POLISHING COMPOSITIONS OTHER THAN FRENCH POLISH; SKI WAXES
Definition statement
This subclass/group covers:
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Polishing compositions containing abrasives or grinding agents as well as polishing compositions based on aqueous dispersions, such as chemical mechanical polishing slurries for polishing semi conductors.
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Polishing compositions based on wax -this includes compositions based on mixtures of wax and natural or synthetic resins- and polishing compositions based on non-waxy substances, e. g. natural or synthetic resins.
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Ski waxes
References relevant to classification in this subclass
This subclass/group does not cover:
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Coating compositions based on oil, fats or waxes or derivatives thereof
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Coating compositions based on natural resins or derivatives thereof
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French polish
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Detergents
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Cleaning compositions for semi conductor devices
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Informative references
Attention is drawn to the following places, which may be of interest for search:
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Mirror polishing of wafers
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Manufacture of semiconductor devices, polishing
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Manufacture of semiconductor devices, chemical mechanical polishing
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Manufacture of semiconductor devices, planarisation of the insulating layers
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Manufacture of semiconductor devices, deposition of non-insulating layers on insulating layers, chemical mechanical polishing thereof
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Manufacture of semiconductor devices, planarisation of conductors
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Abrasive powders, suspension and pastes for polishing
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Grinding; Polishing machines and processes
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Compositions of macromolecular compounds
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Compositions of oils, fats or waxes or derivatives thereof
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Compositions of natural resins or derivatives thereof
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Chemical polishing of metals
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Cleaning or de-greasing of metallic material by chemical methods
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Synonyms and Keywords
In patent documents the following abbreviations are often used:
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CMP
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Chemical Mechanical Polishing
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Polishing compositions (French polish C09F11/00; detergents C11D)
Definition statement
This subclass/group covers:
Polishing compositions containing abrasives or grinding agents; aqueous compositions and other polishing compositions based on wax or on non-waxy substances.
References relevant to classification in this group
This subclass/group does not cover:
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French polish
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Abrasives as such
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Detergents
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Informative references
Attention is drawn to the following places, which may be of interest for search:
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Manufacture of semiconductor devices, polishing
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Manufacture of semiconductor devices, chemical mechanical polishing
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Manufacture of semiconductor devices, dielectric removal step
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Manufacture of semiconductor devices, deposition of non-insulating layers on insulating layers, chemical mechanical polishing thereof
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Manufacture of semiconductor devices, planarisation of conductors
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Abrasive powders, suspension and pastes for polishing
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Special rules of classification within this group
Abrasive free Chemical Mechanical Polishing (CMP) compositions are classified in C09G 1/04. All other CMP compositions are classified in C09G 1/02.
Glossary of terms
In this subclass/group, the following terms (or expressions) are used with the meaning indicated:
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CMP
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Chemical Mechanical Polishing
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Ski waxes
Definition statement
This subclass/group covers:
Informative references
Attention is drawn to the following places, which may be of interest for search:
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Apparatus for waxing or dewaxing
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