Skip over navigation
PROCESSES FOR THE ELECTROLYTIC REMOVAL OF MATERIALS FROM OBJECTS; APPARATUS THEREFOR
Definition statement
This subclass/group covers:

Electrolytic cleaning, degreasing, pickling or descaling

Electrolytic etching or polishing

Polishing or etching using a plasma which is generated at the surface of the workpiece by a voltage applied thereto in an electrolyte

Electrolytic stripping of metallic layers or coatings

Constructional parts, or assemblies thereof, of cells for electrolytic removal of material from objects, servicing or operating

References relevant to classification in this subclass
This subclass/group does not cover:
Working of metal by the action of electric current on a workpiece, electrochemical machining, electrolytic grinding, electro-erosion
Non-mechanical removal of metallic material from surfaces
Inhibiting corrosion of metals by anodic or cathodic protection
Constructional parts or assemblies thereof, of cells for both electrolytic coating and removal
Wafer treatment
Processes specially adapted for treatment of semi-conductors or solid state devices, e.g. electrolytic etching
Informative references
Attention is drawn to the following places, which may be of interest for search:
Chemical cleaning involving a liquid and additional treatment, e.g. electricity
Polishing or grinding with abrasive particles
Lapping machines u sing both abrasives substances and theapplication of electrical current
After-treatment of articles using an electrical field, without altering their shape or form
Polishing compositions
Multistep processes for surface treatment of metallic material
Measuring using electrical means
Analyzing materials with electro- chemical means
Non-contact plasma polishing
Electrolytic cleaning, degreasing, pickling or de-scaling
Glossary of terms
In this subclass/group, the following terms (or expressions) are used with the meaning indicated:
Electrolytic cleaning
removing impurities from a surface by electrolytic action
Electrolytic degreasing
removing grease from a surface by electrolytic action
Electrolytic pickling or de-scaling
removing oxide or scale from a surface by electrolytic action
Melt
molten salt or ionic liquid or fused bath
Electrolytic etching or polishing
Relationship between large subject matter areas

Methods of polishing or grinding using electric current where the electrolyte comprises abrasive material would be classified in B24B37/046

Special rules of classification within this group

An electrolyte specified in a document is classified in C25F 3/00 even when it concerns one of the fields listed under "references" of subclass C25F. Exception: electrolytes comprising abrasive material are not classified in C25F 3/00.

Glossary of terms
In this subclass/group, the following terms (or expressions) are used with the meaning indicated:
Electrolytic etching
dissolving by - electrolytic action or - a plasma which is generated at the surface of the workpiece by a voltage applied to the electrodes in the electrolyte, such that a rough surface is obtained
Electrolytic polishing
dissolving by - electrolytic action or - by a plasma which is generated at the surface of the workpiece by a voltage applied to the electrodes in the electrolyte, such that a smooth surface is obtained
of semiconducting materials
Glossary of terms
In this subclass/group, the following terms (or expressions) are used with the meaning indicated:
Semiconducting material
the material as such, not a workpiece which is a semiconductor (e.g. a wafer)
locally
Definition statement
This subclass/group covers:

Locally electrolytic etching where the portions to be etched are determined only by a mask or a template

Glossary of terms
In this subclass/group, the following terms (or expressions) are used with the meaning indicated:
Locally
when the portion(s) to be etched or polished is/are determined by a mask or a template
of semiconducting materials
Glossary of terms
In this subclass/group, the following terms (or expressions) are used with the meaning indicated:
Semiconducting material
the material as such, not a workpiece which is a semiconductor (e.g. a wafer)
Electrolytic stripping of metallic layers or coatings
Definition statement
This subclass/group covers:

Removing an entire layer or coating, even when this layer or coating is already partially damaged (e.g. removing NiCrAlY from a turbine blade to be reworked)

Constructional parts, or assemblies thereof, of cells for electrolytic removal of materials from objects (for both electrolytic coating and removal C25D); Servicing or operating
This page is owned by Office of Patent Classification.
Last Modified: 10/11/2013