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POLISHING COMPOSITIONS OTHER THAN FRENCH POLISH; SKI WAXES
Definition statement
This subclass/group covers:
  • Polishing compositions containing abrasives or grinding agents as well as polishing compositions based on aqueous dispersions, such as chemical mechanical polishing slurries for polishing semi conductors.
  • Polishing compositions based on wax -this includes compositions based on mixtures of wax and natural or synthetic resins- and polishing compositions based on non-waxy substances, e. g. natural or synthetic resins.
  • Ski waxes
References relevant to classification in this subclass
This subclass/group does not cover:
Coating compositions based on oil, fats or waxes or derivatives thereof
Coating compositions based on natural resins or derivatives thereof
French polish
Detergents
Cleaning compositions for semi conductor devices
Informative references
Attention is drawn to the following places, which may be of interest for search:
Mirror polishing of wafers
Manufacture of semiconductor devices, polishing
Manufacture of semiconductor devices, chemical mechanical polishing
Manufacture of semiconductor devices, planarisation of the insulating layers
Manufacture of semiconductor devices, deposition of non-insulating layers on insulating layers, chemical mechanical polishing thereof
Manufacture of semiconductor devices, planarisation of conductors
Abrasive powders, suspension and pastes for polishing
Grinding; Polishing machines and processes
Compositions of macromolecular compounds
Compositions of oils, fats or waxes or derivatives thereof
Compositions of natural resins or derivatives thereof
Chemical polishing of metals
Cleaning or de-greasing of metallic material by chemical methods
Synonyms and Keywords

In patent documents the following abbreviations are often used:

CMP
Chemical Mechanical Polishing
Polishing compositions (French polish C09F 11/00; detergents C11D)
Definition statement
This subclass/group covers:

Polishing compositions containing abrasives or grinding agents; aqueous compositions and other polishing compositions based on wax or on non-waxy substances.

References relevant to classification in this group
This subclass/group does not cover:
French polish
Abrasives as such
Detergents
Informative references
Attention is drawn to the following places, which may be of interest for search:
Manufacture of semiconductor devices, polishing
Manufacture of semiconductor devices, chemical mechanical polishing
Manufacture of semiconductor devices, dielectric removal step
Manufacture of semiconductor devices, deposition of non-insulating layers on insulating layers, chemical mechanical polishing thereof
Manufacture of semiconductor devices, planarisation of conductors
Abrasive powders, suspension and pastes for polishing
Special rules of classification within this group

Abrasive free Chemical Mechanical Polishing (CMP) compositions are classified in C09G 1/04. All other CMP compositions are classified in C09G 1/02.

Glossary of terms
In this subclass/group, the following terms (or expressions) are used with the meaning indicated:
CMP
Chemical Mechanical Polishing
Ski waxes
Definition statement
This subclass/group covers:

Ski waxes.

Informative references
Attention is drawn to the following places, which may be of interest for search:
Apparatus for waxing or dewaxing
This page is owned by Office of Patent Classification.
Last Modified: 10/11/2013