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POLISHING COMPOSITIONS OTHER THAN FRENCH POLISH; SKI WAXES
Definition statement
This subclass covers:
  • Polishing compositions containing abrasives or grinding agents as well as polishing compositions based on aqueous dispersions, such as chemical mechanical polishing slurries for polishing semi conductors.
  • Polishing compositions based on wax -this includes compositions based on mixtures of wax and natural or synthetic resins- and polishing compositions based on non-waxy substances, e. g. natural or synthetic resins.
  • Ski waxes
References relevant to classification in this subclass
This subclass does not cover:

Coating compositions based on oil, fats or waxes or derivatives thereof

Coating compositions based on natural resins or derivatives thereof

French polish

Detergents

Cleaning compositions for semi conductor devices

Informative references
Attention is drawn to the following places, which may be of interest for search:

Mirror polishing of wafers

Manufacture of semiconductor devices, polishing

Manufacture of semiconductor devices, chemical mechanical polishing

Manufacture of semiconductor devices, planarisation of the insulating layers

Manufacture of semiconductor devices, deposition of non-insulating layers on insulating layers, chemical mechanical polishing thereof

Manufacture of semiconductor devices, planarisation of conductors

Abrasive powders, suspension and pastes for polishing

Grinding; Polishing machines and processes

Compositions of macromolecular compounds

Compositions of oils, fats or waxes or derivatives thereof

Compositions of natural resins or derivatives thereof

Chemical polishing of metals

Cleaning or de-greasing of metallic material by chemical methods

Synonyms and Keywords

In patent documents the following abbreviations are often used:

CMP

Chemical Mechanical Polishing

Polishing compositions (French polish C09F 11/00; detergents C11D)
Definition statement
This group covers:

Polishing compositions containing abrasives or grinding agents; aqueous compositions and other polishing compositions based on wax or on non-waxy substances.

References relevant to classification in this group
This group does not cover:

French polish

Abrasives as such

Detergents

Informative references
Attention is drawn to the following places, which may be of interest for search:

Manufacture of semiconductor devices, polishing

Manufacture of semiconductor devices, chemical mechanical polishing

Manufacture of semiconductor devices, dielectric removal step

Manufacture of semiconductor devices, deposition of non-insulating layers on insulating layers, chemical mechanical polishing thereof

Manufacture of semiconductor devices, planarisation of conductors

Abrasive powders, suspension and pastes for polishing

Special rules of classification within this group

Abrasive free Chemical Mechanical Polishing (CMP) compositions are classified in C09G 1/04. All other CMP compositions are classified in C09G 1/02.

Glossary of terms
In this group, the following terms (or expressions) are used with the meaning indicated:

CMP

Chemical Mechanical Polishing

Ski waxes
Definition statement
This group covers:

Ski waxes.

Informative references
Attention is drawn to the following places, which may be of interest for search:

Apparatus for waxing or dewaxing

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Last Modified: 10/11/2013