CPC Definition - Subclass C25F
This place covers:
Electrolytic cleaning, degreasing, pickling or descaling
Electrolytic etching or polishing
Polishing or etching using a plasma which is generated at the surface of the workpiece by a voltage applied thereto in an electrolyte
Electrolytic stripping of metallic layers or coatings
Constructional parts, or assemblies thereof, of cells for electrolytic removal of material from objects, servicing or operating
This place does not cover:
Working of metal by the action of electric current on a workpiece, electrochemical machining, electrolytic grinding, electro-erosion | |
Non-mechanical removal of metallic material from surfaces | |
Inhibiting corrosion of metals by anodic or cathodic protection | |
Constructional parts or assemblies thereof, of cells for both electrolytic coating and removal | |
Wafer treatment | |
Processes specially adapted for treatment of semi-conductors or solid state devices, e.g. electrolytic etching |
Attention is drawn to the following places, which may be of interest for search:
Chemical cleaning involving a liquid and additional treatment, e.g. electricity | |
Polishing or grinding with abrasive particles | |
Lapping machines u sing both abrasives substances and theapplication of electrical current | |
After-treatment of articles using an electrical field, without altering their shape or form | |
Polishing compositions | |
Multistep processes for surface treatment of metallic material | |
Measuring using electrical means | |
Analyzing materials with electro- chemical means | |
Non-contact plasma polishing |
In this place, the following terms or expressions are used with the meaning indicated:
Electrolytic cleaning | removing impurities from a surface by electrolytic action |
Electrolytic degreasing | removing grease from a surface by electrolytic action |
Electrolytic pickling or de-scaling | removing oxide or scale from a surface by electrolytic action |
Melt | molten salt or ionic liquid or fused bath |
Methods of polishing or grinding using electric current where the electrolyte comprises abrasive material would be classified in B24B 37/046
In this place, the following terms or expressions are used with the meaning indicated:
Electrolytic etching | dissolving by - electrolytic action or - a plasma which is generated at the surface of the workpiece by a voltage applied to the electrodes in the electrolyte, such that a rough surface is obtained |
Electrolytic polishing | dissolving by - electrolytic action or - by a plasma which is generated at the surface of the workpiece by a voltage applied to the electrodes in the electrolyte, such that a smooth surface is obtained |
In this place, the following terms or expressions are used with the meaning indicated:
Semiconducting material | the material as such, not a workpiece which is a semiconductor (e.g. a wafer) |
This place covers:
Locally electrolytic etching where the portions to be etched are determined only by a mask or a template
In this place, the following terms or expressions are used with the meaning indicated:
Semiconducting material | the material as such, not a workpiece which is a semiconductor (e.g. a wafer) |
This place covers:
Removing an entire layer or coating, even when this layer or coating is already partially damaged (e.g. removing NiCrAlY from a turbine blade to be reworked)