| US 7,473,102 B2 | ||
| Space transforming land grid array interposers | ||
| Evan George Colgan, Chestnut Ridge, N.Y. (US); Paul W. Coteus, Yorktown, N.Y. (US); Hubert Harrer, Schoenaich (Germany); Gareth Geoffrey Hougham, Ossining, N.Y. (US); John Harold Magerlein, Yorktown Heights, N.Y. (US); and John Torok, Poughkeepsie, N.Y. (US) | ||
| Assigned to International Business Machines Corporation, Armonk, N.Y. (US) | ||
| Filed on Mar. 31, 2006, as Appl. No. 11/395,355. | ||
| Prior Publication US 2007/0232090 A1, Oct. 04, 2007 | ||
| Int. Cl. H01R 12/00 (2006.01) | ||
| U.S. Cl. 439—66 [439/591] | 14 Claims |
| 1. An electronic apparatus, comprising:
a first level package structure comprising a package substrate, one or more IC (integrated circuit) chips mounted on a first
surface of the package substrate, and a first pattern of I/O contacts with pitch P1 formed on a second surface of the package substrate opposite the first surface;
a second level package structure comprising a second pattern of I/O contacts with pitch P2, wherein P2 is not equal to P1; and
an LGA (land grid array) interposer disposed between the first and second level package structures, wherein the LGA interposer
provides space transform electrical interconnections between the first pattern and second pattern of I/O contacts, and further
comprising a dummy contact formed on at least a first or second surface of the LGA interposer and aligned to an LGA contact
on an opposing surface of the LGA interposer.
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