Omission The following Utility patent was inadvertently omitted from the May 13, 1997 Official Gazette. 5,628,849 METHOD FOR IN-SITU ENVIRONMENT SENSITIVE SEALING AND/OR PRODUCT CONTROLLING Benjamin V. Fasano, New Windsor; Johnathan S. Fish, Watervliet; Gregory M. Johnson, Poughkeepsie, and Subhash L. Shinde, Croton-on-Hudson, all of N.Y., assignors to International Business Machines Corporation, Armonk, N.Y. Filed May 26, 1995, Ser. No. 451,933 Int. Cl.6 B32B 9/00; C03B 29/00; C04B 33/34 U.S. Cl. 264-614 41 Claims 1. A method for processing of an electronic product in a high temperature thermal environment comprising the steps of: Refer to Official Gazette for Drawing (a) placing said electronic product in a box, wherein said box has a first cover and a frame; (b) separating said first cover from said frame with at least one spacer comprising a material which reduces in height when exposed to a specific change in said thermal environment; (c) placing said box in said thermal environment; and (d) exposing said box to said specific change in said thermal environment whereby said at least one spacer reduces in height when exposed to said change and thereby reduces the distance between said first cover and said frame.