Omission

   The following Utility patent was inadvertently omitted from the May
13, 1997 Official Gazette.

                                   5,628,849
                   METHOD FOR IN-SITU ENVIRONMENT SENSITIVE
                      SEALING AND/OR PRODUCT CONTROLLING
Benjamin V. Fasano, New Windsor; Johnathan S. Fish, Watervliet;
   Gregory M. Johnson, Poughkeepsie, and Subhash L. Shinde,
   Croton-on-Hudson, all of N.Y., assignors to International Business
   Machines Corporation, Armonk, N.Y.
                     Filed May 26, 1995, Ser. No. 451,933
                  Int. Cl.6 B32B 9/00; C03B 29/00; C04B 33/34
   U.S. Cl. 264-614                                             41 Claims

   1. A method for processing of an electronic product in a high
temperature thermal environment comprising the steps of:

Refer to Official Gazette for Drawing

   (a) placing said electronic product in a box, wherein said box has a
first cover and a frame;
   (b) separating said first cover from said frame with at least one
spacer comprising a material which reduces in height when exposed to a
specific change in said thermal environment;
   (c) placing said box in said thermal environment; and
   (d) exposing said box to said specific change in said thermal
environment whereby said at least one spacer reduces in height when
exposed to said change and thereby reduces the distance between said
first cover and said frame.