US 10,188,275 C1 (242nd)
Small diameter video camera heads and visualization probes and medical devices containing them
Elazar Sonnenschein, Beer Sheva (IL); Ariel Smoliar, Rehovot (IL); and Yuval Malka, Beer Sheva (IL)
Filed by Medigus Ltd., Omer (IL)
Assigned to SCOUTCAM LTD.
Supplemental Examination Request No. 96/000,417, Nov. 10, 2022.
Reexamination Certificate for Patent 10,188,275, issued Jan. 29, 2019, Appl. No. 15/051,265, Feb. 23, 2016.
Application 96/000,417 is a continuation of application No. 14/324,531, filed on Jul. 7, 2014, abandoned.
Application 14/324,531 is a continuation in part of application No. 12/883,288, filed on Sep. 16, 2010, granted, now 8,803,960.
Claims priority of provisional application 61/242,823, filed on Sep. 16, 2009.
Ex Parte Reexamination Certificate from Reexamination Ordered under 35 U.S.C. 257 issued on Apr. 22, 2024.
Int. Cl. A61B 17/29 (2006.01); A61B 1/00 (2006.01); A61B 1/005 (2006.01); A61B 1/012 (2006.01); A61B 1/05 (2006.01); G02B 23/24 (2006.01); H04N 5/374 (2011.01); H04N 23/54 (2023.01); H04N 23/55 (2023.01); H04N 23/57 (2023.01); H04N 25/76 (2023.01); A61B 1/06 (2006.01); A61B 17/22 (2006.01); A61B 90/00 (2016.01); A61B 90/30 (2016.01); H01L 27/146 (2006.01); H04N 23/50 (2023.01)
CPC A61B 1/05 (2013.01) [A61B 1/00096 (2013.01); A61B 1/0055 (2013.01); A61B 1/012 (2013.01); A61B 1/051 (2013.01); A61B 17/29 (2013.01); G02B 23/243 (2013.01); H04N 23/54 (2023.01); H04N 23/55 (2023.01); H04N 23/57 (2023.01); H04N 25/76 (2023.01); A61B 1/0684 (2013.01); A61B 2017/22042 (2013.01); A61B 2090/306 (2016.02); A61B 90/361 (2016.02); H01L 27/14621 (2013.01); H01L 27/14645 (2013.01); H04N 23/555 (2023.01)]
OG exemplary drawing
AS A RESULT OF REEXAMINATION, IT HAS BEEN DETERMINED THAT:
Claims 1, 4-9, 11, 15, 16, 20 and 22 are determined to be patentable as amended.
Claims 2, 3, 12-14, 17-19, 21, 23 and 24, dependent on an amended claim, are determined to be patentable.
New claims 25-37 are added and determined to be patentable.
Claim 10 was not reexamined.
1. A video camera head comprising an objective lens assembly and a CMOS sensor; wherein the CMOS sensor comprises an array of photosensitive elements and electronics adapted to deal with the output signals of the photosensitive elements the electronics implemented together with the array of photosensitive elements on a silicon substrate and in that the silicon substrate comprises [ consists of ] no more than two, three, or four electrical connecting pads configured to allow video signals to be sent from the electronics [ through at least one wire extending from the video camera head to a video processing unit ] and [ to allow ] power to be supplied to the electronics.
4. The video camera head of claim 1, wherein [ A video camera head comprising an objective lens assembly and a CMOS sensor; wherein the CMOS sensor comprises an array of photosensitive elements and electronics adapted to deal with the output signals of the photosensitive elements the electronics implemented together with the array of photosensitive elements on a silicon substrate and in that the silicon substrate consists of no more than two, three, or four electrical connecting pads configured to allow video signals to be sent from the electronics and power to be supplied to the electronics, and ] the video camera head has a maximum outer diameter of 1.4 mm or less.
5. The video camera head of claim 1 [ A video camera head comprising an objective lens assembly and a CMOS sensor; wherein the CMOS sensor comprises an array of photosensitive elements and electronics adapted to deal with the output signals of the photosensitive elements the electronics implemented together with the array of photosensitive elements on a silicon substrate and in that the silicon substrate consists of no more than two, three, or four electrical connecting pads configured to allow video signals to be sent from the electronics and power to be supplied to the electronics] , wherein the electrical connections between the electrically connecting pads and the solid state pick up device [ CMOS sensor ] are implemented by means of through silicon vias.
6. The video camera head of claim 1, wherein the photosensitive elements of the solid state pick up device [ CMOS sensor ] are implemented using back side illumination technology.
7. The video camera head of claim 1, wherein [ A video camera head comprising an objective lens assembly and a CMOS sensor; wherein the CMOS sensor comprises an array of photosensitive elements and electronics adapted to deal with the output signals of the photosensitive elements the electronics implemented together with the array of photosensitive elements on a silicon substrate and in that the silicon substrate consists of no more than two, three, or four electrical connecting pads configured to allow video signals to be sent from the electronics and power to be supplied to the electronics, and ] the length of the objective lens assembly is 2.5 mm or less.
8. The video camera head of claim 1, [ A video camera head comprising an objective lens assembly and a CMOS sensor; wherein the CMOS sensor comprises an array of photosensitive elements and electronics adapted to deal with the output signals of the photosensitive elements the electronics implemented together with the array of photosensitive elements on a silicon substrate and in that the silicon substrate consists of no more than two, three, or four electrical connecting pads configured to allow video signals to be sent from the electronics and power to be supplied to the electronics, further ] comprising an iris created by metalizing one surface of one lens of the objective lens assembly and etching the iris therein.
9. The video camera head of claim 6, [ A video camera head comprising an objective lens assembly and a CMOS sensor; wherein the CMOS sensor comprises an array of photosensitive elements and electronics adapted to deal with the output signals of the photosensitive elements the electronics implemented together with the array of photosensitive elements on a silicon substrate and in that the silicon substrate consists of no more than two, three, or four electrical connecting pads configured to allow video signals to be sent from the electronics and power to be supplied to the electronics, wherein the photosensitive elements of the CMOS sensor are implemented using back side illumination technology, and further ] comprising pixel cells having dimensions in the range of 2.2×2.2 microns to 0.9×0.9 microns.
11. A visualization probe comprising illumination means, an objective lens assembly and a CMOS sensor; wherein the CMOS sensor comprises an array of photosensitive elements and electronics adapted to deal with the output signals of the photosensitive elements the electronics implemented together with the array of photosensitive elements on a silicon substrate and in that the silicon substrate comprises [ consists of ] no more than two, three, or four electrical connecting pads configured to allow video signals to be sent from the electronics and power to be supplied to the electronics and wherein the visualization probe has a maximum outer diameter of 4 mm or less.
15. The visualization probe of claim 11, wherein the electrical connections between the electrically connecting pads and the solid state pick up device [ CMOS sensor ] and the integrated circuitry are implemented by means of through silicon vias.
16. The visualization probe of claim 11, wherein the photosensitive elements of the solid state pick up device [ CMOS sensor ] are implemented using back side illumination technology.
20. The visualization probe of claim 17, wherein the articulation section is constructed from a plurality of ring-shaped elements attached to an elongated flexible axially located component of the visualization probe /medical device, wherein the axially located component passes through the centers of the ring-shaped elements.
22. A medical device comprising a visualization probe comprised of illumination means, an objective lens assembly and a CMOS sensor; wherein the CMOS sensor comprises an array of photosensitive elements and electronics adapted to deal with the output signals of the photosensitive elements the electronics implemented together with the array of photosensitive elements on a silicon substrate and in that the silicon substrate comprises [ consists of ] no more than two, three, or four electrical connecting pads configured to allow video signals to be sent from the electronics and power to be supplied to the electronics and wherein the medical device has a maximum outer diameter of 4 mm or less.
[ 25. The video camera head of claim 1, wherein at least one of said pads configured to allow video signals to be sent is implemented by multiplexing two or more signals on one pad.]
[ 26. The video camera head of claim 1, further comprising circuitry for transmitting the video signals on a voltage supply line.]
[ 27. The video camera head of claim 1, further comprising a top coat polymer covering the objective lens assembly.]
[ 28. The video camera head of claim 1, wherein the wire extends through a visualization probe comprising one or more of:
a) an articulation section;
b) a working channel.]
[ 29. The video camera head of claim 28, wherein the articulation section is constructed without any hinges and in one piece.]
[ 30. The video camera head of claim 29, wherein the articulation section is constructed from one plate, and in which each link is cut from the plate precisely by electromagnetic or mechanical apparatus to form a plurality of elements projecting outward from a spine and the projecting elements are then bent to form the individual vertebrae.]
[ 31. The video camera head of claim 28, wherein the articulation section is constructed from a plurality of ring-shaped elements attached to an elongated flexible axially located component of the visualization probe, wherein the axially located component passes through the centers of the ring-shaped elements.]
[ 32. The video camera head of claim 5, wherein each pad is connected to a different through silicon via of said through silicon vias.]
[ 33. The video camera head of claim 5, wherein the electrical connecting pads are configured to allow video signals to be sent from the electronics through at least one wire extending from the video camera head to a video processing unit, and the wire extends through a cable and is directly connected to one of the through silicon vias.]
[ 34. A video camera head comprising an objective lens assembly and a CMOS sensor; wherein the CMOS sensor comprises an array of photosensitive elements and electronics adapted to deal with the output signals of the photosensitive elements, the electronics implemented together with the array of photosensitive elements on a silicon substrate, and in that the silicon substrate consists of at least two and no more than four electrical connecting pads configured to allow video signals to be sent from the electronics and to allow power to be supplied to the electronics; and wherein the electrical connections between the pads and the electronics adapted to deal with the output signals are implemented with through silicon vias, and the back side of the silicon substrate is patterned to provide electrical conductivity between the bottoms of the vias and the pads.]
[ 35. A video camera head comprising an objective lens assembly and a CMOS sensor; wherein the CMOS sensor comprises an array of photosensitive elements and electronics adapted to deal with the output signals of the photosensitive elements, the electronics implemented together with the array of photosensitive elements on a silicon substrate, and in that the silicon substrate consists of four electrical connecting pads configured to allow video signals to be sent from the electronics and power to be supplied to the electronics, wherein one of the pads is for voltage input to supply power to the electronics, one of the pads is for a ground connection, one of the pads is for video signal output, and one of the pads is for shutter timing.]
[ 36. A visualization probe comprising illumination means, an objective lens assembly and a CMOS sensor; wherein the CMOS sensor comprises an array of photosensitive elements and electronics adapted to deal with the output signals of the photosensitive elements, the electronics implemented together with the array of photosensitive elements on a silicon substrate, and in that the silicon substrate consists of four electrical connecting pads configured to allow video signals to be sent from the electronics and power to be supplied to the electronics, wherein one of the pads is for voltage input to supply power to the electronics, one of the pads is for a ground connection, one of the pads is for video signal output, and one of the pads is for shutter timing, and wherein the visualization probe has a maximum outer diameter of 4 mm or less.]
[ 37. A medical device comprising a visualization probe comprised of illumination means, an objective lens assembly and a CMOS sensor;
wherein the CMOS sensor comprises an array of photosensitive elements and electronics adapted to deal with the output signals of the photosensitive elements, the electronics implemented together with the array of photosensitive elements on a silicon substrate, and in that the silicon substrate consists of four electrical connecting pads configured to allow video signals to be sent from the electronics and power to be supplied to the electronics, wherein one of the pads is for voltage input to supply power to the electronics, one of the pads is for a ground connection, one of the pads is for video signal output, and one of the pads is for shutter timing, and wherein the medical device has a maximum outer diameter of 4 mm or less.]