| US 7,474,006 B2 | ||
| Package board and semiconductor device | ||
| Masato Maeda, Kanagawa (Japan) | ||
| Assigned to NEC Electronics Corporation, Kanagawa (Japan) | ||
| Filed on Oct. 04, 2006, as Appl. No. 11/542,220. | ||
| Claims priority of application No. 2005-292803 (JP), filed on Oct. 05, 2005. | ||
| Prior Publication US 2007/0075438 A1, Apr. 05, 2007 | ||
| Int. Cl. H01L 23/48 (2006.01) | ||
| U.S. Cl. 257—778 [257/737; 257/738; 257/E21.499; 257/E21.503; 257/E23.069] | 14 Claims |
| 1. A package board for flip-chip packaging on whose one surface an element is mounted in a facedown manner, comprising:
an interconnection provided on said one surface;
a bump formation region in which a bump electrically connecting said interconnection with an electrode pad of said element
is provided; and
a strip-shaped insulating film covering a part of said interconnection outside of said bump formation region,
wherein said strip-shaped insulating film is provided to surround all sides of a central region of said element and along
a side of said bump formation region opposite to an edge of said package board, and said strip-shaped insulating film further
has an opening section formed within said central region.
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