A. This class provides for manufacturing a semiconductor containing a solid-state device by a combination of operations wherein:
(1) no other class provides for the overall combination, and
(2) the intent is to use the electrical properties of the semiconductor in the device for at least one of the following purposes: (a) conducting or modifying an electrical current, (b) storing electrical energy for subsequent discharge within a microelectronic integrated circuit, or (c) converting electromagnetic wave energy to electrical energy or electrical energy to electromagnetic energy.
B. This class provides for a species of Class 427 operations involving:
(1) coating a substrate with a semiconductive material, or
(2) coating a semiconductive substrate or substrate containing a semiconductive region;
wherein the intent is to use the electrical properties of the semiconductor in a solid-state device for at least one of the following purposes: (a) conducting or modifying an electrical current, (b) storing electrical energy for subsequent discharge within a microelectronic integrated circuit, or (c) converting electromagnetic wave energy to electrical energy or electrical energy to electromagnetic energy.
C. This class provides for a species of Class 216 operations involving etching a semiconductive substrate or etching a substrate containing a semiconductive region, wherein the intent is to use the electrical properties of the semiconductor in a solid-state device for at least one of the
following purposes:
(1) conducting or modifying an electrical current,
(2) storing electrical energy for subsequent discharge within a microelectronic integrated circuit, or
(3) converting electromagnetic wave energy to electrical energy or electrical energy to electromagnetic energy.
D. This class provides for packaging (e.g., with mounting, encapsulating, etc.) or treatment of packaged semiconductor, when not elsewhere provided, wherein there are:
(1) multiple operations having a step of permanently attaching or securing a semiconductive substrate to a terminal, elongated conductor, or support (e.g., mounting, housing, lead frame, discrete heat sink, etc.),
(2) multiple operations having a step of shaping flowable plastic or flowable insulative material about a semiconductive substrate, or
(3) a step of treating an already packaged semiconductor substrate (e.g., coating, etching, etc.); if the following conditions are also met: (a) there is significant semiconductor chip structure (e.g., such as recited semiconductor junction, etc.) or named semiconductor device (e.g., DRAM, CMOS, EPROM, etc.), or (b) there is no significant semiconductor structure if also combined with a coating operation of this class (see B above) or etching operation of this class (see C above), and (c) the intent is to use the electrical properties of the semiconductor in a solid-state device for at least one of the following purposes: (i) conducting or modifying an electrical current, (ii) storing electrical energy for subsequent discharge within a microelectronic integrated circuit, or (iii) converting electromagnetic wave energy to electrical energy or electrical energy to electromagnetic energy;
(1) Note. When Class 438 coating (see B above) or etching operations (see C above) are not included, Class 29, following historical precedence, provides for processes of mounting, packaging, molding, or encapsulating of semiconductors having no significant semiconductor chip structure (e.g., merely recited as semiconductor chip, per se, etc.) when not elsewhere provided.
E. This is the generic class for operations not elsewhere provided for treating a semiconductive substrate or substrate containing a semiconductive region; wherein the intent is to use the semiconductor in a solid-state device for at least one of the following purposes:
(1) conducting or modifying an electrical current,
(2) storing electrical energy for subsequent discharge within
a microelectronic integrated circuit, or
(3) converting electromagnetic wave energy to electrical energy or electrical energy to electromagnetic energy.
(1) Note. Lacking an indication that the semiconducting material is to be used for a purpose other than (a) conducting or modifying an electrical current, (b) storing electrical energy for subsequent discharge within a microelectronic integrated circuit, or (c) converting electromagnetic wave energy to electrical energy or electrical energy to electromagnetic energy; it will be assumed that the process meets the Class 438 definition.
(2) Note. For this class certain materials will be considered to be semiconductors even if there is no other indication that semiconducting properties are present. Thus, if the criteria set forth under the (1) Note is met that there is no indication that the material is to be used for a purpose other than (a), (b), or (c), the following materials are to be considered semiconductive: silicon, germanium, selenium, tellurium, gallium nitride, gallium phosphide, gallium arsenide, aluminum phosphide, aluminum arsenide, and mercury cadmium telluride.

LINES WITH OTHER CLASSES AND WITHIN THIS CLASS
Several classes provide for plural step operations for manufacturing semiconductor solid-state devices or components therefor. Combined operations for manufacturing semiconductor electrical devices or semiconductor-based components therefor having plural steps not encompassed by another class are proper for Class 438.
For example, while plural steps acceptable to Class 264 (e.g., injection molding and subsequent removal of flash, etc.) remain in Class 264, combinations of molding and adhesive bonding are provided for in Class 156, even though this involves multiple steps, one of which (i.e., molding) would be considered a Class 264 unit operation even if semiconductor material is involved. However, combinations of molding, adhesive bonding, and a Class 438 unit operation acting on a semiconductor substrate which is used for at least one of the following purposes: (a) conducting or modifying an electrical current, (b) storing electrical energy for subsequent discharge within a microelectronic integrated circuit, or (c) converting electromagnetic wave energy to electrical energy or electrical energy to electromagnetic energy, are considered proper for Class 438.
A. UNIT COATING OPERATIONS, COMBINED OPERATIONS INVOLVING COATING, AND PARTICLE BOMBARDMENT
The following search notes are intended to clarify the lines and distinctions for determining when coating operations are provided for in Class 438. Throughout this class, the term "coating" is used in the generic sense to include both
surface coating and impregnation.
The unit coating operations in Class 438 may be viewed as a specie of a Class 427 process which was removed intact from Class 427 and transferred to Class 438 for the convenience of the searcher. Thus, plural step operations that were acceptable in Class 427 are now acceptable in Class 438 if the criteria for the semiconductor material as set forth hereinabove is met. Coating operations which do not meet the Class 438 definition may be classified in the classes identified in References to Other Classes, below.
B. UNIT ETCHING OPERATIONS AND COMBINED ETCHING OPERATIONS IN CLASS 438
In References to Other Classes, below, are search notes are intended to clarify the lines and distinctions for determining when an etching unit operation is provided for in Class 438. Throughout this class, the term "etching" is used in the generic sense to include the removal of a surface by chemical reaction or solvent action regardless of the composition thereof.
The unit etching operations in Class 438 may be viewed as a specie of a Class 216 process which was removed intact from Class 216 and transferred to Class 438 for the convenience of the searcher. Thus, plural step operations that were acceptable in Class 216 are now acceptable in Class 438 if the criteria for the semiconductor material as set forth hereinabove is met. Etching operations which do not meet the Class 438 definition may be found in References with Other Classes, below.
C. PACKAGING (E.G., WITH MOUNTING, ENCAPSULATING, ETC.) OR TREATMENT OF PACKAGED SEMICONDUCTOR
Packaging is a semiconductor art manufacturing term for integration, assembly, or surrounding of a semiconductive substrate (e.g., chip, die, etc.) with a permanent encasement, housing, capsule, or support. This is distinguished from package making found in Class 53 which is directed to preparing a manufactured product for passage through the channels of trade in a safe, convenient, and attractive condition, usually wrapped in a cover or in a container which is intended to be removed when the manufactured product is used.
Class 438 takes the following packaging or packaging related operations, if not elsewhere provided: (a) multiple operations having a step of permanently attaching or securing a semiconductive substrate to a terminal, elongated conductor, or support (e.g., mounting, housing, lead frame, discrete heat sink, etc.), (b) multiple operations having a step of shaping flowable plastic or flowable insulative material about a semiconductive substrate, or (c) a step of treating an already packaged semiconductor substrate (e.g., coating, etching, etc.).
However, other manufacturing classes have established historic lines with Class 438 that must be considered when determining proper placement. These lines with external classes revolve around such concepts as: whether there is significant semiconductor device structure, whether there is a unit operation or a so-called "multi-step" operation, etc. The search notes in References to Other Classes, below, are intended to clarify these established lines and to alert the searcher to other classes for related searches.
D. LINE NOTES TO OTHER MANUFACTURING OPERATIONS
See References to Other Classes, below for lines clarifying the relationship of other chemical classes to Class 438. For many of the chemical classes, inclusion of metal casting, working or deforming, or fusion bonding step is not acceptable if combined with an operation of the chemical class.
E. LOCATION OF SEMICONDUCTOR COMPOUND, COMPOSITION, OR STOCK
Class 438 does not provide for compound, composition, or stock material produced or utilized by a Class 438 process. A process of manufacture or use of a compound or composition is usually classified with the compound or composition. The process of manufacturing a semiconductor compound or composition and the formation of a semiconductor device or semiconductor junction takes combined operations to Class 438.
Also see References to Other Classes, below, identifying this section.
F. LINE TO HEATING CLASSES
This class (438), will take the process of (a) heating of semiconductor material to modify the microstructure or electrical properties thereof, (b) combined operations involving heating of semiconductor material to modify the semiconductor structure or electrical properties when not provided in another class, or (c) heating of semiconductor substrates that affects only the nonsemiconductor region of the substrate when combined with other operations acceptable to Class 438 or combined with the establishment of device structure (e.g., connects, insulating regions, electrodes, etc.).
See References to Other Classes, below, identified as heating classes.
G. LINE NOTES TO ELECTRICAL CLASSES
See References to Other Classes, below.

REFERENCES TO OTHER CLASSES

SEE OR SEARCH CLASS:
29, Metal Working, especially 729 for electrical device manufacturing apparatus, subclasses 829+ for the assembly of electrical components to an insulative base having a conductive path applied thereto, or formed thereon or therein (e.g., a printed circuit board). {See "Packaging (E.g., With Mounting, Encapsulating, Etc.)" above}
(1) Note. When Class 438 coating (see "Unit Coating Operations, Combined Operations Involving Coating" above,) or etching operations (see "Unit Etching Operations And Combined Etching Operations") are not included, Class 29, subclasses 825+, following historical precedence, provides for processes of mounting, packaging, molding, or encapsulating of semiconductors having no significant semiconductor chip structure (e.g., merely recited as semiconductor chip, per se, etc.) when not elsewhere provided. If there is no significant chip structure, Class 29 takes as original (a) adhesive bonding combined with specified metal shaping steps or (b) adhesive bonding combined with mechanical joining, either broad or specific.
(2) Note. Multistep processes for packaging semiconductors having no significant semiconductor chip structure are proper for Class 156 when they claim: (a) adhesive bonding combined with shaping of nonmetals; (b) adhesive bonding combined with broad or nominally claimed metal shaping steps; or (c) adhesive bonding including steps for assembling the parts to be bonded are proper in Class 156.
53, Package Making, for passage through the channels of trade in a safe, convenient, and attractive condition, usually wrapped in a cover or in a container. In this context of trade, Class 53 provides for methods of: (a) encompassing, encasing, or completely surrounding goods or materials with a cover made from sheet stock, (b) partially encasing or surrounding goods and materials by a partial cover made from sheet stock, (c) assembling or securing a separate closure to an aperture of a preformed receptacle to complete encasement of contents, (d) depositing articles and arranging fluent materials in preformed receptacles, (e) partial or complete shaping of a cover about an article, and other related package making processes. (See "Packaging (E.g., With Mounting, Encapsulating, Etc.)" above)
(1) Note: If it cannot be perceived (a) whether the process is package making or (b) whether the process is manufacturing of a semiconductor device within or attached to a container, case, lead frame, heat sink, or enclosure as an integral part of the manufactured product; placement goes to Class 438 and Class 53 may be cross-referenced.
65, Glass Manufacturing, for processes of melting, shaping or forming, joining, or heat treating of glass. Glass is defined in the Class 65 definitions (Glossary) as an inorganic material generally including a glass former and
having specific characteristics provided in the definition. Included in Class 65 is joining, per se, of glass to metal or glass. (See "Packaging (E.g., With Mounting, Encapsulating, Etc.)" above)
(1) Note. Class 438 takes packaging or the packaging-related operation of semiconductor devices when glass melting, glass shaping, glass forming, or glass heat treating is combined with any coating, adhesive bonding, metal casting, metal working, or deforming, metal fusion bonding or other chemical manufacturing operation.
65, Glass Manufacturing, for processes of melting, shaping or forming, joining, or heat treating of glass. Glass is defined in the Class 65 definitions (Glossary) as an inorganic material generally including a glass former and having specific characteristics provided in the definition. It is noted that both silica and elemental silicon are also included for Class 65. Thus, melting, shaping, or fusion bonding of silicon dioxide, per se, or silicon, per se, is also considered proper for Class 65. Class 65 also takes combined operations whether preparatory or subsequent to the melting, shaping or forming, joining or heat treating of glass. Included in Class 65 is joining, per se, of glass to metal, spinning, per se, of glass fibers or joining through glass melting, per se, of glass fibers to substrates such as semiconductor substrates. (see "Line Notes To Other Manufacturing Operations, " above)
(1) Note. Class 438, as the exception, takes the combination of Class 438 unit coating operation or Class 438 unit etching operation with glass melting, shaping or forming, joining, or heat treating. Moreover, Class 438 also takes the heat treating, per se, of Class 438 semiconductor material if for purposes of modifying the electrical properties thereof. Class 438 takes the mounting or packaging operation of semiconductor devices when glass melting, glass shaping, glass forming, or glass heat treating is combined with any coating, adhesive bonding, metal casting, metal working, or deforming, metal fusion bonding or other chemical manufacturing operation.
106, Compositions: Coating or Plastic, 1.05 for metal-deposition or substrate-sensitizing compositions; subclasses 286.1+ for inorganic materials only containing at least one metal atom; subclass 286.8 for inorganic materials only; subclasses 287.1+ for silicon containing other than solely as silicon dioxide as a part of an aluminum-containing compound, and subclasses 400+ for materials or ingredients. (see "Location Of Semiconductor Compound, Composition, Or Stock" above.)
117, Single-Crystal, Oriented-Crystal, and Epitaxy Growth Processes; Non-Coating Apparatus Therefore, for processes of single crystal growth of semiconductor material upon a seed or substrate and perfecting operations combined therewith. See Class 117 definitions for examples of perfecting
operations generally acceptable to Class 117. See particularly Class 117, Class Definition, (2) Note, Keywords and (3) Note, Indicative Terminology, for terms indicative of single crystal formation. Inclusion of a nonperfecting single crystal forming operation on a semiconductor substrate or producing a semiconductor product meeting the hereinabove requirements of a semiconductor material or the definition of a semiconductor substrate takes the original to Class 438, even if there is present a single crystal forming step. (Coating operation not meeting Class 438 definition)
(1) Note. When combined with single crystal formation, the following operations are acceptable in Class 438: (a) simultaneous formation of nonsingle crystalline regions intended to impart structure that will serve as a functional part of the semiconductive substrate or completed device, (b) prior or subsequent removal of a nonseed portion of the substrate in order to impart electrical device structure to the same (e.g., formation or a recess, trench, trough, ridge, mesa, stripe, etc.), or (c) prior or subsequent step acting to alter the composition of the semiconductor substrate so as to impart electrical device structure to the same.
134, Cleaning and Liquid Contact With Solids, especially subclass 1.2 and 1.3 for processes for cleaning a semiconductor substrate including the application of electrical or wave energy to the substrate. (Etching operation not meeting the Class 438 definition)
(1) Note. If the undesirable material to be removed from the semiconductor substrate resides other than on the surface thereof, the process is to be considered gettering of the substrate and thus is proper for Class 438.
148, Metal Treatment, for unit coating operations on metal, particularly 206 wherein there is carburization or nitriding of a metal surface by chemical reaction or diffusion of an externally supplied source of carbon or nitrogen that reacts with the metal surface wherein the metal substrate remains as part of the coating and subclasses 240[supscrpt]+ [end supscrpt]wherein there is reactive coating of a metal substrate with an external reactant (e.g., oxygen, etc.) wherein the metal substrate remains as part of the coating. Class 148 also takes heat treatment of metallic compositions if during the heat treatment there is either a change in the internal physical structure (i.e., microstructure) or chemical properties. (Coating operation not meeting Class 438 definition)
(1) Note. Since in certain instances metallic compositions could be semiconductor material meeting the Class 438 criteria, placement will go to Class 438 over Class 148 if the material is identified or perceived as semiconductor material. If perceived, a mandatory cross is made in Class 148.
(2) Note. Reactive coating, per se, of a metal (i.e., not
intended to be semiconductive) area on a semiconductive substrate (i.e., meeting the Class definition of semiconductor substrate in the Glossary) is original in Class 438. A mandatory cross is made in Class 148 if the only step is reactive coating of a metal portion of a semiconductive containing substrate.
(3) Note. Combination of Class 148 heat treatment of a metal substrate to modify or maintain the chemical property or microstructure of the metal with (a) additional manufacturing of semiconductor device structure or (b) with a Class 438 coating or etching operation takes the original to Class 438.
148, Metal Treatment, 33.1 for semiconductor stock which must be essentially homogeneous and have at least two contiguous layers differing in the number of unbound electrons and/or differing in energy gap levels, which exhibit a junction between the layers. (see "Location Of Semiconductor Compound, Composition, Or Stock" above.)
148, Metal Treatment, for processes of heat treating metals. Class 148 takes heat treatment of metallic compositions if during the heat treatment there is either a change in the internal physical structure (i.e., microstructure) or chemical properties. Since in certain instances metallic compositions could be semiconductor material meeting the Class 438 criteria, placement will go to Class 438 over Class 148 if the material is identified or perceived as semiconductor material. If perceived, a mandatory cross is made in Class 148. (heating class)
156, Adhesive Bonding and Miscellaneous Chemical Manufacture, 60 for a process of adhesively bonding. Multistep processes for packaging semiconductors having no significant semiconductor chip structure are proper for Class 156 when they claim (a) adhesive bonding combined with shaping of nonmetals, (b) adhesive bonding combined with broad or nominally claimed metal-shaping steps, or (c) adhesive bonding including steps for assembling the parts to be bonded are proper in Class 156. An adhesive bonding unit operation for packaging or mounting operations on semiconductor devices goes as original to Class 156. Adhesive bonding combined with Class 438 coating of a semiconductor substrate or Class 438 etching of a semiconductor substrate places the original in Class 438. (See "Packaging (E.g., With Mounting, Encapsulating, Etc.)" above)
174, Electricity: Conductors and Insulators, subclasses 15.1-16.3 for fluid cooling of electrical conductors or insulator, subclasses 52.1+, for housings with electric devices or mounting means, and subclasses 250 through 268 for printed circuit devices. (electrical class)
204, Chemistry: Electrical and Wave Energy, particularly 334 for synthesis of material, such as silicon, by passing an electrical current through a fused material. See "Unit
Coating Operations, Combined Operations Involving Coating," above and see elsewhere in this section for Class 204 or Class 205 coating. Or see "Unit Etching Operations And Combined Etching Operations" above for Class 204 etching and the line to Class 438. (see "Line Notes To Other Manufacturing Operations," above)
204, Chemistry: Electrical and Wave Energy, particularly see 192.32, for sputter etching operations on semiconductor material and semiconductor containing substrates; even if the semiconductor is intended for electrical purposes. Simultaneous sputter etching and chemical etching (e.g., as when utilizing a mixture of argon and halide gas, etc.) go as original in Class 204. (Etching operation not meeting the Class 438 definition)
(1) Note. Creation of semiconductor structure, (e.g., semiconductor active region, semiconductor junction, etc.) by steps subsequent to sputter etching will go to Class 438.
204, Chemistry: Electrical and Wave Energy, particularly subclasses 192.1-192.37 for sputter coating operations involving semiconductor material or substrates including a semiconductor region, even if the intent is to use the semiconductor material for (a) conducting or modifying an electrical current, (b) storing electrical energy for subsequent discharge within a microelectronic integrated circuit, or (c) converting electromagnetic wave energy to electrical energy or electrical energy to electromagnetic energy - Class 204 will take combinations of sputter coating with other chemical treating operations that involve (a) preparatory treatment of the substrate (e.g., etching, cleaning, etc.) or (b) subsequent perfecting treatment of the applied coating with the following exception noted (coating operation not meeting Class 438 definition); and subclasses 192.32-192.37, for sputter etching operations on semiconductor material and semiconductor containing substrates, even if the semiconductor is intended for electrical purposes - simultaneous sputter etching and chemical etching (e.g., as when utilizing a mixture of argon and halide gas, etc.) go as original in Class 204 (etching operation not meeting the Class 438 definition).
(1) Note. Creation of semiconductor structure (e.g., semiconductor active region, semiconductor junction, etc.) by subsequent treatment steps, even if limited to the Class 204 applied coating, will go to Class 438. Any subsequent operation that affects the substrate is not provided in Class 204 and is proper in Class 438. However, heat treatment of the Class 204 coating that causes interdiffusion limited to the interfacial region to perfect the bonding of the coating to the substrate is proper for Class 204.
(2) Note. Creation of semiconductor structure (e.g., semiconductor active region, semiconductor junction, etc.) by steps subsequent to sputter etching will go to Class 438.
205, Electrolysis: Processes, Compositions Used Therein, and Methods of Preparing the Compositions, particularly subclass 123, 124, and 157 for electrolytic coating operations on semiconductor or semiconductor devices (coating operation not meeting Class 438 definition), subclasses 334-639 for electrolytic synthesis of material, such as silicon, by passing an electrical current through a fused material, and subclass 656 for electrolytic erosion of a workpiece of non-uniform internal electrical characteristics (etching operation not meeting the Class 438 definition). Class 205 will take combinations of electrolytic coating with other chemical treating operations that involve (a) preparatory treatment of the substrate (e.g., etching, cleaning, etc.) or (b) subsequent perfecting treatment of the applied coating with the following exception noted (coating operation not meeting Class 438 definition).
205, Electrolysis: Processes, Compositions Used Therein, and Methods of Preparing the Compositions, particularly subclass 656 for electrolytic erosion of a workpiece of nonuniform internal electrical characteristics. Class 205 is an integral part of Class 204 and follows the definitions thereof. (Etching operation not meeting the Class 438 definition)
216, Etching a Substrate: Processes, for chemical etching processes and perfecting operations therefor, including lithos:graphic steps, of semiconductor material that is to be utilized for nonelectrical properties. (Etching operation not meeting the Class 438 definition)
(1) Note. This class provides for a species of Class 216 operations involving etching a semiconductive substrate or etching a substrate containing a semiconductive region; wherein the intent is to use the electrical properties of the semiconductor in a solid-state device for at least one of the following purposes: (a) conducting or modifying an electrical current, (b) storing electrical energy for subsequent discharge within a microelectronic integrated circuit, or (c) converting electromagnetic wave energy to electrical energy or electrical energy to electromagnetic energy.
(2) Note. Generic claims with a sole claimed specie of etching for Class 216 goes as original to Class 216. Generic claims with a sole disclosed specie of etching for Class 438 goes as original in Class 438. Generic claims with plural claimed etching specie wherein at least one of the claimed species does not belong in Class 438 goes as original in Class 216. Generic claims with plural disclosed etching specie one of which does not belong in Class 438 goes to Class 216 as original. Generic claims with no material specie claimed or disclosed goes as original in Class 216. When there is no generic claim and plural separately claimed etching specie, wherein at least one claim of which is Class 216 and one claim of which is Class 438, placement goes as original to Class 438 with a mandatory cross-reference to Class 216.
219, Electric Heating, 78.01 for a process and apparatus for bonding by electrical current and pressure, and appropriate subclasses for electric heating of material, per se. However, inclusion of the criteria for Class 438 as set forth hereinabove takes the original to Class 438 even when electric heating is involved. (heating class)
228, Metal Fusion Bonding, appropriate subclasses for a process of fusion bonding and additional operations which are considered to be ancillary to the bonding (preheating, positioning, pretinning, etc.) of a semiconductive substrate; especially note subclass 123.1 and 179.1+. {See "Packaging (E.g., With Mounting, Encapsulating, Etc.)" above}
250, Radiant energy, for methods not elsewhere provided of (a) using, generating, controlling, or detecting radiant energy, (b) combinations including such methods, and (c) subcombinations thereof. Particularly, see 492.2 for processes of irradiation of semiconductor devices with no indication as to what occurs to the substrate. Class 250, subclasses 492.2+[supscrpt],[end supscrpt] generally relates to processes of exposing substrates to ion bombardment utilizing apparatus of Class 250 when limited to operating the apparatus in apparatus terms. Class 250 is also the generic home for processes of exposing substrates to ion bombardment. However, Class 438 provides for ion implantation of semiconductive substrate or substrate containing a semiconductive region and also ion implantation throughout the material mass to produce semiconductive material or to modify the semiconductive material. (Coating operation not meeting Class 438 definition)
250, Radiant Energy, for methods not elsewhere provided, of (a) using, generating, controlling, or detecting radiant energy, (b) combinations including such methods, and (c) subcombinations thereof. Particularly, see 492.2 for processes of irradiation of semiconductor devices with no indication as to what occurs to the substrate. Class 250 subclasses 492.2+[supscrpt],[end supscrpt] generally relates to processes of exposing substrates to ion bombardment utilizing apparatus of Class 250 when limited to operating the apparatus in apparatus terms. Class 250 is also the generic home for processes of exposing substrates to ion bombardment. However, Class 438 takes chemically reactive ion etching of semiconductive substrate or substrate containing semiconductive region. (Etching operation not meeting the Class 438 definition)
250, Radiant Energy, for heating invisible radiant energy; subject matter of Class 438, per se, when no function other than heating is attributed to the process and for methods not elsewhere provided, of (a) using, generating, controlling, or detecting radiant energy, (b) combinations including such methods, and (c) subcombinations thereof. Particularly, see 492.2 for processes of ion bombardment or irradiation of semiconductor devices, with no indication as to what occurs
to the substrate. (heating class)
252, Compositions, for (a) 62.3 for semiconductor compositions which have been uniformly doped or otherwise specialized for use as one layer which when combined with another such layer would provide an interface exhibiting barrier layer properties (e.g., as exists in Class 148, subclasses 33 through 33.6, stock wherein there is a semiconductor junction, etc.) and (b) subclasses 500+ for electrical conductive compositions. Also see the cross-reference art collection in Class 252, subclasses 950+[supscrpt],[end supscrpt] for doping agent source materials. (see "Location Of Semiconductor Compound, Composition, Or Stock" above.)
257, Active Solid-State Devices (e.g., Transistors, Solid-State Diodes), for active solid-state electronic device structure, per se. Subject matter may include one or more such devices combined with contacts or leads, or structures configured to be tested on a semiconductor chip, or merely semiconductor material without contacts or leads where the sole disclosed use is an active solid-state device. This subject matter does not include active solid-state devices combined with significant circuits. (electrical class)
264, Plastic and Nonmetallic Article Shaping or Treating: Processes, for a process (and steps perfecting same) of forming a composite by shaping a plastic or nonmetallic wherein a semiconducting containing preform is within a mold during the shaping operation (e.g., encapsulating, etc.). (See "Packaging (E.g., With Mounting, Encapsulating, Etc.)" above)
361, Electricity: Electrical Systems and Devices, 679 for housings and mounting assemblies for electronic devices and components, and subclasses 736+ and 752+ for modules for printed circuits or housing or chassis for printed circuit boards. (electrical class)
364, Electrical Computers And Data Processing Systems, especially subclass 468.28 for methods of production or design of semiconductor devices or integrated circuits wherein a data processing system or calculating computer controls a specific manufacturing step, condition, or workpiece, and subclasses 490+ for the design and analysis of integrated circuits. (electrical class)
376, Induced Nuclear Reactions: Processes, Systems, and Elements, particularly subclass 183 for a process of neutron bombardment, per se, of semiconductive material containing an element which is converted to a desired dopant by nuclear transmutation. Any combination of operations that goes beyond formation of the transmutated doped semiconductor material, per se, goes as original to Class 438 if it meets the criteria of the intent to use the electrical properties of the semiconductor in a solid-state device as set forth by the Class 438 definition. (Coating operation not meeting Class
438 definition)
376, Induced Nuclear Reactions: Processes, Systems, and Elements, 320 for the direct conversion of the energy produced in a nuclear reaction into an electrical output by a one-step process or apparatus for accomplishing such a one-step process. (electrical class)
378, X-ray or Gamma Ray Systems or Devices, especially 34 for X-ray or gamma-ray lithography. (electrical class)
382, Image Analysis, especially subclass 145 for a process limited to image analysis per se in manufacturing of an integrated circuit. However, inclusion of subject matter for Class 438 remains with Class 438 even if there is a step of image analysis.
385, Optical Waveguides, particularly, subclass 14 for a laser in integrated optical circuit, subclasses 129+ for a planar optical waveguide, and subclasses 141+ for a waveguide having a particular optical characteristic modifying chemical composition. The (13) Note of Class 385 indicates that miscellaneous manufacturing of optical wave guide devices not elsewhere provided are in Class 385. Thus, if the manufactured article is a semiconductor device, a Class 438 process controls over the Class 385 process even if an optical fiber is part of the device. (electrical class)
420, Alloys or Metallic Composition, for alloys or metallic compositions that may also exhibit semiconductor properties (e.g., gallium arsenide, etc.). (see "Location Of Semiconductor Compound, Composition, Or Stock" above.)
423, Chemistry of Inorganic Compounds, appropriate subclasses for inorganic compounds or elements used in the manufacture of semiconductor devices. (see "Location Of Semiconductor Compound, Composition, Or Stock" above.)
427, Coating Processes, for coating operations provided for in that class, particularly 457 for a process of treating a coating with radiant energy; subclasses 487+ for polymerization of applied coating utilizing direct application of electrical, magnetic, wave, or particulate energy; subclasses 523+ for ion plating or ion implanting; subclasses 532+ for pretreatment of a substrate or posttreatment of a coated substrate utilizing electrical, magnetic, wave, or particulate energy; subclasses 569+ for deposition coating processes utilizing plasma; subclasses 580+ for deposition coating processes utilizing electrical discharge; subclass 581 for coating processes utilizing chemical liquid deposition; subclass 582 for coating processes utilizing photo-initiated chemical vapor deposition; subclasses 585+ for coating processes utilizing chemical vapor deposition; subclass 591 for deposition coating utilizing induction or dielectric heating; subclasses 592+ for deposition coating utilizing resistance heating; subclasses 595+ for deposition coating utilizing
electromagnetic or particulate radiation; subclasses 598+ for deposition coating utilizing magnetic field or force; subclass 600 for deposition coating utilizing sonic or ultrasonic energy. (Coating operation not meeting Class 438 definition)
(1) Note. Class 438 provides for a specie of Class 427 operations involving (a) coating a substrate with a semiconductive material or (b) coating a semiconductive substrate or substrate containing a semiconductive region; and wherein the intent is to use the electrical properties of the semiconductor in a solid state device for at least one of the following purposes: (i) conducting or modifying an electrical current, (ii) storing electrical energy for subsequent discharge within a microelectronic integrated circuit, or (iii) converting electromagnetic wave energy to electrical energy or electrical energy to electromagnetic energy.
(2) Note. Generic claims with a sole claimed specie of coating for Class 438 goes as original to Class 438. Generic claims with a sole disclosed specie of coating for Class 438 goes as original in Class 438. Generic claims with plural claimed coating species wherein at least one of the claimed species does not belong in Class 438 goes as original in Class 427. Generic claims with plural disclosed coating species one of which does not belong in Class 438 goes to Class 427 as original. Generic claims with no material species claimed or disclosed goes as original in Class 427. When there is no generic claim and plural separately claimed coating specie, wherein at least one claim of which is Class 427 and one claim of which is Class 438, placement goes as original to Class 438 with a mandatory cross-reference to 427.
428, Stock Material or Miscellaneous Articles, appropriate subclasses for semiconductor stock material defined in terms of composition and structure, especially subclass 620. (see "Location Of Semiconductor Compound, Composition, Or Stock" above.)
429, Chemistry: Electrical Current Producing Apparatus, Product, and Process, especially subclass 7 for a combination including a nonbattery electrical component electrically connected within a cell casing other than testing or indicating components. (electrical class)
430, Radiation Imagery Chemistry: Process, Composition, or Product Thereof, particularly for initial lithos:graphic processes in semiconductor manufacture limited to (a) exposure imaging and developing and including preparatory operations to the exposure (e.g., as coating to form the resist, etc.) or (b) developing, per se, of subject matter of Class 430 substrates. When Class 430 exposure, imaging or developing are combined with etching or coating of a semiconductor substrate for purposes other than masking and commensurate with the Class 438 definition for manufacture of
a semiconductor device as set forth hereinabove, the combination goes as original to Class 438 with the following exception noted. (Coating operation not meeting Class 438 definition)
(1) Note. Since Class 430 provides for processes of (a) coating, per se, of substrates, with a composition to produce a product to be used for electric or magnetic imagery and (b) processes of coating, per se, of substrate with a photosensitive composition for use in radiation imagery, coating or etching of semiconductor material limited to forming a product intended to be used for electric, magnetic, or radiation imagery is original in Class 430.
(2) Note. Although technically classifiable as an original in Class 438 according to the above paragraph, any multistep process involving significant Class 430 operations as a subcombination of the overall process should be cross-referenced to Class 430.
430, Radiation Imagery Chemistry: Process, Composition, or Product Thereof, particularly for initial lithos:graphic processes in semiconductor manufacture limited to (a) exposure imaging and developing and including preparatory operations to the exposure (e.g., as coating to form the resist, etc.) or (b) developing, per se, of subject matter of Class 430 substrates. When Class 430 exposure imaging or developing are combined with etching or coating of a semiconductor substrate commensurate with the Class 438 definition for manufacture of a semiconductor device as set forth hereinabove, the combination goes as original to Class 438 with the following exception noted. (Etching operation not meeting the Class 438 definition)
(1) Note. Since Class 430 provides for processes of (a) coating, per se, of substrates, with a composition to produce a product to be used for electric or magnetic imagery and (b) processes of coating per se of substrate with a photosensitive composition for use in radiation imagery, coating or etching of semiconductor material limited to forming a product intended to be used for electric, magnetic, or radiation imagery is original in Class 430.
(2) Note. Although technically classifiable as an original in Class 438 according to the above paragraph, any multistep process involving significant Class 430 operations as a subcombination of the overall process should be cross-referenced to Class 430.
432, Heating, for generic heating processes. However, inclusion of the criteria for Class 438 as set forth hereinabove takes the original to Class 438 even when generic heating is involved. (heating class)
439, Electrical Connectors, appropriate subclasses for features related or analogous to electrical contact or housing features of active solid-state devices (e.g., 271
for sealing elements or subclasses 449+ for stress relief means for conductor to terminal joint. (electrical class)
501, Compositions: Ceramic, appropriate subclasses for ceramic compositions used in semiconductor devices. (see "Location Of Semiconductor Compound, Composition, Or Stock" above.)
505, Superconductor Technology: Apparatus, Material, Process, particularly subclass 330 for processes of manufacturing from high temperature (i.e., above 30 degrees Kelvin) superconductive material (a) superconductor devices or (b) semiconductor devices having superconductive components or connect lines. (see "Line Notes To Other Manufacturing Operations," above)

GLOSSARY:
Listed below are: (1) a compilation of acronyms, abbreviations, and technological terms pertaining to solid-state electrical devices, manufacturing processes, and related apparatus and compositions useful therefor and (2) the meaning to be given to the various "art" terms appearing in this class. These latter terms, some of which have been included in the glossary below, are the same as that generally accepted or in common usage. However, certain terms employed in this class and also included below have been assigned definitions which may be more restrictive or different from those in common usage since these terms are being utilized for distinguishing this class over other classes of related art.
a-Si
Amorphous silicon
ACT
Acoustic charge transport
ADC
Analog-to-digital converter
AES
Auger electron spectroscopy
ALE
Atomic layer epitaxy
ALEP
Angle-lapping edge profilometry
AMD
Active matrix display
AMG
Alternative-metal, virtual-ground (metallization)
APCVD
Atmospheric-pressure CVD
APD
Avalanche photodiode
ARC
antireflective coating
ASG
Arsenosilicate glass
BBCO
Barium bismuth copper oxide (a HTSC)
BBD
Bucket brigade device
BBL
Buried bit-line
BED
Band edge discontinuity
BH
Buried heterostructure
BHF
Buffered hydrofluoric acid
BIC
Breakdown of insulator for conduction
BICFET
Bipolar inversion channel FET
BiCMOS
Integrated bipolar and CMOS
BiMOS
Integrated bipolar and MOSFET
BJT
Bipolar junction transistor
BKBO
Barium potassium bismuth oxide (a HTSC)
BLM
Ball limiting metallization
BMD
Bulk micro defect
BOE
Buffered oxide etch
BOX
Buried oxide
BOXES
Buried oxide with etch stop
BPSG
Borophosphosilica glass
BPTEOS
borophosphoTEOS
BSD
Back side damage
BSE
buried storage electrode
BSG
Borosilica glass
BSQ
Bias sputter quartz
BST
Barium strontium titanate
CAIBE
Chemically assisted ion beam etching
CBIC
Complementary bipolar IC
CBKR
Cross bridge Kelvin resistor (test structure)
CCB
Controlled collapse bonding
CCC
Corrugated capacitor cell
CCD
Charge coupled device
CDE
Chemical dry etching
CDI
Collector diffusion isolation
CEL
Contrast enhancement layer
CER
Contact end resistor (test structure)
CERDIP
ceramic DIP
chanstop
channel stop isolation structure
CHEMFET
Chemically sensitive FET
CHL
Current hugging logic
CID
Charge injection device
CLSEG
Confined lateral SEG
CML
Current mode logic (i.e., ECL)
CMOS
Complementary (NMOS and PMOS) FETs
CMP
chemical-mechanical polishing/planarization
COB
(a) chip-on-board or (b) capacitor over bit-line
COD
Catastrophic optical damage
COG
Chip-on-glass
COMFET
Conductivity modulation FET (i.e., IGBT)
CSBH
Channeled substrate buried heterostructure
CSL
Coherent superlattice
CTD
Charge transfer device
CTSL
Coherent tilted superlattice
CVD
Chemical vapor deposition
Cz
Czoshralski (melt pulling)
DADBS
diacetoxyditertiarybutoxysilane
DADIS
diacetoxydiisopropoxysilane
DBR
distributed Bragg reflector
DCG
dichromated gelatin
DCFL
direct-coupled FET logic
DCS
dichlorosilane
DDE
double diffused epitaxy
DDI
deep dielectric isolation
DEIS
dual electron injection structure
DEZ
diethylzinc
DFB
distributed feedback (laser)
DH
double-hetero
DHBT
double-hetero bipolar transistor
DHF
dilute hydrofluoric acid
DI
dielectric isolation
DIBL
drain induced barrier lowering
DIET
dielectrically encapsulated trench capacitor
DIP
dual-in-line package
DLP
double layer polysilicon
DLTS
deep level transient spectroscopy
DMAH
dimethylaluminumhydride
DMD
(a) depletion mode device (also D-mode or D-type) or (b) deformable mirror device
DMOS
double diffused MOS
DMS
dilute magnetic semiconductor
DOES
doublehetero optoelectronic switch
DRAM
dynamic random-access memory
DSP
double stacked capacitor
DTL
diode-transistor logic
DUF
diffusion under film
DUT
device under test
DUV
deep ultraviolet
DZ
denuded zone
-E-
EAROM
electrically alterable read-only memory
EB
(a) extrinsic base or (b) electron beam
EBES
electron beam exposure system
EBIC
electron beam induced current
EBL
electron beam lithography
ECL
emitter coupled logic
ECR
electron cyclotron resonance
EDP
ethylene-diamine-pyrocatechol etchant
EDTA
ethylenediaminotetraacetic acid
EELS
electron energy loss spectroscopy
EEPROM
electrically erasable programmable read-only memory
EFG
edge-defined film-fed growth (also EDFFG or EDFG)
EG
extrinsic gettering
EGSi
electronic-grade silicon
EL
electroluminescent
ELO
epitaxial lateral overgrowth
EMD
enhancement mode device (also E-mode or E-type)
EMI
electromagnetic interference
EMP
electron microprobe
EPB
epoxidated polybutadiene (an EB resist)
EPD
etch pit density
EPI
epitaxial (single crystalline) layer
EPP
ethylene-piperidine-pyrocatechol etchant
EPR
electron paramagnetic resonance
EPROM
erasable programmable read-only memory
EPS
effective punchthrough stopper
EPW
etchant mix of ethylenediamine, pyrocatechol, and water
ESCA
electron spectroscopy for chemical analysis
ESD
electrostatic discharge
ESR
(a) equivalent series resistance or (b) electron spin resonance
FAMOS
floating-gate avalanche-injection MOS
FASIC
folded bit-line adaptive sidewall isol. capacitor cell
FCT
field controlled thyristor
FEC
floating electrode capacitor
FED
field emission device
FET
field effect transistor
FIB
focused ion beam
FIPOS
full isolation by porous oxidized silicon
FLOTOX
floating gate tunnel oxide
FOX
field oxide
FPD
field programmable device
FPGA
field programmable gate array
FTIR
Fourier transform infrared spectroscopy
FUROX
fully recessed oxide isolation
GDMS
glow discharge mass spectroscopy
GILD
gas immersion laser doping
GRIN-SCH
graded index separate confinement heterostructure
GTO
gate turn-off
HBT
heterojunction bipolar transistor
HDC
high dielectric constant
HDI
high density interconnects
HDMI
high density multilayer interconnects
HEMT
high electron mobility transistor (Hetero MESFET)
HET
hot electron transistor (bipolar)
Hi-C
high capacitance
HIC
hybrid integrated circuit
HIMOS
(see COMFET)
HIPOX
high pressure oxidation
HMDS
hexamethyldisilizane
HNA
hetchant mix of hydrofluoric, nitric, and acetic acids
HPSC
half-V[subscrpt]cc[end subscrpt]sheath plate capacitor
HTO
high temperature oxide
HTSC
high temperature superconductor
IB
(a) intrinsic base or (b) ion beam
IBD
ion beam deposition
IC
integrated circuit
ICP
inductively coupled plasma
IG
intrinsic gettering
IGBT
insulated gate bipolar transistor (e.g., COMFET, HIMOS)
IGFET
insulated gate field effect transistor
IID
impurity induced disordering
I[supscrpt]2[end supscrpt]L
integrated injection logic
IJP
ink jet printhead
ILB
inner lead bonding
ILD
interlayer dielectric
IMMA
ion microprobe mass analysis
IMPATT
impact ionization avalanche transist time (diode)
INS
intrinsic nondoped semiconductor
IR
infrared
ISFET
ion sensitive FET (i.e., CHEMFET)
ITO
indium tin oxide (a TCO)
IVEC
isolation vertical capacitor cell
JFET
junction field effect transistor (junction gate)
JOFET
Josephson junction field effect transistor
JTE
junction termination extension
KMER
Kodak metal etch resist
KPR
Kodak photo resist
KTFR
Kodak thin film resist
LAGB
low-angle grain boundary
LATID
large angle tilt implant drain
LB
(a) Langmuir-Blodgett or (b) laser beam
LCCD
leadless ceramic chip carrier
LCD
liquid crystal display
LDCC
leaded ceramic chip carrier
LDD
lightly doped drain
LEC
liquid encapsulated Czoshralski
LED
light emitting diode
LEED
low-energy electron diffraction
LEK
liquid encapsulated Kyropoulus
LOCOS
local oxidation of silicon
LOPED
lift-off using edge detection
LPCVD
low-pressure chemical vapor deposition
LPE
liquid phase epitaxy
LRP
limited reaction processing
LSI
large scale integration
LSSL
lateral surface superlattice
LST
logic service terminal
LTCC
low temperature co-fired ceramic
LTG
low temperature growth
LTO
low temperature oxidation
MBE
molecular beam epitaxy
MCz
magnetic Czoshralski
MCM
multichip module
MCT
(a) MOS controlled thyristor or (b) HgCdTe
MEM
micro-electromechanical
MESFET
metal semiconductor FET (Schottky gate)
MF[supscrpt]3[end supscrpt]R
modified fully-framed fully-recessed isolation
MGSi
metallurgical-grade silicon
MIM
metal-insulator-metal
MISFET
metal insulator semiconductor IGFET
MLEC
magnetic LEC
MLC
multilayer ceramic
MLO
multilayer oxide
MLR
multilayer resist
MMA
methyl methacrylate
MMIC
monolithic microwave integrated circuit
MNOS
metal nitride/oxide IGFET
MOCVD
metal organic chemical vapor deposition
MODFET
modulation doped MESFET (i.e., HEMT)
MOMOM
metal-oxide-metal (tunnelling device)
MOSFET
metal oxide semiconductor IGFET
MQW
multiquantum well
MTF
mean time to failure
MTL
merged transistor logic (i.e., I[supscrpt]2[end supscrpt]L)
NDC
negative differential conductivity
NEA
negative electron affinity (e[supscrpt]-[end supscrpt]emitter)
NMA
N-methyl-acetamide
NMOS
n-channel MOSFET
NMP
n-methyl-pyrrolidone
novolak
Thermoplastic phenol-formaldehyde used as photoresist
NPN
(bipolar transistor)
NRD
nitridation retarded diffusion
NSAG
nonself-aligned gate
NTD
neutron transmutation doping
NVRAM
nonvolatile RAM
OBG
optical band gap
ODE
orientation dependent etching
OED
oxidation enhanced diffusion
OEIC
optoelectronic integrated circuit
OF
orientation flat
OISF
oxidation induced stacking fault
OMCVD
organometallic CVD
OMCT
octamethylcyclotetrasiloxane
OMVPE
organometallic VPE
ORD
oxidation retarded diffusion
ORL
optical return loss
OSA
optical subassembly
OSF
(see OISF)
OTCR
over-the-cell routing
OTP
one-time programmable
OXSEF
oxygen-doped silicon epitaxial film
PAC
photoactive compound
PAP
peel apart
PBG
photonic band gap
PBL
polybuffered LOCOS
PBM
planarization blocking mask
PBN
pyrolytic boron nitride
PBT
permeable base transistor
PCB
printed circuit board
PCE
photoconductive element
PEB
postexposure baking
PECVD
plasma enhanced chemical vapor deposition
PEP
photo-engraving process
PFT
peeled film technology
PGA
(a) pin-grid array or (b) programmable gate array
PGMA
poly(glycidyl methacrylate) (an EB resist)
PHS
plated heat sink
PIC
photonic integrated circuit
PID
programmable interconnect device (fuse/antifuse)
PIN
P-type layer, intrinsic layer, N-type layer
PIQ
thermosetting polyimide resin
PLA
programmable logic array
PLCC
plastic leaded chip carrier
PLDD
profiled LDD
PLM
pad limiting metallurgy
PLZT
lead lanthanate zirconate titanate
PMMA
polymethylmethacrylate
PMOS
p-channel MOSFET
PNP
(bipolar transistor)
polycide
polycrystalline silicide
polySi
polycrystalline silicon
PPL
poly pad LOCOS
PR
photoresist
PROM
programmable read only memory
PROPS
planarization with resist/oxide and polysilicon
PSD
photosensitive diode or dielectric
PSG
phosphosilica glass
PTC
positive temperature coefficient
PTH
plated through-hole
PUT
programmable unijunction transistor
PVD
physical vapor deposition
PWB
printed wiring board
PZT
lead zirconate titanate
QE
quantum efficiency
QFP
quad flat package
QUIP
quad-in-line package
QW
quantum well
QWIP
quantum well infrared photodetector
RAM
random access memory
RBS
Rutherford backscattering
RBT
resonant tunneling bipolar transistor
RCT
reverse conducting thyristor
RED
radiation enhanced diffusion
resurf
reduced surface field
RETT
resonant electron transfer triode
RF
radiofrequency
RHEED
reflected high energy electron diffraction
RHET
resonant tunneling hot electron transistor (bipolar)
RIBE
reactive ion beam etching
RIE
reactive ion etching
RISC
reduced instruction set computing
RMS
refined metallurgical silicon
ROI
recessed oxide isolation
ROM
read only memory
ROX
recessed oxide
RTA
rapid thermal anneal
RTP
rapid thermal processing
salicide
self-aligned silicide
SAG
self-aligned gate
SAW
surface acoustic wave (pressure sensitive device)
SBD
Schottky barrier diode
SBH
Schottky barrier height
SBS
silicon bilateral switch
SCCM
standard cubic centimeter per minute
SCM
single chip module
SCR
silicon controlled rectifier
SDFL
Schottky diode FET logic
SDHT
selectively doped heterostructure transistor (e.g., HEMT)
S-DIP
shrink DIP
SEED
self-enhanced electro-optical devices
SEG
selective epitaxial growth
SEL
(a)surface emitting laser or (b)state excitation by light
SELFOX
selective epitaxial layer field oxidation
SEM
scanning electron microscopy
SEOT
self-aligned epitaxy over trench
SEPOX
selective polysilicon oxidation
SER
soft error rate
SFFT
superconducting flux flow transistor
SGT
surrounding gate transistor
Si
silicon
SI
semi-insulating
SICOS
sidewall base contact structure
SILO
sealed interface local oxidation
SIMOX
separation by implanted oxygen
SIMS
secondary ion mass spectrometry
SIP
single-in-line package
SIPOS
semi-insulating polycrystalline oxygen-doped silicon
SIT
(a)static induct. thyristor or (b)static induct. trans.
SLM
spatial light modulator
SLS
strained layer superlattice
SLT
solid logic technology
SMT
surface mount technology
SOG
spin-on glass
SOI
silicon on insulator
SOIC
small outline IC package
SOJ
small outline J-lead package
SOS
silicon on sapphire
SPE
solid phase epitaxy
SPOT
self-aligned planar oxidation technology
SPT
substrate plate trench capacitor
SQUID
superconductive quantum interference device
SRAM
static random access memory
SRO
stress relief oxide
SSDP
simultaneous single/polycrystalline deposition
SSI
small scale integration
SST
(a)super self-alignment tech. or (b)sealed sidewall tech.
STT
stacked transistor capacitor cell
SUBHET
superconducting base hot electron transistor
SUBSIT
superconducting base semiconductor isolated transistor
SWAMI
sidewall masked isolation
TAB
tape automated bonding
TAT
turn around time
TBES
tritertiarybutoxyethoxysilane
TBCO
thallium bismuth copper oxide (a HTSC)
TCE
trichloroethylene
TCM
thermal conduction module
TCO
transparent conductive oxide
TDDB
time dependent dielectric breakdown
TEC
thermoelectric cooler
TED
transient enhanced diffusion
TEG
(a) triethylgallium or (b) test element group
TEM
transmission electron spectroscopy
TEOS
tetraethylorthosilane
TFR
thin film resistor
TFT
thin film transistor
TGZM
temperature gradient zone melting
TH
through-hole
TIBA
triisobutylaluminum
TLTR
transmission line tap resistor (test structure)
TMA
(a) trimethylaluminum or (b) trimethylantimony
TMAH
tetramethyl ammoniumhydroxide
TMAT
tetramethylamidotitanium
TMB
tetramethylborate
TMCTS
tetramethylcyclotetrasiloxane
TMG
trimethylgallium
TMOS
tetramethyloxysilane
TMP
trimethylphosphine
TMS
tetramethylsilane
TMT
tetramethyltin
TOFER
topos:graphic feature enhancement by RIE
TPF
thermoplastic film
TRAPPAT
trapped plasma avalanche tunnel transit (diode)
TSD
temperature sensing diode
TSOP
thin small outline package
TTL
transistor-transistor logic
UHV
ultrahigh vacuum
UV
ultraviolet
VCNR
voltage controlled negative resistance
VGF
vertical gradient freeze (also VFG)
VHSIC
very high speed integrated circuit
VLE
vapor levitation epitaxy
VLSI
very large scale integration
VMOS
vertical MOS
VPE
vapor phase epitaxy
VSIS
V-channel substrate inner stripe
WSI
wafer scale integration
XRD
x-ray diffraction
YBCO
yttria barium copper oxide (a HTSC)
YSZ
yttria stabilized zirconia
ZDO
zero drain overlap
ZIP
zigzag-in-line package
ZMR
zone melt recrystallization
mc
microcrystalline
p
high resistivity intrinsic semiconductor
ACCEPTOR IMPURITY
An atom or ion different from or foreign to, but present in, a semiconductor material and which has insufficient valence electrons to complete the normal bonding arrangement in the semiconductor crystal structure. An acceptor impurity (also
referred to as p-type) accepts an electron from an adjacent atom to create a positive charge carrier (i.e., a hole). A donor impurity (also referred to as n-type) provides an electron to the conduction band of the semiconductor.
ACTIVE SOLID-STATE DEVICE
An electronic device or component that is primarily made up of solid materials, usually semiconductors, which operates by the movement of charge carriers - electrons or holes - which undergo energy level changes within the material and can modify an input voltage to achieve rectification, amplification, or switching action. Active solid-state electronic devices include diodes, transistors, thyristors, etc., but exclude pure resistors, capacitors, inductors, or combinations solely thereof. The latter category is characterized as passive.
ALLOY JUNCTION
A fused junction produced by combining one or more elemental impurity metals with a semiconductor. Typical alloyed junctions include indium-germanium and aluminum-silicon.
AUTODOPING
The introduction via the vapor phase of impurities from an existing substrate region (and adjacent supports, e.g., susceptors, etc.) into another substrate region, typically during growth of the same.
AVALANCHE BREAKDOWN
A sudden change from high dynamic electrical resistance to very low dynamic resistance in a reverse biased semiconductor device (e.g., a reverse biased junction between p-type and n-type semiconductor materials) wherein current carriers are created by electrons or holes which have gained sufficient speed to dislodge valence electrons. Avalanche breakdown can cause structural damage to a semiconductor device.
BAND GAP
The difference between the energy levels of electrons bound to their nuclei (valence electrons) and the energy levels that allow electrons to migrate freely (conduction electrons). The band gap depends on the particular semiconductor involved.
BARRIER REGION OR LAYER
A region which extends on both sides of a semiconductor junction in which all carriers are swept away from the junction region. The region is depleted of carriers. This is also referred to as a depletion region. Not to be confused with diffusion barrier layers associated with metallization schemes for active solid state devices.
BINARY COMPOUND
A substance that always contains the same two elements in a fixed atomic ratio.
BIPOLAR
An active solid-state electronic device in which both positive and negative current carriers are used to support current flow.
BIPOLAR TRANSISTOR
An active solid-state electronic device with a base electrode and two or more junction electrodes in which both positive and negative current carriers are used to support current flow.
BIRD'S BEAK
The lateral encroachment of the localized oxidation region associated with a recessed oxide isolation structure.
BONDING PAD
A metallized area to which an external electrical connection is to be made.
BREAKDOWN
A sudden change from high dynamic electrical resistance to a very low dynamic resistance in a reverse biased semiconductor device (e.g., a reverse biased junction between p-type and n-type semiconductor materials) wherein reverse current increases rapidly for a small increase in reverse applied voltage, and the device behaves as if it had negative electrical resistance.
CAPACITOR
A component used in electrical and electronic circuits which stores a charge of electricity, usually for very brief periods of time, with the ability to rapidly charge and discharge. A capacitor is usually considered a passive component since it does not rectify, amplify, or switch and because charge carriers do not undergo energy level changes therein, although some active solid state devices function as voltage variable capacitors.
CHANNEL
A path for conducting current between a source and drain of a field effect transistor.
CHANNEL STOP
Means for limiting channel formation in a semiconductor device by surrounding the affected area with a ring of highly doped, low resistivity semiconductor material. In a field effect transistor, it is a region of highly doped material of the same type as the lightly doped substrate used to prevent leakage paths along the chip surface from developing. Also referred to as "chanstop."
CHANNEL PINCH-OFF REGION
The location in a current channel portion of a field effect transistor (FET) where the current is reduced to a minimum value due to its diameter being reduced to a minimum.
CHARGE CARRIER
A mobile conduction electron or hole in a semiconductor.
CHARGE CONFINEMENT
Restriction of electrical charge carriers (e.g., electrons or holes) to specified locations (e.g., by quantum wells, gate electrode potentials, etc.).
CHARGE INJECTION DEVICE
A field effect device in which storage sites for packets of electric charge are induced at or below the surface of an active solid-state device by an electric field applied to the device and wherein carrier potential energy per unit charge minima are established at a given storage site and such charge packets are injected into the device substrate or into a data bus. This type device differs from a charge transfer device in that, in the latter, charge is transferred to adjacent charge storage sites in a serial manner, whereas, in a charge injection device, the charge is injected in a nonserial manner to the device substrate or to a data bus.
CHIP
A single crystal substrate of semiconductor material on which one or more active or passive solid-state electronic devices are formed. A chip may contain an integrated circuit. A chip is not normally ready for use until packaged and provided with external connectors.
CHIP CARRIER
A package with terminals, for solid-state electronic devices, including chips which facilitates handling of the chip during assembly of the chip to other electronic elements.
CLADDING BARRIER
A higher band gap material which encases a lower band gap material that defines the walls of a quantum well.
COHERENCE LENGTH
The typical distance an electron can travel before it is scattered (e.g., by a phonon, a defect, or an impurity, etc.).
COHERER
A term which encompasses both active and passive type devices, the passive type being a resistor whose resistance decreases when subjected to a high frequency signal, and the active type being a rectifier which is made up of active solid-state particles which conduct and rectify current when connected into a cohesive element but which loses that characteristic when the particles are separated (e.g., by shaking a container in which the particles are located, etc.).
COLLECTOR DIFFUSION ISOLATION (CDI)
An electrical isolation technology used for bipolar devices which employs an epitaxial layer, which forms transistor base regions, laid on a substrate of the same conductivity type (p or n) as the epitaxial layer, with an opposite conductivity type region, more heavily doped than the epitaxial base layer and located between the layer and the substrate, forming the collector and isolating the transistor from the substrate.
COMPOUND SEMICONDUCTOR
A semiconductor composed of a chemical compound formed of elements from two or more different groups of the chemical periodic chart (e.g., Group III (B, Al, Ga, In) and Group V (N, P, As, Sb) for the following compounds: AlP, AlAs, AlSb, GaP, GaAs, GaSb, InP, InAs, and InSb, or a compound of silicon and carbon (SiC)).
CONDUCTION BAND
A partially filled energy band in which electrons can move freely, permitting a material to carry electric current where electrons are the current carriers.
CONDUCTION ELECTRONS
In a conductor or n-type semiconductor, outer shell electrons that are bound so loosely that they can move freely in the conduction band of a solid material under the influence of an electric field.
CONNECTOR AREA
That portion of the electrical conductors (e.g., bonding pad, die bond, etc.) used for providing external electrical connections from a component to a chip or other component.
CONTACT
The point or part of a conductor which touches another electrical conductor or electrical component to carry electrical current to or from the conductor or electrical component.
CRYSTAL DEFECT
Any nonuniformity in a crystal lattice. There are four categories of crystal defects: (a) point defects, (b) line defects, (c) area defects, and (d) volume defects. Point defects include any foreign atom at a regular lattice site (i.e., substitutional site) or between lattice sites (i.e., interstitial site), antisite defects in compound semiconductors (e.g., Ga in As or As in Ga), missing lattice atoms, and host atoms located between lattice sites and adjacent to a vacant site (i.e., Frenkel defects). Line defects, also called edge or screw dislocations, include extra planes of atoms in a lattice. Area defects include twins or twinning (i.e., a change in crystal orientation across a lattice) and grain boundaries (i.e., a transition between crystals having no particular positional orientation to one another). Volume defects include precipitates of impurity or dopant atoms caused by volume mismatch between a host lattice and precipitates.
DEEP DEPLETION
The condition in which a depletion layer formed in a MOS active device due to voltage applied to the gate electrode of the device is deeper than the maximum depth at which inversion would normally be expected to occur at room temperature in a semiconductor device at the surface closest to the gate electrode, without formation of an inversion layer.
DEEP LEVEL CENTERS
Energy levels that can act as traps located in the forbidden band of a semiconductor material that are not near the conduction or valence band edges.
DEGENERATION
Doping of a semiconductor to such an extent that the Fermi level lies within the conduction band (i.e., N+ semiconductor) or within the valence band (i.e., P+ semiconductor). Also, in circuit applications, negative feedback between two or more active solid-state devices.
DEPLETION MODE
The operation of a field effect transistor having appreciable channel conductivity for zero gate-source voltage and whose channel conductivity may be increased or decreased according to the polarity of the applied gate-source voltage, by changing the gate-to-source voltage from zero to a finite
value, resulting in a decrease in the magnitude of the drain current.
DEPLETION REGION
The region extending on both sides of a reverse biased semiconductor junction in which free carriers are removed from the vicinity of the junction. It is also called a space charge region, a barrier region, or an intrinsic semiconductor region.
DEVICE (ACTIVE)
The physical realization of an individual electrical element in a physically independent body which cannot be further divided without destroying its stated function. Examples are transistors, pnpn structures, and tunnel diodes.
DIE
A tiny piece of semiconductor material, separated from a semiconductor slice, on which one or more active electronic components are formed. Sometimes called a chip.
DIE BOND
Attachment of a semiconductor chip to a substrate or chip carrier or package, usually with an epoxy, eutectic, or solder alloy.
DIFFUSED JUNCTION
A junction between two different conductivity regions within a semiconductor and which is formed by diffusion of appropriate impurity atoms into the material.
DIFFUSION BARRIER
An obstacle to the diffusion of atoms in a metallization scheme for an active solid-state device.
DIODE ISOLATION
A technique in which a high electrical resistance between an integrated circuit element and its substrate is achieved by surrounding the element with a reverse biased pn junction.
DIP (DUAL IN-LINE PACKAGE)
A chip carrier or package consisting of a plastic or ceramic body with two rows of vertical leads in which a semiconductor integrated circuit is assembled and sealed. The leads are typically inserted into a circuit board and secured by soldering.
DIRECT BAND GAP SEMICONDUCTOR
A semiconductor in which an electron transition from the conduction to the valence band, or vice versa, does not require a change in crystal momentum for electrons. Gallium arsenide is an example of a direct band gap semiconductor.
DISORDERED
Crystalline arrangement in which the different constituent atoms of a compound semiconductor randomly occupy lattice sites.
DISLOCATION
A line defect in a crystal, either of the edge type or screw type, in which the atoms are not arranged in a perfect latticelike structure. See CRYSTAL DEFECT for other examples of crystalline defects.
DMOSFET
Depletion-type metal oxide semiconductor field effect transistor. Such devices are normally in the on condition with no applied gate voltage.
DONOR IMPURITY
An element which when added to a semiconductor provides unbound or free electrons to the semiconductor which may serve as current carriers. Typically, donors are atoms which have more valence electrons than the atoms of the semiconductor material into which they are introduced in small quantities as an impurity or dopant. Since such donor impurities have more valence electrons than the semiconductor, a semiconductor doped with donor impurities is an n-type semiconductor.
DOPANT
An impurity added from an external source to a material by diffusion, coating, or implanting into a substrate, such as changing the properties thereof. In semiconductor technology, an impurity may be added to a semiconductor to modify its electrical properties or to a material to produce a semiconductor having desired electrical properties. N-type (negative) dopants (e.g., such as phosphorus for a group IV semiconductor) typically come from group V of the periodic table. When added to a semiconductor, n-type dopants create a material that contains conduction electrons. P-type (positive) dopants (e.g., such as boron for a group IV semiconductor) typically come from group III and result in conduction holes (i.e., vacancies in the electron shells).
DOPING OF SEMICONDUCTOR
Adding controlled amounts of conductivity modifying material, referred to as electrically active dopant or impurity, to a semiconductor material or to a material to produce a
semiconductor having desired electrical properties for this class.
DOPING PROFILE
The point to point concentration throughout a semiconductor of an impurity atom doped into the semiconductor.
DOUBLE-DIFFUSED MOS (DMOS)
A metal oxide semiconductor having diffused junctions in which successive diffusions of different impurity types are made in the same well-defined region of the semiconductor.
DRAIN
The electrode of a field effect transistor which receives charge carriers which pass through the transistor channel from the source electrode.
DUAL GUARD-BAND ISOLATION
A type of electrical isolation of functional elements of an integrated circuit comprised of two distinct unused areas of chip surface area adjacent to the elements desired to be electrically isolated.
DYNAMIC RANDOM ACCESS MEMORY (DRAM)
Solid-state memory in which the information decays over time and needs to be periodically refreshed.
ELECTROMIGRATION
Mass transport of ions (i.e., usually metal) in a material as a response to the passage of current through the material by momentum exchange between thermally activated ions and conduction electrons.
ELECTRON-HOLE PAIR
A positive charge carrier (i.e., hole) and a negative charge carrier (i.e., electron) considered together as being created or destroyed as part of one and the same event.
ENHANCEMENT MODE
The operation of a field effect transistor which has a channel formed therein between its source and drain regions and which normally does not conduct current through its channel with zero voltage applied to its gate electrode. Voltage of the correct polarity will accumulate minority carriers in the channel to permit conduction of current in the channel, thus turning on the transistor.
EPITAXIAL LATERAL OVERGROWTH
Process of epitaxial deposition through an exposed opening in an insulating layer with deposition continuing epitaxially over the insulating layer laterally from the opening.
EPITAXY
The controlled growth of a single crystal of one material on the surface of a crystal of the material (i.e., homo) or onto another substance (i.e., hetero) so that the crystal lattice of the base material controls the orientation of the atoms in the grown single crystal layer.
ESAKI DIODE
A heavily doped pn-junction diode where conduction occurs through the junction potential barrier due to a quantum mechanical effect even though the carriers which tunnel through the potential barrier do not have enough energy to overcome the potential barrier. Esaki tunneling involves a tunneling barrier formed by a macroscopic depletion layer between n-type and p-type regions. It does not involve a resonant tunneling barrier using controlled quantum confinement, a layer located between junctions, nor a thin superlattice layer.
EXTRINSIC SEMICONDUCTOR
A semiconductor whose charge carrier concentration and, therefore, electrical properties depend on impurity atoms introduced therein.
FACE BONDED
A chip mounting technique wherein semiconductor chips are provided with small mounting pads, turned face down, and bonded directly to conductors on a substrate.
FIELD EFFECT TRANSISTOR (FET)
A unipolar transistor in which current carriers are injected at a source terminal and pass to a drain terminal through a channel of semiconductor material whose conductivity depends largely on an electric field applied to the semiconductor from a control electrode. There are two main types of FETs, a junction FET and an insulated-gate FET. In the junction FET, the gate is isolated from the channel by a pn-junction. In an insulated-gate FET, the gate is isolated from the channel by an insulating layer so that the gate and channel form a capacitor with the insulating layer as the capacitor dielectric.
FIELD OXIDE
A thin (on a macroscopic scale) film made of an oxide of a material which overlies a device substrate to reduce parasitic capacitive coupling between conductors overlying the oxide and the substrate or devices below the oxide layer
(e.g., in the substrate). See bird's beak.
FLIP-CHIP
A term which describes the situation wherein a semiconductor device which has all terminations on one side thereof in the form of bump contacts, has a passivated surface, and has been flipped over and attached to a matching substrate.
FLOATING DIFFUSION
A region of a semiconductor device in which impurity atoms have been doped and which is electrically floating, that is, has no direct electrical connection.
FLOATING GATE
A gate electrode that is electrically floating, that is, has no direct electrical connection.
FORBIDDEN ENERGY BAND
The energy band of a material which is located between a solid material's conduction and valence bands. It is defined by the amount of energy that is needed to release an electron from its valence band to its conduction band. Electrons cannot exist in this gap. They are either below it, and bound to an atom, or above it, and able to move freely.
FRAME TRANSFER CCD
A charge coupled device area imager array with a separate image area, storage area, and read-out register area, the storage area being located between the image area and the readout area. This is distinguished from an interline- transfer CCD in which the sensing and storage/readout function areas are located next to each other.
GATE
The control electrode or control region that exerts an effect on a semiconductive region directly associated therewith, such that the conductivity characteristic of the semiconductor region is altered in a temporary manner, often resulting in an on-off type switching action. The control electrode or control region of a field effect transistor is located between the source and drain electrodes, and regions thereof.
GATE ARRAY
A repeating geometric arrangement of groups of active solid-state devices, each group being connectable into a logic circuit, in one integrated, monolithic semiconductor chip.
GATE CONTROLLED DIODE
A three terminal semiconductor diode with the ability to be turned on or off by a pulse applied to its gate electrode.
GETTERING
The elimination or reduction of unwanted constituents (i.e., impurities) or defects from a substrate.
GRAPHOEPITAXY
The growth of a single crystalline layer across the surface of a nonsingle crystalline substrate by commencing growth at a seeding portion/region thereof.
GUNN DIODE
A diode in which electrons under the influence of sufficiently high electric fields are transferred between energy valleys of different momentum in the conduction band of the active semiconductor device material or holes under the influence of sufficiently high electric fields are transferred between energy valleys of different momentum in the valence band of the active semiconductor device material. A Gunn diode does not normally have a pn junction and cannot be used as a rectifier.
GUNN EFFECT
An intervalley transfer effect wherein electrons under the influence of sufficiently high electric fields are transferred between energy valleys of different momentum in the conduction band of the active semiconductor device material, or holes under the influence of sufficiently high electric fields are transferred between energy valleys of different momentum in the valence band of the active semiconductor device material.
HALL EFFECT DEVICE
An active solid-state device in which a current is flowing and is in a magnetic field perpendicular to the current, and in which a voltage is produced that is perpendicular to both the current flow direction and the magnetic field direction.
HETEROJUNCTION/HETEROINTERFACE
An interface between two dissimilar semiconductor materials. For example, one material may by InAs and the other may be InAlAs, or one material may be GaAs and the other material may be GaAlAs.
HIGH ELECTRON MOBILITY TRANSISTOR (HEMT)
A heterojunction field effect transistor with impurity ions located on the side of the heterojunction with lower affinity for the charge carriers (holes or electrons) injected at the
source that pass to the drain via a channel adjacent the heterojunction.
HOLE
An empty energy level in the valence band of a semiconductor crystal which exhibits properties of a real particle and can act as a mobile positive-charge carrier.
HOMOJUNCTION
An interface between regions of opposite polarity in the same semiconductor material.
HOT CARRIER DIODE
A diode in which electrons (or holes) have energies greater than those that are in thermal equilibrium with the material of at least one of the regions forming the diode. Schottky barrier diodes typically have "hot carriers" (hot electrons) injected into the metal from the semiconductor.
HYBRID CIRCUIT
A small printed circuit having miniature components which may include passive components (resistors, capacitors, and inductors) deposited on a printed circuit board.
IMPURITY
A foreign material present in a semiconductor crystal, such as boron or arsenic in silicon, which is added to the semiconductor to produce either p-type or n-type semiconductor material, or to otherwise result in material whose electrical characteristics depend on the impurity dopant atoms.
INDIRECT BAND GAP SEMICONDUCTOR
A semiconductor material in which a change in semiconductor crystal momentum for an electron is required when it moves from the conduction band to the valence band and vice versa. Silicon and aluminum arsenide are examples of indirect band gap semiconductors.
INSULATED-GATE FIELD EFFECT TRANSISTOR (IGFET)
A unipolar transistor with source, gate, and drain regions and electrodes, in which conduction takes place in a channel controlled by action of the voltage applied to the gate electrode of the device, in which the gate electrode is separated from the channel by an insulator layer.
INSULATOR
A material which has a high resistance to the flow of electric current. It has such low electrical conductivity
that the flow of current therethrough can usually be neglected.
INTRINSIC CONCENTRATION
The number of minority carriers in a semiconductor due to thermal generation of electron-hole pairs.
INVERSION
A condition in a semiconductor material in which the concentration of minority carriers exceeds the concentration of majority carriers.
INVERSION LAYER/CHANNEL
A region in a semiconductor material in which the concentration of minority carriers exceeds the concentration of majority carriers.
ISOELECTRONIC
A condition in which two constituents have the same number of valence electrons.
ISOLATION
The separation or surrounding of active semiconductor regions or components with electrically insulative regions to prevent the flow of electrical current between the active semiconductor regions or between electronic component parts of a solid-state electronic device.
ISOPLANAR CMOS
A semiconductor device in which relatively thick regions of silicon dioxide, recessed into the semiconductor surface, are used to electrically isolate device areas and prevent parasitic device formation. More commonly called LOCOS CMOS.
ISOPLANAR ISOLATION
A type of electric isolation in which relatively thick regions of silicon dioxide, recessed into the semiconductor surface, are used to electrically isolate device areas and prevent parasitic device formation. More commonly called LOCOS ISOLATION.
JUNCTION BARRIER
The opposition to the diffusion of majority carriers across a pn junction due to the charge of the fixed donor and acceptor ions.
JUNCTION CAPACITANCE
The capacitance across a pn junction. It depends on the width of the depletion layer, which increases with increased reverse bias voltage across the junction.
JUNCTION ISOLATION
Electrical isolation of devices on a monolithic integrated circuit chip using a reverse biased junction diode to establish a depletion layer that forms the electrical isolation between devices.
JUNCTION RESISTANCE
The electrical resistance across a semiconductor PN junction.
LAND
The conductive areas, normally metal patterns, on a semiconductor integrated circuit, which form part of the contacts and interconnections between components on the integrated circuit. See bonding pad, die bond.
LIFT-OFF
Process for the removal of unwanted deposited material from a substrate (and thus patterning the same) by the dissolution of an intermediate layer and the commitant physical separation of the overlying deposited material.
LUMINESCENCE
The emission of visible or invisible radiation unaccompanied by high temperature by any substance as a result of absorption of exciting energy in the form of photons, charged particles, or chemical change. It is a general term which includes fluorescence and phosphorescence. Types include hemiluminescence, bioluminescence, photoluminescence, electroluminescence, photoluminescence, and triboluminescence. Active solid-state luminescent devices are semiconductors which operate via injection luminescence. Active devices include pn junctions (including heterojunctions), Schottky barrier junctions, metal-insulator-semiconductor (MIS) structures, and high speed traveling domains (e.g., Gunn domain and acoustoelectric wave generated domains). Passive solid-state electroluminescent devices (phosphors) are insulators which operate in an intrinsic luminescence phenomena (i.e., where an applied electric field generates free carriers) to initiate the light emission mechanism, there being no free carriers in an insulator to be accelerated by an applied field unless the field also generates them.
MAJORITY CARRIER
The predominant charge carrier in a semiconductor. Electrons are majority carriers in n-type semiconductors. Holes are
majority carriers in p-type semiconductors.
MASTERSLICE ARRAY/MASTERCHIP
A substrate that contains active and passive electronic components in a predetermined pattern which may be connected into different logic or analog circuits.
MBM JUNCTION
Active solid-state devices having metal-barrier-metal layer junctions.
METAL-OXIDE SEMICONDUCTOR FIELD EFFECT TRANSISTOR (MOSFET)
See Insulated-gate Field Effect Transistor.
METALLIZATION
Process of coating (a) metal or (b) other material which is identified as having the conductive characteristic of a metal onto a semiconductor or a substrate containing semiconductor regions to form electrodes, contacts, interconnects, bonding pads, or heat sinks and also including formation of conductive material by doping of nonconductive material.
MIM DIODE
A junction diode with a thin insulating layer of material sandwiched between two metallic surface layers which operates as a tunneling (direct or Fowler-Nordheim type) diode.
MINORITY CARRIER
The less predominant charge carrier in a semiconductor. In a p-type semiconductor, minority carriers are electrons, whereas in n-type semiconductor material, minority carriers are holes.
MIS
Acronym for metal-insulator-semiconductor. Typically active solid-state devices with MIS technology have a silicon dioxide layer formed on a single crystal silicon substrate. A polysilicon conductor layer is formed on the oxide.
MOBILITY
The facility with which carriers move through a semiconductor when subjected to an applied electric field. Electrons and holes typically have different mobilities in the same semiconductor.
MODFET
Acronym for a modulation doped field effect transistor. A high speed semiconductor FET in which dopant atoms containing
semiconductor layers alternate with nondoped semiconductor layers, so that the carriers (electrons or holes) resulting from the dopant atoms can travel in the undoped material, so that there is little scattering of carriers from dopant atoms. Typically, the dopant atoms are in semiconductor material having a lower carrier affinity than the undoped layers to facilitate carrier spill over into the undoped layers. Such a structure may typically constitute a superlattice. See also High Electron Mobility Transistor.
MONOLITHIC DEVICE (E.G., IC, ETC.)
A device in which all components are fabricated on a single chip of silicon. Interconnections among components are provided by means of metallization patterns on the surface of the chip structure, and the individual parts are not separable from the complete circuit. External connecting wires are taken out to terminal pins or leads.
MSM
Acronym for metal-semiconductor-metal semiconductor device. Active solid-state semiconductor devices having a semiconductor layer sandwiched between two layers of metal and forming back-to-back Schottky diodes.
NEGATIVE RESISTANCE REGION
An operating region of an active solid-state electronic device in which an increase in applied voltage results in a decrease in output current.
NEGATIVE TEMPERATURE COEFFICIENT
The amount of reduction in a device parameter, such as capacitance or resistance, for each degree of device operating temperature.
NMOS
N-channel metal oxide semiconductor devices which use electrons as majority carriers.
NONDOPANT
An impurity added from an external source which does not modify the electrical properties of a semiconductor.
NPN TRANSISTOR
A bipolar transistor with n-type emitter and collector regions separated by a p-type base.
N-CHANNEL FET
A field effect transistor that has an n-type conduction channel.
N-TYPE SEMICONDUCTOR
An extrinsic semiconductor having n-type dopant atoms (e.g., atoms with one or more valence electron than the host atoms). Electron density exceeds hole density.
ORDERED
Crystalline arrangement in which different constituent atoms of a compound semiconductor occupy specific lattice sites resulting in long range regularity of the resultant structure.
OUTDIFFUSION
The solid-state diffusion of impurities from the underlying substrate into a deposited layer during the growth thereof.
PACKAGE
A container, case, or enclosure utilized in the context of semiconductor art for protecting a solid-state electronic device from the environment and which is considered a part of a manufacture product (i.e., as opposed to a package utilized for passage of a product through the channels of trade in a safe, convenient, and attractive condition).
PAD
A. The portion of a conductive pattern on a solid-state electronic device for making external connection thereto. B. The portion of a conductive pattern on a chip or a printed circuit board designed for mounting or attaching a substrate or solid-state active electronic device. See also bonding pad, die bond, etc.
PARASITIC DEVICES/CHANNELS
A. Junctions forming unintended interconnection of intended active solid-state devices. B. Devices which were not designed to carry current flow and which result from unintended interconnection of intended active solid-state devices.
PASSIVE DEVICE
A solid-state electronic device or component in which charge carriers do not change their energy levels and that does not provide rectification, amplification, or switching, but which does react to voltage and current. Examples are pure resistors, capacitors, and inductors.
P-CHANNEL
A conduction path, made of p-type semiconductor material, located between source and drain of a field effect device.
PHOTODIODE
A diode in which charge carriers are created by light which illuminates the diode junction. It is a photovoltaic as well as a photoconductive device.
PINCH-EFFECT RESISTOR
A monolithic integrated circuit resistor having a layer of one conductivity type, typically a P-layer formed at the same time as integrated circuit bipolar transistor base regions, which is thinned by an inset region of opposite conductivity type, typically an N-layer formed at the same time as integrated circuit bipolar transistor emitter regions.
PIN DIODE/DEVICE
A diode having an intrinsic semiconductor (i.e., one with no dopants) sandwiched between a p-type layer and an n-type layer. The depletion region (the intrinsic semiconductor layer) thickness can be tailored to optimize quantum efficiency for use as a photo diode or frequency response for use as a microwave diode.
PIN-GRID ARRAY
A semiconductor chip package having leads in the form of pins arranged in columns and rows.
PLANAR TRANSISTOR
A bipolar transistor in which the emitter base and collector regions terminate at the same plane surface without indentations in or protrusions from the surface. Hence, the emitter and base regions form dish-shaped portions extending into the semiconductor from the common surface.
PN-JUNCTION
The interface and region of transition between p-type and n-type semiconductors. See also barrier layer.
PN-JUNCTION DIODE
A semiconductor device having two terminals connected to opposite-type semiconductor materials with a junction therebetween and exhibiting a nonlinear voltage-current characteristic, usually used for switching or rectification.
PNP TRANSISTOR
A bipolar transistor with p-type emitter and collector regions separated by an n-type base.
POINT DEFECT
A crystal defect occurring at a point in a crystal. Examples include (a) a foreign atom incorporated into the crystal lattice at either a substitutional (regular lattice) site or interstitial (between regular lattice sites) site, (b) a missing atom in the lattice, or (c) a host atom located between regular lattice sites and adjacent to a vacancy (called a Frenkel defect). See CRYSTAL DEFECT for other examples of crystalline defects.
POLYSILICON
A polycrystalline form of silicon.
POTENTIAL BARRIER
The difference in electrical potential across a pn junction in a semiconductor. See also barrier layer.
POTTING
An embedding process in which an electronic component is placed in a can, shell, or other container and buried in a fluid dielectric which subsequently is hardened material. Even though the container is not removed from the finished part, this is considered a molding operation since the fluid is confined to a definite shape during hardening.
PRINTED CIRCUIT BOARD
A structure formed on one or more layers of electrically insulating material having electrical terminals and conductive material deposited thereon, in continuous paths, from terminal to terminal, to form circuits for electronic apparatus such as chips or substrates.
P-TYPE
An extrinsic semiconductor in which the hole density exceeds the conduction electron density.
PUNCHTHROUGH
Expansion of a depletion region* from one junction to another junction in an active solid-state device.
QUANTUM TRANSISTOR
Transistors whose operation is based on the properties of electrons confined in quantum wells - semiconductor films only a hundred or so angstroms thick sandwiched between high confining walls made of a second semiconductor material.
QUANTUM WELL
Semiconductor films only a hundred or so angstroms thick sandwiched between high confining walls made of a second material.
RECOMBINATION
The process by which excess holes and electrons in a semiconductor crystal recombine and no longer function as charge carriers in the semiconductor. Basic recombination processes are band-to-band recombination which occurs when an electron in the conduction band recombines with a hole in the valence band, and trapping recombination which occurs when an electron or hole is captured by a deep energy level, such as produced by a deep level dopant, before recombining with an opposite conductivity-type carrier.
RESISTIVITY
A measure of the resistance of a material to electric current. Resistivity is a bulk material property measured in ohm-cm.
RESONANT TUNNELLING DEVICE
A device that works on the principle of resonant electron (or hole) tunneling through a pair of matched potential barriers. This occurs when the energy of the electrons (or holes) matches that of a quantum energy level in the quantum well formed between the barriers.
SEMICONDUCTOR
A. A generic term for (1) a substance or material whose electronic conductivity at ordinary temperature is intermediate between that of a metal and an insulator and whose conductivity is capable of being modified by the addition of a dopant or (2) an electronic device the main functioning parts are made from semiconductor materials.
B. For the purposes of Class 438, a semiconductor material (1) must have resistivity between that of an insulator and a conductor and (2) be intended for use in a solid state device for at least one of the following purposes: (a) conducting or modifying an electrical current, (b) storing electrical energy for subsequent discharge, or (c) converting electromagnetic wave energy to electrical energy or electrical energy to electromagnetic energy. The resistivity is commonly changed by light, heat, or electric or magnetic fields incident on the material.
SEMICONDUCTOR JUNCTION
The region of transition, which usually exhibits asymmetric conductivity, between two joined semiconductors of different electrical properties or of joined semiconductor and conductor (e.g., metal, etc.) and which is also referred to in the art as a barrier layer. Types of junctions include heterojunctions, Schottky barrier junctions, and PN junctions.
SILICON ON INSULATOR (SOI)
A semiconductor structure using an insulating substrate, instead of silicon as a substrate material, with an overlying active layer of single crystal silicon containing active solid state devices. The substrate may typically be of the form of an insulating layer which is itself formed on a single crystal substrate.
SILICON ON SAPPHIRE (SOS) CMOS
A complementary metal oxide semiconductor device (e.g., a transistor) wherein single crystal silicon is grown on a passive insulating base of sapphire (single crystal alpha phase aluminum oxide) with complementary MOS transistors formed in the silicon in one or more island portions.
SINGLE CRYSTAL
A body of material having atoms regularly located at periodic lattice sites throughout.
SINKER
A buried electrically conductive, low resistance path in an integrated circuit which connects an electrical contact to a conductive region buried in the integrated circuit. It may be made up of a heavily doped impurity region.
SOLID-STATE DEVICE
An electronic device or component that uses current flow through solid (as opposed to liquid), gas, or vacuum materials. Solid-state devices may be active or passive.
SOURCE
In a field effect transistor, the active region/electrode to which the source of charge carriers is connected.
SPACE CHARGE REGION
The region around a pn junction in which holes and electrons recombine to leave no mobile charge carriers and a net charge density due to the residual dopant ions.
SPIKING
Phenomena associated with electromigration wherein a fingerlike protrusion of a metallization layer is allowed to grow through a dielectric layer and eventually contact a further layer.
SUBSTRATE
A. A base upon which a coating is formed. See the class definition for the requirements for coating, per se, or
etching, per se, when a base of semiconductor or containing a semiconductive region is the substrate. B. The supporting material on or in which the components of an integrated circuit are fabricated or attached.
SUPERLATTICE
A periodic sequence of variations in carrier potential energy in a semiconductor, of such magnitude and spacing that the current carrier wave function is spread out over many periods, so that carrier energy and other properties are determined in part by the periodic variations. The variation may be in chemical composition of the material, as in a sequence of heterojunctions, or in impurity concentration, forming a doping superlattice, or both.
SURFACE MOUNT DEVICES
Active or passive solid-state devices which are structured and configured to be mounted directly to a printed circuit board surface. This type of mounting is distinguished from "through-hole" mounting which involves the electrical and physical connection of devices to a printed circuit board using drilled and plated holes through the conductive pattern of the board.
SURFACE RESISTIVITY
The resistance of a material between two opposite sides of a unit square of its surface. Also called Sheet Resistance. Measured in ohms, often written as "ohms per square" in this case.
THERMISTOR
A thermoelectric device whose electrical resistance varies with temperature. Its temperature coefficient of resistance is high, nonlinear, and usually negative.
THIN-FILM
A material on a substrate with a thickness not greater than 10 microns and uniformity within 20% of it's average value (Grant and Hackh's Chemical Dictionary, 5th Edition, edited by Roger & Claire Grant, McGraw-Hill, Inc., 1987, page 235).
THICK-FILM DEVICES
Printed thin-film circuits. Silk screen printing techniques are used to make the desired circuit patterns on a ceramic substrate. Active devices may be added thereto as separate devices (see HYBRID CIRCUIT).
THIN-FILM DEVICES
Solid-state electronic devices which are constructed by depositing films of conducting material on the surface of
electrically insulating bases.
THYRISTOR
A four layer p-n-p-n bistable switching device that changes from an off or blocking state to an on or conducting state which uses both electron and hole-type carrier transport.
TRANSFERRED ELECTRON DEVICE
See GUNN EFFECT. In such devices, advantage is taken of the negative differential mobility of electrons or holes in certain semiconducting compounds, particularly GaAs or InP.
TRANSISTOR
An active solid-state semiconductor device having three or more electrodes in which the current flowing between two specified electrodes is modulated by the voltage or current applied to one or more specified electrodes, and is capable of performing switching or amplification. May be of unipolar type (i.e., field effect transistor) or bipolar type.
TRAPATT DEVICE
An acronym for trapped plasma avalanche triggered transit diodes, which are biased into avalanche condition. As the diode breaks down, a highly conducting electron-hole plasma quickly fills the entire n-type region, and the voltage across the diode drops to a low value. The plasma is then extracted from the diode by the low residual electric field, thus causing a large current flow even though the voltage is low. Once extraction of the plasma is completed, the current drops and the voltage rises.
TRENCH ISOLATION
Electrical isolation of electronic components in a monolithic integrated circuit by the use of grooves or other indentations in the surface of the substrate, which may or may not be filled with electrically insulative (i.e., dielectric) material.
TUNNEL DIODE
A semiconductor diode in which the electrons penetrate a quantum barrier that is impenetrable in terms of classical physics, but which is penetrable in terms of quantum physics due to the quantum mechanical uncertainty in position of current carriers.
TWO-DIMENSIONAL ELECTRON GAS
A description of the motion of electrons which are confined in only one direction, such as electrons in the conducting channel of a MOSFET. In an electron gas, the electrons move around without apparent restriction. The behavior of
electrons in conducting metals (e.g., copper) is an example of a three-dimensional electron gas. In a two dimensional electron gas, motion is restricted to a single plane (two dimensions). See also MODFET.
UNIPOLAR
An active solid-state electronic device in which only one type of charge carrier (i.e., positive holes or negative electrons) is used to support current flow.
VARACTOR
A semiconductor diode comprising a two terminal active device using the voltage variable capacitance of a pn junction or a Schottky junction that changes capacitance with a change in applied voltage.
VARISTOR
A varistor is a two-electrode active or passive semiconductor device with a voltage dependent nonlinear resistance which falls significantly as the voltage is increased. In an active device, the nonlinear property is due to the presence of one or more potential barriers. In a passive-type varistor, it is due to electrical heating of the material due to current flow therethrough. Varistors are to be contrasted with passive variable resistors such as rheostats or potentiometers.
VIA
A metallized or plated-through hole in an insulating layer, a semiconductor containing substrate or chip, or a printed circuit board which forms a conduction path itself without having a wire or lead inserted therethrough.
WAFER
A thin slice of semiconductor material with parallel faces used as the substrate for active solid-state devices in discrete or monolithic integrated circuit form.
WIRING CHANNEL
An area on an integrated circuit, such as a gate array, which is left free of active devices and in which interconnection metallization patterns are formed.
WORK FUNCTION
The minimum energy required to remove an electron from the Fermi level of a material and liberate it to free space outside the solid.
ZENER DIODE
A single pn junction, two terminal semiconductor diode reversed biased into breakdown caused by the Zener effect (i.e., by field emission of charge carriers in the device's depletion layer). NOTE: True Zener breakdown occurs in silicon at values below 6 volts. It is to be distinguished from the avalanche breakdown mechanism that occurs in reverse biased diodes at higher (about 6 volts) voltages.

HAVING BIOMATERIAL COMPONENT OR INTEGRATED WITH LIVING ORGANISM:
This subclass is indented under the class definition. Process for making an electrical device utilizing a semiconductor substrate which contains a component identical to material found in a living organism or is integrated with a living organism.

SEE OR SEARCH CLASS:
128, Surgery, for a method of treatment of a living body or organism.
429, Chemistry: Electrical Current Producing Apparatus, Product, and Process, subclass 2 for subject matter under the class definition having living matter (e.g., microorganism, etc.).

HAVING SUPERCONDUCTIVE COMPONENT:
This subclass is indented under the class definition. Process for producing an electrical device utilizing a semiconductor substrate having an electrically conductive component which at temperatures of less than or equal to 30K is able to conduct electricity in the absence of resistance.

SEE OR SEARCH CLASS:
29, Metal Working, 25.01 for manufacturing a nonsemiconductor-type barrier layer device and subclass 599 for a method of mechanical manufacture of a superconductor electrical device.
257, Active Solid-State Devices (e.g., Transistors, Solid-State Diodes), 30 for an active solid-state device in which the active layer through which carrier tunnelling occurs has a lower conductivity than the material adjacent thereto, especially subclasses 31+ for Josephson junction
devices, and subclasses 661+ for a superconductive contact or lead.
331, Oscillators, subclass 107 for superconductive element and tunnelling element oscillators.
427, Coating Processes, 62 for a process of coating, per se, wherein the product is a superconductive electrical device.
505, Superconductor Technology: Apparatus, Material, Process, particularly subclass 330 for a process of manufacturing a semiconductor electrical device having a superconductive component possessing an operating temperature greater than 30K and subclass 923 for a process of making a semiconductor electrical device having a superconductive component possessing an operating temperature of less than 30K.

HAVING MAGNETIC OR FERROELECTRIC COMPONENT:
This subclass is indented under the class definition. Process for making an electrical device wherein the semiconductor substrate has integral therewith a component with recited magnetic or ferroelectric properties.

SEE OR SEARCH THIS CLASS, SUBCLASS:
48 for a process of manufacturing an electrical device or circuit utilizing a semiconductor substrate, said device or circuit being responsive to an external magnetic signal.

SEE OR SEARCH CLASS:
257, Active Solid-State Devices (e.g., Transistors, Solid-State Diodes), subclass 295 for an insulated gate field effect transistor having a ferroelectric material layer.
427, Coating Processes, 127 for coating a magnetic base or coating a base with a magnetic material.

REPAIR OR RESTORATION:
This subclass is indented under the class definition. Process for the renewal, reconstruction, or refurbishment of the previously possessed electrical or mechanical properties of a semiconductor electrical device which have become degraded.
(1) Note. This subclass includes patents to a process of removing and replacing a defective chip from a package as well as a process of repair of defective electrical conduct paths (e.g., wirings).

INCLUDING CONTROL RESPONSIVE TO SENSED CONDITION:
This subclass is indented under the class definition. Process including the step of regulating an operation by detecting a characteristic or a change in a characteristic of the process or the semiconductor substrate acted upon and by implementing an action in the process based upon the detected characteristic or change therein.
(1) Note. There must be a positive action carried out in response to the detected characteristic or change therein which furthers the semiconductor substrate toward its subsequent indented utilization. Thus, the removal of defective devices or substrates from a manufacturing process flow (e.g., by sorting, etc.) or the identification of same (e.g., by inking, etc.) is not deemed to be a positive action proper for this subclass.

SEE OR SEARCH CLASS:
209, Classifying, Separating, and Assorting Solids, especially 552 for methods sensing a condition of an item and controlling the separation in accordance therewith.
340, Communications: Electrical, for control responsive indicating systems not having structural details, especially subclass 653 for electronic circuit or component and subclasses 657+ for electrical characteristic.
364, Electrical Computers and Data Processing Systems, 184 for testing of process control systems.
365, Static Information Storage and Retrieval, subclass 201 for testing of memory systems.
377, Electrical Pulse Counters, Pulse Dividers or Shift Registers: Circuits and Systems, 28 for error checking of pulse counters.
714, Error Detection/Correction and Fault Detection/Recovery, appropriate subclasses for diagnostic testing, per se, particularly 100 for reliability and availability, fault recovery, locating and avoidance, diagnostic testing or monitoring of a digital processing system for reliability purpose.

Interconnecting plural devices on semiconductor substrate:
This subclass is indented under subclass 5. Process for electrically connecting multiple electrical devices on a monolithic semiconductive substrate to establish a desired circuit pattern (e.g., wiring, etc.).

SEE OR SEARCH THIS CLASS, SUBCLASS:
128 for a process of forming an array of electrical devices and selectively interconnecting the devices to produce a desired electrical circuit.

Optical characteristic sensed:
This subclass is indented under subclass 5. Process wherein the sensed condition is an optical property of the device or an optical property of the process.
(1) Note. Optical aligning, per se, is not deemed to be a control responsive operation for the purposes of this subclass.

SEE OR SEARCH CLASS:
348, Television, 86 for manufacturing wherein a picture signal generator (i.e., television camera) is utilized for monitoring a manufacturing operation.
356, Optics: Measuring and Testing, for optical alignment processes.
382, Image Analysis, for methods for the automated analysis of an image or recognition of a pattern, including measuring significant characteristics of the image or pattern.

Chemical etching:
This subclass is indented under subclass 7. Process having a step of chemically etching the semiconductor substrate in conjunction with the sensing of an optical property of the process or of the semiconductor device.

Plasma etching:
This subclass is indented under subclass 8. Process wherein the chemical etching step utilizes an ionized chemically reactive gas to etch the semiconductor substrate.

Electrical characteristic sensed:
This subclass is indented under subclass 5. Process wherein the sensed condition is an electrical property of the device or an electrical property of the process.

SEE OR SEARCH CLASS:
209, Classifying, Separating, and Assorting Solids, especially 571 for methods of electrical testing thereby sensing a property of an item to facilitate subsequent separation.

Utilizing integral test element:
This subclass is indented under subclass 10. Process wherein the electrical property is sensed utilizing a specific test structure integral to the semiconductor substrate and which has no other function in the completed device.

SEE OR SEARCH CLASS:
257, Active Solid-State Devices (e.g., Transistors, Solid-State Diodes), subclass 48 for test or calibration structures provided on active solid-state devices to permit or facilitate the measurement, test, or calibration of the characteristics of the devices.

And removal of defect:
This subclass is indented under subclass 10. Process wherein a defect detected by the electrical sensing step is thereafter removed.

SEE OR SEARCH THIS CLASS, SUBCLASS:
4 for a process of repairing or restoring the previously possessed electrical or mechanical properties of a semiconductor electrical device which have become degraded.

Altering electrical property by material removal:
This subclass is indented under subclass 10. Process whereby following or as a result of the electrical sensing step, an electrical property of the semiconductor substrate is altered by a material removal step (e.g., by etching).

WITH MEASURING OR TESTING:
This subclass is indented under the class definition. Process having combined therewith a step of measuring or testing a condition of the process or of the device made thereby.
(1) Note. Processes having at least one step proper for the class and combined therewith a step of electrical aging or burn-in are classified herein.

SEE OR SEARCH CLASS:
209, Classifying, Separating, and Assorting Solids, especially 571 for methods of electrical testing thereby sensing a property of an item to facilitate subsequent separation.
250, Radiant Energy, 306 for inspection of solids or liquids by charged particles, and subclass 371 for invisible radiant energy responsive methods using semiconductor devices.
324, Electricity: Measuring and Testing, for per se electrical measuring, especially subclass 71.5 for determining a nonelectrical property of a semiconductor by measuring an electrical property, subclass 451 for determining a material property using thermoelectric phenomenon, subclasses 500+ for fault detecting in electrical circuits and of electrical components, and subclass 719 for semiconductor materials quality determination using conductivity effects.
374, Thermal Measuring and Testing, especially subclass 57 for thermal testing of susceptibility to thermally induced deterioration, flaw, etc., and subclass 178 for thermal measuring utilizing a barrier layer (e.g., semiconductive junction) sensing element.

Packaging (e.g., with mounting, encapsulating, etc.) or treatment of packaged semiconductor:
This subclass is indented under subclass 14. Process provided including (a) multiple operations having a step of permanently attaching or securing a semiconductive substrate to a terminal, elongated conductor or support (e.g., a mounting, housing, lead frame, discrete heat sink, etc.), (b) multiple operations having a step of shaping flowable plastic or flowable insulative material about a semiconductive substrate, or (c) a step of treating an already mounted or packaged semiconductor substrate (e.g., coating of flowable plastic or flowable insulative material about a semiconductor substrate by dipping, etc.).

Optical characteristic sensed:
This subclass is indented under subclass 14. Process wherein the sensed condition is an optical characteristic of the process or of the device made thereby.
(1) Note. Optical aligning per se is not deemed to be a measurement of an optical characteristic and as such would not bring original classification to this subclass solely based on that claimed feature.

SEE OR SEARCH CLASS:
348, Television, 86 for manufacturing wherein a picture signal generator (i.e., television camera) is utilized for monitoring a manufacturing operation.
356, Optics: Measuring and Testing, for optical alignment processes.
382, Image Analysis, especially 141, for a manufacturing process using image analysis, aligning images/masks, or pattern recognition.

Electrical characteristic sensed:
This subclass is indented under subclass 14. Process wherein the sensed condition is an electrical characteristic of the process or of the device made thereby.

SEE OR SEARCH CLASS:
324, Electricity: Measuring and Testing, for per se
electrical measuring, especially subclass 71.5 for determining a nonelectrical property of a semiconductor by measuring an electrical property, subclass 451 for determining a material property using thermoelectric phenomenon, subclasses 500+ for fault detecting in electrical circuits and of electrical components, and subclass 719 for semiconductor materials quality determination using conductivity effects.

Utilizing integral test element:
This subclass is indented under subclass 17. Process wherein the electrical property is sensed utilizing a specific test structure integral to the semiconductor substrate and which has no other function in the completed device.

SEE OR SEARCH CLASS:
257, Active Solid-State Devices (e.g., Transistors, Solid-State Diodes), subclass 48 for test or calibration structures provided on active solid-state devices to permit or facilitate the measurement, test, or calibration of the characteristics of the devices.

HAVING INTEGRAL POWER SOURCE (E.G., BATTERY, ETC.):
This subclass is indented under the class definition. Process for making a semiconductor electrical device having therewith an integral structure capable of chemically or radioactively generating electrical power.

SEE OR SEARCH CLASS:
136, Batteries: Thermoelectric and Photoelectric, subclass 202 for apparatus wherein nuclear energy other than that resulting from an induced nuclear reaction is used as a heat source for the generator or comprising a thermoelectric device designed to be employed as an ancillary unit in a nuclear reactor system.
310, Electrical Generator or Motor Structure, subclass 303 for the combination of a semiconductor junction and a radioactive source which radiates the semiconductor material and thus generates a source of current for an external load.
376, Induced Nuclear Reactions: Processes, Systems, and Elements, 320 for the direct conversion of the energy produced in a nuclear reaction into an electrical output by a one-step process or apparatus for accomplishing such one-step
process.
429, Chemistry: Electrical Current Producing Apparatus, Product, and Process, especially subclass 7 for a combination including a nonbattery electrical component electrically connected within a cell casing other than testing or indicating components.

ELECTRON EMITTER MANUFACTURE:
This subclass is indented under the class definition. Process for manufacturing a structure which gives off electrons into free space utilizing a semiconductor substrate.
(1) Note. Some materials may variously be conductive, semiconductive, or insulative. See section A. above for an expansion of what comprises a semiconductor substrate for the purposes of this class.

SEE OR SEARCH CLASS:
136, Batteries: Thermoelectric and Photoelectric, subclass 254 for a photoemissive photoelectric cell.
257, Active Solid-State Devices (e.g., Transistors, Solid-State Diodes), 10 for devices having a low workfunction layer for electron emission.
313, Electric Lamp and Discharge Devices, especially subclass 346 for cathodes containing or coated with electron emissive material, subclasses 499+ for subject matter under the class definition having semiconductor depletion layer-type luminescent material, and subclass 546 for photosensitive photocathodes.
427, Coating Processes, 74 for coating processes which result in a photoelectric or photovoltaic product (e.g., a photocathode) which is responsive to visible, infrared, or ultraviolet illumination by (a) emitting electrons, (b) generating an electromotive force, or by (c) varying electrical conductivity.
445, Electric Lamp or Space Discharge Component or Device Manufacturing, for a process of manufacturing a nonsemiconductive-type space discharge device.

MANUFACTURE OF ELECTRICAL DEVICE CONTROLLED PRINTHEAD:
This subclass is indented under the class definition. Process for manufacturing from a semiconductor substrate an electrical device utilized for the transfer to another surface of an imprint or mark which transfer is regulated by the electrical device.

SEE OR SEARCH CLASS:
29, Metal Working, subclass 890.1 for fluid pattern dispersion device manufacture (e.g., ink jet manufacture).
347, Incremental Printing of Symbolic Information, 1 for ink jet marking apparatus, subclasses 159+ for electrical discharge marking apparatus, subclasses 163+ for electrochemical marking apparatus, and subclasses 171+ for thermal marking apparatus.

MAKING DEVICE OR CIRCUIT EMISSIVE OF NONELECTRICAL SIGNAL:
This subclass is indented under the class definition. Process for making a semiconductor electrical device or circuit which is emissive of a nonelectrical output during operation.
(1) Note. The nonelectrical signal serving as input stimulus to the device or circuit may be described as an information carrying wave.

SEE OR SEARCH CLASS:
257, Active Solid-State Devices (e.g., Transistors, Solid-State Diodes), subclass 13, 79 through 103, and 918 for incoherent light emitting injection luminescent devices.
372, Coherent Light Generators, for coherent light emissive devices, in particular subclasses 43-50 for a semiconductive laser device and subclass 75 for semiconductor optical laser pump devices.
430, Radiation Imagery Chemistry: Process, Composition, or Product Thereof, 311 for electrical device manufacture involving photolithography, and subclass 321 for nonelectro-optic device manufacture involving photolithography.

Having diverse electrical device:
This subclass is indented under subclass 22. Process for manufacturing a circuit composed of a plurality of electrical
devices integrated on a common substrate or chip of monolithic construction, at least one of the devices being emissive of nonelectrical signal.

Including device responsive to nonelectrical signal:
This subclass is indented under subclass 23. Process for making a circuit comprising a combination of a device emissive of nonelectrical signal and a device responsive to nonelectrical signal integrated onto a common substrate or chip of monolithic or hybrid construction.

SEE OR SEARCH CLASS:
65, Glass Manufacturing, especially 406 for process of glass bonding an optical fiber to a substrate.
250, Radiant Energy, subclass 551 for signal isolators, including optically coupled light emitters and semiconductor light receivers.
257, Active Solid-State Devices (e.g., Transistors, Solid-State Diodes), subclasses 80-85 for an incoherent light emitter coupled to an active solid-state light responsive device, per se.
372, Coherent Light Generators, for coherent light emissive devices, in particular subclasses 43-50 for a semiconductive laser device and subclass 75 for semiconductor optical laser pump devices.
385, Optical Waveguides, subclass 14 for a laser in integrated optical circuit, subclasses 129+ for a planar optical waveguide, and subclasses 141+ for a waveguide having a particular optical characteristic modifying chemical composition.

Packaging (e.g., with mounting, encapsulating, etc.) or treatment of packaged semiconductor:
This subclass is indented under subclass 24. Process including (a) multiple operations having a step of permanently attaching or securing a semiconductive substrate to a terminal, elongated conductor or support (e.g., a mounting, housing, lead frame, discrete heat sink, etc.), (b) multiple operations having a step of shaping flowable plastic or flowable insulative material about a semiconductive substrate, or (c) a step of treating an already mounted or packaged semiconductor substrate (e.g., coating of flowable
plastic or flowable insulative material about a semiconductor substrate by dipping, etc.).

Packaging (e.g., with mounting, encapsulating, etc.) or treatment of packaged semiconductor:
This subclass is indented under subclass 22. Process including (a) multiple operations having a step of permanently attaching or securing a semiconductive substrate to a terminal, elongated conductor or support (e.g., a mounting, housing, lead frame, discrete heat sink, etc.), (b) multiple operations having a step of shaping flowable plastic or flowable insulative material about a semiconductive substrate, or (c) a step of treating an already mounted or packaged semiconductor substrate (e.g., coating of flowable plastic or flowable insulative material about a semiconductor substrate by dipping, etc.).

SEE OR SEARCH THIS CLASS, SUBCLASS:
64 for a process of packaging (e.g., with mounting, encapsulating, etc.) or treating a packaged semiconductor device responsive to electromagnetic radiation.
106 for a process of packaging (e.g., with mounting, encapsulating, etc.) or treating a packaged semiconductor device.

Having additional optical element (e.g., optical fiber, etc.):
This subclass is indented under subclass 26. Process for making a semiconductor device wherein the device has combined therewith one or more separate optical elements to transmit or modify electromagnetic radiation incident from the semiconductor device and wherein the optical element is affixed or joined to the semiconductor device.

SEE OR SEARCH CLASS:
65, Glass Manufacturing, especially subclass 406 for processes which involve assembling at least two individually distinct optical fibers, waveguides, or preforms directly to each other (e.g., coupling, etc.)
323, Electricity: Power Supply or Regulation Systems, subclass 902 for optical coupling to a semiconductor.

Plural emissive devices:
This subclass is indented under subclass 26. Process for making a collection or grouping of multiple devices emissive of a nonelectrical signal in a single coherent monolith.

Including integrally formed optical element (e.g., reflective layer, luminescent material, contoured surface, etc.):
This subclass is indented under subclass 22. Process for making a semiconductor device wherein the device has combined therewith one or more optical elements to transmit or modify electromagnetic radiation incident from the semiconductor device.

Liquid crystal component:
This subclass is indented under subclass 29. Process for making a semiconductor device wherein the additional optical element is a substance, usually organic with at least one polarizable group, capable of unidirectional molecular alignment in layers, giving rise to optical bifringement.
(1) Note. Liquid crystals, on variation in pressure, temperature, electric current passing therethrough, etc., change their colors or light transmitting ability, the cholesteric type changing colors while the nematic-type changes between transparency and opacity.

SEE OR SEARCH CLASS:
345, Selective Visual Display Systems, 87 for a display element control system for liquid crystal display elements arranged in a matrix configuration.
349, Liquid Crystal Cells, Elements and Systems, particularly 187 for nominal manufacturing methods or postmanufacturing processing of liquid crystal cells.

Optical waveguide structure:
This subclass is indented under subclass 29. Process for
making a semiconductor device wherein the additional optical element is an optical conduit for the transmission of light energy.

Optical grating structure:
This subclass is indented under subclass 29. Process for making a semiconductor device wherein the additional optical element is a periodic latticework or screen composed of lines producing a series of spectra by the dispersion of the radiation emitted from the device.

Substrate dicing:
This subclass is indented under subclass 22. Process having a step of dividing the semiconductor substrate into plural separate bodies.
(1) Note. The dicing may be done by any manner, such as abrading, sawing, etching, cleavage, or a combination thereof.

SEE OR SEARCH CLASS:
83, Cutting, for generic processes of cutting a substrate into discrete individual units.
225, Severing by Tearing or Breaking, 1 for methods.
451, Abrading, for a process of dicing by abrading.

Making emissive array:
This subclass is indented under subclass 22. Process for making a collection or grouping of multiple devices emissive of nonelectrical signal in a single semiconductor substrate.

SEE OR SEARCH THIS CLASS, SUBCLASS:
28 for a process of packaging (e.g., with mounting, encapsulating, etc.) plural emissive devices into a coherent monolith.

Multiple wavelength emissive:
This subclass is indented under subclass 34. Process wherein the array is emissive of plural electromagnetic wavelengths.

Ordered or disordered:
This subclass is indented under subclass 22. Process for making a semiconductor device wherein a compound semiconductor region is ordered or disordered.

Graded composition:
This subclass is indented under subclass 22. Process wherein the chemical composition of a semiconductor region of the substrate varies with location within the semiconductive region.

Passivating of surface:
This subclass is indented under subclass 22. Process having a step of making the surface of the semiconductor substrate less chemically or optically active.

Mesa formation:
This subclass is indented under subclass 22. Process having a step of removing material from the semiconductor substrate to form a raised feature relative to the surrounding regions of the substrate.

Tapered etching:
This subclass is indented under subclass 39. Process wherein the material removal step is by etching the substrate to form
a mesa with nonparallel sides.

With epitaxial deposition of semiconductor adjacent mesa:
This subclass is indented under subclass 39. Process including a step of epitaxial growth of semiconductor material on the portion of the substrate adjacent the mesa.

Groove formation:
This subclass is indented under subclass 22. Process having a step of removing material from the semiconductor substrate to form a recessed feature (e.g., trench, notch, etc.) relative to the surrounding regions of the substrate.

Tapered etching:
This subclass is indented under subclass 42. Process wherein the material removal step is by etching the substrate to form a groove with nonparallel sides.

With epitaxial deposition of semiconductor in groove:
This subclass is indented under subclass 42. Process including a step of epitaxial growth of semiconductor material in the groove.

Dopant introduction into semiconductor region:
This subclass is indented under subclass 22. Process having a step of introducing a dopant into a semiconductive region of the substrate.

Compound semiconductor:
This subclass is indented under subclass 22. Process for making a device emissive of electromagnetic radiation having a compound semiconductor.

Heterojunction:
This subclass is indented under subclass 46. Process for making a device emissive of electromagnetic radiation having a interface between two dissimilar semiconductor materials, at least one of which is a compound semiconductor, to constitute a junction.

MAKING DEVICE OR CIRCUIT RESPONSIVE TO NONELECTRICAL SIGNAL:
This subclass is indented under the class definition. Process for making a semiconductor electrical device or circuit which is responsive to a nonelectrical input or stimuli during operation.
(1) Note. The nonelectrical signal serving as input stimulus of the device or circuit may be described as an information carrying wave.

SEE OR SEARCH CLASS:
136, Batteries: Thermoelectric and Photoelectric, for active solid-state device structures with a specified usage of generating electricity, especially 200 for batteries which generate electricity under the action of heat and subclasses 243+ for batteries which generate electricity under the action of light; some of these batteries utilize potential barrier layers.
250, Radiant Energy, subclass 338.4 for infrared responsive semiconductor devices for signaling, subclasses 370.01 through 370.15 for invisible radiant energy responsive semiconductor devices, subclasses 552 through 553 for photocell circuits and apparatus involving solid-state light sources, and subclasses 208.1 through 208.6 for plural photosensitive elements, including arrays.
257, Active Solid-State Devices (e.g., Transistors, Solid-State Diodes), subclasses 53-56, 108, 414, and 467 through 470 for such devices used as temperature responsive devices; subclasses 108, 414, and 421 through 427 for devices responsive to an external magnetic field; subclasses 10, 11, 21, 53 through 56, 72, 113 through 118, 184 through 189, 225
through 234, 257, 258, 290 through 294, 414, and 431 through 466 for light responsive active semiconductor devices.
338, Electrical Resistors, especially subclass 2 for electrical resistors of the strain gage type and subclass 22 for semiconductor thermistors.
427, Coating Processes, 74 for coating processes which result in a photoelectric or photovoltaic product (e.g., photocathode) which is responsive to visible, infrared, or ultraviolet illumination by (a) emitting electrons, (b) generating an electromotive force, or (c) varying electrical conductivity.

Chemically responsive:
This subclass is indented under subclass 48. Process for making a semiconductor device responsive to a chemical reaction or the presence of a particular chemical or concentration thereof (e.g., pH level, etc.) in close proximity to the device.

SEE OR SEARCH CLASS:
257, Active Solid-State Devices (e.g., Transistors, Solid-State Diodes), subclass 225, 253, and 414+ for an active solid-state device responsive to a nonelectrical signal.

Physical stress responsive:
This subclass is indented under subclass 48. Process for making a semiconductor device or circuit responsive to physical deformation (e.g., pressure, strain, etc.)
(1) Note. Processes for making semiconductor electrical device based surface acoustic wave devices, accelerometers, and strain gages are proper for this subclass.

SEE OR SEARCH CLASS:
73, Measuring and Testing, particularly subclass 777 for a semiconductor-type stress/strain sensor, subclass 514.16 for a semiconductor-type accelerometer, and subclass 754 for semiconductor-type fluid pressure sensors.
257, Active Solid-State Devices (e.g., Transistors, Solid-State Diodes), 415 for a solid-state active device responsive to physical deformation.
333, Wave Transmission Lines and Networks, 193 for electromechanical filter using surface acoustic waves.
338, Electrical Resistors, subclass 2 for electrical resistors of the strain gage type.

Packaging (e.g., with mounting, encapsulating, etc.) or treatment of packaged semiconductor:
This subclass is indented under subclass 50. Process including (a) multiple operations having a step of permanently attaching or securing a semiconductive substrate to a terminal, elongated conductor or support (e.g., a mounting, housing, lead frame, discrete heat sink, etc.), (b) multiple operations having a step of shaping flowable plastic or flowable insulative material about a semiconductive substrate, or (c) a step of treating an already mounted or packaged semiconductor substrate (e.g., coating of flowable plastic or flowable insulative material about a semiconductor substrate by dipping, etc.).

SEE OR SEARCH THIS CLASS, SUBCLASS:
106 for process of packaging (e.g., with mounting, encapsulating, etc.) or treating a packaged semiconductor device.

Having cantilever element:
This subclass is indented under subclass 50. Process for making a physical stress responsive device or circuit which has a projecting beam or horizontal member supported at only one end.

SEE OR SEARCH CLASS:
216, Etching a Substrate: Processes, subclass 2 for a process of making a cantilever mechanical structure using semiconductive material wherein no electrical function is attributable to the cantilever element produced.

Having diaphragm element:
This subclass is indented under subclass 50. Process for
making a physical stress responsive device or circuit which has a thin deflectable membrane.

SEE OR SEARCH CLASS:
216, Etching a Substrate: Processes, subclass 2 for a process of making a diaphragm mechanical structure using semiconductive material wherein no electrical function is attributable to the structure produced.

Thermally responsive:
This subclass is indented under subclass 48. Process for making a device or circuit responsive to the temperature proximate the device.
(1) Note. Processes of making devices which vary in electrical properties at various temperatures of operation are not deemed to be responsive to thermal stimuli for the purposes of this subclass.

SEE OR SEARCH CLASS:
136, Batteries: Thermoelectric and Photoelectric, subclass 200 for a process of using a thermoelectric device for generating electrical current.
257, Active Solid-State Devices (e.g., Transistors, Solid-State Diodes), subclass 108, 225, 252, and 467 through 470 for a device responsive to temperature.

Packaging (e.g., with mounting, encapsulating, etc.) or treatment of packaged semiconductor:
This subclass is indented under subclass 54. Process provided including (a) multiple operations having a step of permanently attaching or securing a semiconductive substrate to a terminal, elongated conductor or support (e.g., a mounting, housing, lead frame, discrete heat sink, etc.), (b) multiple operations having a step of shaping flowable plastic or flowable insulative material about a semiconductive substrate, or (c) a step of treating an already mounted or packaged semiconductor substrate (e.g., coating of flowable plastic or flowable insulative material about a semiconductor substrate by dipping, etc.).

SEE OR SEARCH THIS CLASS, SUBCLASS:
106 for a process of packaging (e.g., with mounting,
encapsulating, etc.) or treating a packaged semiconductor device.

Responsive to corpuscular radiation (e.g., nuclear particle detector, etc.):
This subclass is indented under subclass 48. Process for making a device or circuit responsive to atomic or subatomic discrete particles (e.g., alpha, neutron, fission fragment or fissionable isotope).

SEE OR SEARCH CLASS:
250, Radiant Energy, subclass 371 for invisible radiant energy responsive methods using semiconductor devices. Also see subclasses 370.01+ for invisible radiant energy responsive electric signaling means of the semiconductor type, particularly subclass 370.02 for an alpha particle detection system, subclass 370.03 for a fission fragmentor fissionable isotope detection system, and subclass 370.05 for a neutron detection system.

Responsive to electromagnetic radiation:
This subclass is indented under subclass 48. Process for making a device or circuit responsive to ultraviolet, visible, or infrared light, x-rays, or gamma rays.
(1) Note. Processes of making devices in which (a) stored electrical charges are erased by exposure to electromagnetic radiation or (b) the device is switched from a nonconducting state to a conducting state or vice versa (e.g., optical turn-on type), are not considered to be responsive to a nonelectrical signal for placement in this and its indented subclasses.

SEE OR SEARCH THIS CLASS, SUBCLASS:
257 for a process of manufacturing a field effect transistor which has a floating gate structure capable of having electrical charge stored therein erased upon the application of electromagnetic radiation.

SEE OR SEARCH CLASS:
427, Coating Processes, 74 for a process of coating with a photoelectric material to produce an electrical product.
430, Radiation Imagery Chemistry: Process, Composition, or
Product Thereof, 31 for an electric or magnetic imagery process employing a photoconductive semiconductive component.

Gettering of substrate:
This subclass is indented under subclass 57. Process having a step of gettering the semiconductor substrate.

SEE OR SEARCH THIS CLASS, SUBCLASS:
471 for a process of gettering a semiconductor substrate per se.

Having diverse electrical device:
This subclass is indented under subclass 57. Process for making an electrical device responsive to electromagnetic radiation in combination with an additional electrical device which is not responsive to electromagnetic radiation.

Charge transfer device (e.g., CCD, etc.):
This subclass is indented under subclass 59. Process for making a charge transfer device having combined therewith another electrical device or element, either of which being responsive to electromagnetic radiation.
(1) Note. A charge transfer device is a structure in which storage sites for packets of electrical charge are induced at or below the semiconductor surface by an electric field applied by serially arranged gate electrodes formed thereupon and wherein carrier potential energy per unit charge minima are established at a given storage site and such minima are transferred in a serial manner via an active channel region to one or more adjacent storage sites.

Continuous processing:
This subclass is indented under subclass 57. Process for making a semiconductor device responsive to electromagnetic
radiation wherein a series of processing steps are performed in a uninterrupted manner.

Using running length substrate:
This subclass is indented under subclass 61. Process whereby the continuous processing is affected using an elongate substrate of indeterminate length having a semiconductive layer thereon.

SEE OR SEARCH THIS CLASS, SUBCLASS:
484 for a process of depositing amorphous active semiconductor onto a substrate of indeterminate length.
490 for a process of depositing polycrystalline active semiconductor onto a substrate of indeterminate length.

Particulate semiconductor component:
This subclass is indented under subclass 57. Process for making a device responsive to electromagnetic radiation wherein the substrate contains particulate semiconductive material.
(1) Note. "Particulate" is defined as a mass of discrete units of matter so small (generally of largest dimension <<1000 microns) that they are not ordinarily handled as individual units, and whose shape and length-to-diameter ratio are such that in the dry state the particles will not hold together as a coherent article without the application of pressure or heat.

SEE OR SEARCH CLASS:
136, Batteries: Thermoelectric or Photoelectric, subclass 250 for a photoelectric device having a particulate or spherical semiconductor component.

Packaging (e.g., with mounting, encapsulating, etc.) or treatment of packaged semiconductor:
This subclass is indented under subclass 57. Process provided including (a) multiple operations having a step of permanently attaching or securing a semiconductive substrate
to a terminal, elongated conductor or support (e.g., a mounting, housing, lead frame, discrete heat sink, etc.), (b) multiple operations having a step of shaping flowable plastic or flowable insulative material about a semiconductive substrate, or (c) a step of treating an already mounted or packaged semiconductor substrate (e.g., coating of flowable plastic or flowable insulative material about a semiconductor substrate by dipping, etc.).
(1) Note. The term packaging connotes the integration/assembly of the semiconductive substrate/chip/die with a preformed housing, capsule, or support.

SEE OR SEARCH THIS CLASS, SUBCLASS:
106 for a process of packaging (e.g., with mounting, encapsulating, etc.) or treating a packaged semiconductor device.

Having additional optical element (e.g., optical fiber, etc.):
This subclass is indented under subclass 64. Process for packaging a semiconductor device responsive to electromagnetic radiation wherein the device has combined therewith one or more optical elements to transmit or modify electromagnetic radiation incident upon the semiconductor device and the optical element is fixed or attached to the device or the housing or support thereof.

SEE OR SEARCH CLASS:
65, Glass Manufacturing, especially subclass 406 for processes which involve assembling at least two individually distinct optical fibers, waveguides, or preforms directly to each other (e.g., coupling, etc.).
323, Electricity: Power Supply or Regulation Systems, subclass 902 for optical coupling to a semiconductor.

Plural responsive devices (e.g., array, etc.):
This subclass is indented under subclass 64. Process for packaging a multiplicity of devices or elements responsive to electromagnetic radiation into a coherent monolith.
(1) Note. The plural responsive devices may be combined via a hybrid construction or secured onto a common support.

Assembly of plural semiconductor substrates:
This subclass is indented under subclass 66. Process having a step of joining multiple semiconductor substrates into a coherent monolith in which plural devices responsive to electromagnetic radiation are formed.

Substrate dicing:
This subclass is indented under subclass 57. Process having a step of dividing the semiconductor substrate into multiple separate bodies.
(1) Note. The dicing may be done by any manner, such as abrading, sawing, etching, cleavage, or a combination thereof.

SEE OR SEARCH CLASS:
83, Cutting, for generic processes of cutting a substrate into discrete individual units.
225, Severing by Tearing or Breaking, 1 for methods.
451, Abrading, for a process of dicing by abrading.

Including integrally formed optical element (e.g., reflective layer, luminescent layer, etc.):
This subclass is indented under subclass 57. Process for making a semiconductor device responsive to electromagnetic radiation wherein the device has combined therewith one or more integrally formed optical elements to transmit or modify electromagnetic radiation incident upon the semiconductor device

Color filter:
This subclass is indented under subclass 69. Process for making a semiconductor device responsive to electromagnetic radiation having combined therewith structural means
functioning as a color filter element.

Specific surface topography (e.g., textured surface, etc.):
This subclass is indented under subclass 69. Process having a surface of specified topography incorporated into an electromagnetic sensitive device or utilized during manufacture thereof.

Having reflective or antireflective component:
This subclass is indented under subclass 69. Process for making a semiconductor device responsive to electromagnetic radiation having a component which has reflective or antireflective properties with respect to electromagnetic radiation incident thereupon.

Making electromagnetic responsive array:
This subclass is indented under subclass 57. Process for making a collection or grouping of electromagnetically responsive devices on a single, coherent, semiconductor substrate.
(1) Note. Individual detectors of the array may alternatively be referred to as elements, pixels, or cells.

Vertically arranged (e.g., tandem, stacked, etc.):
This subclass is indented under subclass 73. Process wherein the array of electromagnetic responsive devices is configured with one responsive device residing at a position over another such device.

Charge transfer device (e.g., CCD, etc.):
This subclass is indented under subclass 73. Process for
making a structure in which storage sites for packets of electrical charge are induced at or below the semiconductor surface by an electric field applied by serially arranged gate electrodes formed thereupon and wherein carrier potential energy per unit charge minima are established at a given storage site and such minima are transferred in a serial manner via an active channel region to one or more adjacent storage sites.

Majority signal carrier (e.g., buried or bulk channel, peristaltic, etc.):
This subclass is indented under subclass 75. Process for making a charge transfer device wherein the transfer of such charge minima is by majority carriers of the semiconductive material (i.e., by electrons in n-type material or by holes in p-type semiconductive material) and such transfer is in response to electromagnetic radiation incident to the device.

Compound semiconductor:
This subclass is indented under subclass 75. Process for making a charge transfer device in which the storage sites are composed of a compound semiconductor material.

Having structure to improve output signal (e.g., exposure control structure, etc.):
This subclass is indented under subclass 75. Process for making a charge transfer device which contains structural means to improve the electrical signal it generates in response to the electromagnetic radiation.
(1) Note. The structural means to improve the output signal may serve to control the amount of light incident on the device which is transferred as output signal charge.

Having blooming suppression structure (e.g., antiblooming drain, etc.):
This subclass is indented under subclass 78. Process for making a charge transfer device wherein the structural means to improve the output signal prevents spill over of a large amount of signal charge generated at a storage site which receives an electromagnetic radiation responsive input signal of very high intensity to adjacent storage sites.
(1) Note. The antiblooming suppression structure may include a drain structure for removing charge from storage sites.
(2) Note. The antiblooming drain structure may be located in the device beneath storage sites rather than on its surface.

Lateral series connected array:
This subclass is indented under subclass 73. Process wherein the array of electromagnetically responsive devices is laterally arranged and serially electrically connected.

Specified shape junction barrier (e.g., V-grooved junction, etc.):
This subclass is indented under subclass 80. Process wherein the junction barrier interface (i.e., between adjoining semiconductor regions of opposite conductivity type) has a specified geometrical configuration.

SEE OR SEARCH CLASS:
257, Active Solid-State Devices (e.g., Transistors, Solid-State Diodes), subclass 465 for a light-responsive active solid-state device having a barrier junction of specified geometrical configuration and subclasses 653+ for an active solid-state device having a specified shape PN junction.

Having organic semiconductor component:
This subclass is indented under subclass 57. Process wherein the semiconductor substrate contains a semiconductive compound in which the molecule is characterized by two or more carbon atoms bonded together, one atom of carbon bonded to at least one atom of hydrogen or halogen (i.e., chlorine,
fluorine, bromine, iodine) or one atom of carbon bonded to at least one atom of nitrogen by a single or double bond.
(1) Note. Exceptions to this rule include HCN, CN-CN, HNCO, HNCS, cyanogen halides, cyanamide, fulminic acid, and metal carbides. These are not regarded as organic materials. Also, note that graphite and diamond are not regarded as organic semiconductors, since they are not compounds; silicon carbide is not regarded as organic.

Forming point contact:
This subclass is indented under subclass 57. Process for making a device responsive to electromagnetic radiation including forming a potential barrier between an electrode of small contacting or cross-sectional area in touching relationship with a substantially larger area of the semiconductor substrate, thus forming a potential barrier junction at the single point therebetween.

Having selenium or tellurium elemental semiconductor component:
This subclass is indented under subclass 57. Process for making a device responsive to electromagnetic radiation utilizing a semiconductor substrate containing semiconductive selenium or tellurium in elemental form (i.e., not in a compound) or an alloy (i.e., mixture) thereof.

Having metal oxide or copper sulfide compound semiconductive component:
This subclass is indented under subclass 57. Process for making a device responsive to electromagnetic radiation utilizing a semiconductor substrate containing a metal oxide or copper sulfide compound semiconductor.

And cadmium sulfide compound semiconductive component:
This subclass is indented under subclass 85. Process wherein the semiconductor substrate containing a metal oxide or
copper sulfide compound semiconductor additionally contains a cadmium sulfide compound semiconductor.

Graded composition:
This subclass is indented under subclass 57. Process for making a device responsive to electromagnetic radiation wherein the chemical composition of a semiconductor region of the substrate varies with location within the semiconductive region.

Direct application of electric current:
This subclass is indented under subclass 57. Process for making a device responsive to electromagnetic radiation having a step of directly applying electrical current to the semiconductor substrate.

Fusion or solidification of semiconductor region:
This subclass is indented under subclass 57. Process for making a device responsive to electromagnetic radiation having a step of fusing or solidifying a semiconductive region of the substrate.

Including storage of electrical charge in substrate:
This subclass is indented under subclass 57. Process for making a device responsive to electromagnetic radiation having a step of storing electrical charge in a region of the semiconductor substrate.

SEE OR SEARCH THIS CLASS, SUBCLASS:
19 for a process of making a semiconductor electrical device having formed therewith an integral battery or power source.

Avalanche diode:
This subclass is indented under subclass 57. Process for making a device which is configured to operate in a manner in which an external voltage applied in the reverse-conducting direction of the device junction with sufficient magnitude causes the potential barrier at the junction to breakdown due to electrons or holes gaining sufficient speed to dislodge valence electrons and thus create more hole-electron current carriers resulting in a sudden change from high dynamic electrical resistance to very low dynamic resistance.
(1) Note. The terms Zener diode and Zener breakdown voltage are used rather loosely in that the breakdown mechanism above about 6 volts is thought to be due to avalanching and that below about 6 volts is thought to be due essentially to tunnelling.

SEE OR SEARCH THIS CLASS, SUBCLASS:
380 for a process of making an avalanche diode which is not responsive to electromagnetic radiation.

SEE OR SEARCH CLASS:
257, Active Solid-State Devices (e.g., Transistors, Solid-State Diodes), subclass 199 for an avalanche diode in a noncharge transfer device having a heterojunction, subclass 438 for a light-responsive avalanche junction device, subclass 481 for an avalanche diode having a Schottky barrier, subclass 551 for an avalanche diode used as a voltage reference element combined with pn junction isolation means in an integrated circuit, and subclasses 603+ for avalanche diodes in general.

Schottky barrier junction:
This subclass is indented under subclass 57. Process for making a device responsive to electromagnetic radiation having a Schottky rectifying junction.

Compound semiconductor:
This subclass is indented under subclass 57. Process for making a device responsive to electromagnetic radiation having a compound semiconductor.

Heterojunction:
This subclass is indented under subclass 93. Process for making a device responsive to electromagnetic radiation having a interface between two dissimilar semiconductor materials, at least one of which is a compound semiconductor, to constitute a junction.

Chalcogenide (i.e., oxygen (O), sulfur (S), selenium (Se), tellurium (Te)) containing:
This subclass is indented under subclass 93. Process wherein the compound semiconductor contains an element from the group of oxygen, sulfur, selenium, and tellurium.

Amorphous semiconductor:
This subclass is indented under subclass 57. Process for making a device responsive to electromagnetic radiation having an amorphous semiconductor component.

Polycrystalline semiconductor:
This subclass is indented under subclass 57. Process for making a device responsive to electromagnetic radiation having a polycrystalline semiconductor component.

Contact formation (i.e., metallization):
This subclass is indented under subclass 57. Process for making a semiconductor device responsive to electromagnetic radiation having a step of coating the device with electrically conductive material forming an electrical connect or conductor thereto.
(1) Note. The electrically conductive material may additionally be transparent to electromagnetic radiation.

HAVING ORGANIC SEMICONDUCTIVE COMPONENT:
This subclass is indented under the class definition. Process for making a semiconductor electrical device wherein the semiconductor substrate contains a semiconductive compound in which the molecule is characterized by two or more carbon atoms bonded together, one atom of carbon bonded to at least one atom of hydrogen or halogen (i.e., chlorine, fluorine, bromine, iodine) or one atom of carbon bonded to at least one atom of nitrogen by a single or double bond.
(1) Note. Exceptions to this rule include HCN, CN-CN, HNCO, HNCS, cyanogen halides, cyanamide, fulminic acid, and metal carbides. These are not regarded as organic materials. Also, note that graphite and diamond are not regarded as organic semiconductors, since they are not compounds; silicon carbide is not regarded as organic.

SEE OR SEARCH THIS CLASS, SUBCLASS:
82 for a process of making a device having an organic semiconductive component which is responsive to electromagnetic radiation.

SEE OR SEARCH CLASS:
29, Metal Working, subclass 25.03 for a process of making an electrolytic capacitor using a solid organic semiconductor.
136, Batteries: Thermoelectric and Photoelectric, subclass 263 for photoelectric cells containing organic active material.
252, Compositions, subclass 62.3 for organic barrier layer device compositions.
257, Active Solid-State Devices (e.g., Transistors, Solid-State Diodes), subclass 40 for an active solid-state device having an organic semiconductor.

MAKING POINT CONTACT DEVICE:
This subclass is indented under the class definition. Process for making a semiconductor electrical device having a potential barrier between an electrode of small contacting or cross-sectional area in touching relationship with a substantially larger area of the semiconductor substrate, thus forming a potential barrier junction at the single point of contact therebetween.

SEE OR SEARCH THIS CLASS, SUBCLASS:
83 for a process of making a point contact device which is responsive to electromagnetic radiation.

SEE OR SEARCH CLASS:
257, Active Solid-State Devices (e.g., Transistors, Solid-State Diodes), subclass 41 for a point contact device.

Direct application of electrical current:
This subclass is indented under subclass 100. Process including a step of directly applying electrical current to the point contact semiconductor electrical device.

HAVING SELENIUM OR TELLURIUM ELEMENTAL SEMICONDUCTOR COMPONENT:
This subclass is indented under the class definition. Process for making a semiconductor electrical device wherein the semiconductor substrate is comprised of semiconductive selenium or tellurium in elemental form (i.e., not in a compound) or an alloy (i.e., mixture) thereof.

SEE OR SEARCH THIS CLASS, SUBCLASS:
84 for a process of making a device responsive to electromagnetic radiation comprised of semiconductive selenium or tellurium in elemental form or an alloy thereof.

SEE OR SEARCH CLASS:
252, Compositions, subclass 62.3 for barrier layer device compositions containing free elemental selenium or tellurium.
257, Active Solid-State Devices (e.g., Transistors, Solid-State Diodes), subclass 42 for a device having elemental selenium or tellurium semiconductor.
420, Alloys or Metallic Compositions, subclass 579 for selenium or tellurium base alloy containing metal.

Direct application of electrical current:
This subclass is indented under subclass 102. Process having a step of directly applying electrical current to the selenium or tellurium elemental semiconductor component substrate.

HAVING METAL OXIDE OR COPPER SULFIDE COMPOUND SEMICONDUCTOR COMPONENT:
This subclass is indented under the class definition. Process for making a semiconductor electrical device wherein the semiconductor substrate contains a metal oxide or copper sulfide compound semiconductor.

SEE OR SEARCH THIS CLASS, SUBCLASS:
85 for a process of making a device responsive to electromagnetic radiation having a metal oxide or copper sulfide compound semiconductor component.

SEE OR SEARCH CLASS:
257, Active Solid-State Devices (e.g., Transistors, Solid-State Diodes), subclass 43 for a semiconductor solid-state device having a metal oxide or copper sulfide compound semiconductor component.
264, Plastic and Nonmetallic Article Shaping or Treating: Processes, subclass 61 for methods of vitrifying or sintering an inorganic preform to make a discrete passive device (e.g., multilayer ceramic capacitor, etc.)

HAVING DIAMOND SEMICONDUCTOR COMPONENT:
This subclass is indented under the class definition. Process for making a semiconductor electrical device wherein the semiconductor substrate contains a diamond semiconductor component.
(1) Note. The utilization of a diamond component for other than its semiconductor properties (e.g., as a thermal heat sink) is not proper for this subclass.

SEE OR SEARCH CLASS:
257, Active Solid-State Devices (e.g., Transistors, Solid-State Diodes), subclass 77, for a solid-state device having a diamond semiconductor component.

PACKAGING (E.G., WITH MOUNTING, ENCAPSULATING, ETC.) OR TREATMENT OF PACKAGED SEMICONDUCTOR:
This subclass is indented under the class definition. Process provided including (a) multiple operations having a step of permanently attaching or securing a semiconductive substrate to a terminal, elongated conductor, or support (e.g., a mounting, housing, lead frame, discrete heat sink, etc.), (b) multiple operations having a step of shaping flowable plastic or flowable insulative material about a semiconductive substrate, or (c) a step of treating an already mounted or packaged semiconductor substrate (e.g., coating of flowable plastic or flowable insulative material about a semiconductor substrate by dipping, etc.).
(1) Note. Packaging is a semiconductor art manufacturing term for integration, assembly, or surrounding of a semiconductor substrate (e.g., chip, die, etc.) with a permanent encasement, housing, capsule, or support. This is distinguished from package making found in Class 53 which is directed to preparing a manufactured product for passage through the channels of trade in a safe, convenient, and attractive condition, usually wrapped in a cover or in a container which is intended to be removed when the manufactured product is used.
(2) Note. See References to Other Classes in the class definition, for a listing of various related classes providing for unit or combined operations.
(3) Note. See References to Other Classes in the class definition, for a listing of various related classes providing for electrical connectors, electrical device housing or packaging, etc.

SEE OR SEARCH THIS CLASS, SUBCLASS:
26 for a process of packaging (e.g., with mounting, encapsulating, etc.)or treating a packaged semiconductor device or circuit emissive of a nonelectrical signal.
51 for a process of packaging (e.g., with mounting, encapsulating, etc.) or treating a packaged semiconductor device responsive to physical stress.
55 for a process of packaging (e.g., with mounting, encapsulating, etc.) or treating a thermally responsive semiconductor electrical device.
64 for a process of packaging (e.g., with mounting, encapsulating, etc.) or treating a semiconductor device or circuit responsive to electromagnetic radiation.
100 for a process of manufacturing a point-contact-type semiconductor device.
616 for a process of transcribing bump electrodes which substantially do not retain their contour following transfer from a carrier substrate (e.g., template, etc.) to a semiconductor substrate.

SEE OR SEARCH CLASS:
29, Metal Working, especially subclass 827 for lead frame or beam lead device manufacture, subclasses 829+ for the assembly of an electrical component to an insulative base having a conductive path applied thereto, or formed thereon or therein (e.g., a printed circuit board), subclasses 854+ for the assembly of an electrical component directly to terminal or elongated conductor, and subclasses 729+ for an electrical device manufacturing apparatus.
53, Package Making, 396 for methods of encompassing, encasing, or completely surrounding goods or materials with a cover made from sheet material stock, and for methods of assembling or securing a separate closure (hood, cap, capsule, crown, seal, etc.) to the aperture of a preformed receptacle so as to complete the encasement of contents.
65, Glass Manufacturing, especially 36 for a process of fusion bonding of glass to a formed part, and subclass 155 for electronic device making means involving fusion bonding.
148, Metal Treatment, for a process of treating metal to modify or maintain the internal physical structure (i.e., microstructure) or chemical properties of metal.
156, Adhesive Bonding and Miscellaneous Chemical Manufacture, 60 for a single step process of adhesively bonding and for certain multistep processes having a step of adhesively bonding a nominal semiconductive chip or wafer.
216, Etching a Substrate: Processes, especially 13 for processes of manufacturing a printed circuit board or thick film circuit board involving an etching step.
219, Electric Heating, 78.01 for process and apparatus for bonding by electrical current and pressure.
228, Metal Fusion Bonding, appropriate subclasses, for a process of fusion bonding and additional operations which are considered to be ancillary to the bonding (preheating, positioning, pretinning, etc.) of a semiconductive substrate, especially subclass 123.1 and 179.1+.
264, Plastic and Nonmetallic Article Shaping or Treating: Processes, for a process (and steps perfecting same) of shaping plastic or nonmetallic material and uniting it to a preform (e.g., encapsulating), said preform being a
semiconductive substrate.
324, Electricity: Measuring and Testing, for a process of temporarily affixing a semiconductor substrate to a support during the electrical testing thereof.
427, Coating Processes, 96 for a process of coating an insulative substrate to form a printed circuit board or thick film circuit board.

Assembly of plural semiconductive substrates each possessing electrical device:
This subclass is indented under subclass 106. Process wherein plural semiconductive substrates are combined into a hybrid construction or secured onto a common support.

SEE OR SEARCH THIS CLASS, SUBCLASS:
455 for a nonpackaging process of joining or bonding plural semiconductive substrates wherein none of the semiconductive substrates are intended to function as a terminal, elongated conductor, or support.

Flip-chip-type assembly:
This subclass is indented under subclass 107. Process wherein a semiconductive substrate which has electric contacts on the top side thereof is flipped to juxtapose the contacts in face-to-face orientation with a substrate which has matching electrical contacts prior to bonding.

Stacked array (e.g., rectifier, etc.):
This subclass is indented under subclass 107. Process for making a semiconductor device wherein a multiplicity of semiconductive substrates are juxtaposed in face-to-face orientation.

Making plural separate devices:
This subclass is indented under subclass 106. Process for making a semiconductor device wherein a multiplicity of separate semiconductive devices are obtained.

Using strip lead frame:
This subclass is indented under subclass 110. Process for making plural separate semiconductor devices utilizing a plurality of support structures or positions arranged on an elongated continuum prior to separation.
(1) Note. The continuum may either be the material of the lead frame (e.g., metal strip) or the lead frame may be mounted serially on another continuum (e.g., plastic strip)

And encapsulating:
This subclass is indented under subclass 111. Process including a step of surrounding the semiconductor substrate with an electrically insulating material which forms a sealed encasement therefor.

Substrate dicing:
This subclass is indented under subclass 110. Process wherein a semiconductive substrate is divided into discrete individual units.
(1) Note. The dicing may be done by any manner, such as abrading, sawing, etching, cleavage, or a combination thereof.

SEE OR SEARCH THIS CLASS, SUBCLASS:
460 for a process under the class definition of dicing a semiconductor substrate into multiple separate bodies.

SEE OR SEARCH CLASS:
83, Cutting, for generic processes of cutting a substrate into discrete individual units.
225, Severing by Tearing or Breaking, 1 for methods.
451, Abrading, for a process of dicing by abrading.

Utilizing a coating to perfect the dicing:
This subclass is indented under subclass 113. Process including a step of coating the semiconductive substrate to enhance the dicing operation.

Including contaminant removal or mitigation:
This subclass is indented under subclass 106. Process including the step of removing undesirable material through the use of a getter, desiccant, etc.

Having light transmissive window:
This subclass is indented under subclass 106. Process wherein the housing contains light transmissive means allowing light to reach the enclosed semiconductive device.

SEE OR SEARCH THIS CLASS, SUBCLASS:
64 for a process of packaging (e.g., with mounting, encapsulating, etc.) or treating a packaged semiconductor device responsive to electromagnetic radiation.

Incorporating resilient component (e.g., spring, etc.):
This subclass is indented under subclass 106. Process for packaging a semiconductor substrate wherein the resulting structure includes an elastically compressible component.

Including adhesive bonding step:
This subclass is indented under subclass 106. Process for packaging a semiconductor substrate including a step of joining the semiconductor substrate to a another body by nonmetallic bonding.
(1) Note. See Lines With Other Classes, "Packaging (E.g., With Mounting, Encapsulating, Etc.) Or Treatment Of Packaged Semiconductor" above. Also see the search notes below.

SEE OR SEARCH CLASS:
156, Adhesive Bonding and Miscellaneous Chemical Manufacture, 60 for a step of surface bonding or assembly therefor, and the Class 156 definition for special lines to Class 29, Metal Working.

Electrically conductive adhesive:
This subclass is indented under subclass 118. Process wherein the nonmetallic bonding material is electrically conductive.
(1) Note. The nonmetallic bonding material may possess particulate metal dispersed in the nonmetallic adhesive binder to render the composition electrically conductive.

With vibration step:
This subclass is indented under subclass 106. Process for packaging a semiconductor substrate including a step of applying vibratory energy.

Metallic housing or support:
This subclass is indented under subclass 106. Process for mounting, packaging, or encapsulating a semiconductor device wherein a semiconductive substrate is supported or enclosed by joining the substrate to a metallic body.

Possessing thermal dissipation structure (i.e., heat sink):
This subclass is indented under subclass 121. Process wherein the metallic body joined to the semiconductor substrate possesses structure for the dissipation of thermal energy generated during operation of the electrical device.

SEE OR SEARCH THIS CLASS, SUBCLASS:
584 for a process of coating a semiconductor substrate with a thermally conductive material (e.g., plated heat sink, etc.)

Lead frame:
This subclass is indented under subclass 121. Process wherein the metallic body joined to the semiconductor device is in the form of a metallic support with electrically conductive leads depending therefrom.

And encapsulating:
This subclass is indented under subclass 121. Process including a step of surrounding the semiconductor substrate or the metallic housing or support with an electrically insulating material which forms a sealed encasement therefor.

Insulative housing or support:
This subclass is indented under subclass 106. Process for making a structure wherein the semiconductive device is supported or enclosed by preformed insulative body.
(1) Note. An encapsulant, per se, is not considered to be a supporting structure proper for this and indented subclasses.

And encapsulating:
This subclass is indented under subclass 125. Process including a step of surrounding the semiconductor substrate or insulative housing or support with an electrically insulating material which forms a sealed encasement therefor.

Encapsulating:
This subclass is indented under subclass 106. Process including a step of surrounding the semiconductor substrate with an electrically insulating material which forms a sealed encasement therefor.

SEE OR SEARCH CLASS:
65, Glass Manufacturing, for a per se process of shaping glass material about an electrical device to encapsulate same.
264, Plastic and Nonmetallic Article Shaping or Treating: Processes, especially 272.11 for per se electrical component encapsulating by molding of insulative material about the electrical component.

MAKING DEVICE ARRAY AND SELECTIVELY INTERCONNECTING:
This subclass is indented under the class definition. Process for forming an array of active devices on a semiconductor substrate and electrically interconnecting the devices into a designated circuit arrangement.
(1) Note. The processes found in this and its indented subclasses result in circuits which are alter-natively referred to as personalized, customized, or application specific.
(2) Note. This and its indented subclasses do not take processes of producing a shorted or shunted structure as an integral part of a single device.

SEE OR SEARCH THIS CLASS, SUBCLASS:
6 for processes of interconnecting plural devices wherein at least one operation is responsive to a sensed condition.
587 for process of forming an array of gate electrodes upon a semiconductor substrate.
598 for a process of metallizing a semiconductor substrate wherein the electrically conductive metallization contains a portion which is alterable from the conductive to nonconductive condition or vice-versa (e.g., a fuse or antifuse).

SEE OR SEARCH CLASS:
257, Active Solid-State Devices (e.g., Transistors, Solid-State Diodes), particularly 202 for gate arrays.

With electrical circuit layout:
This subclass is indented under subclass 128. Process including a step of designing the topological arrangement of arrayed device components or electrical conductors therebetween in combination with making the semiconductor device array.

SEE OR SEARCH CLASS:
364, Electrical Computers and Data Processing Systems, subclass 491 for integrated circuit layout, per se.
369, Dynamic Information Storage or Retrieval, for processes of storing or retrieving dynamic information, 99 for a particular detail of the information handling portion of a system, especially subclasses 100+ for radiation beam modification of or by a storage medium and subclass 126 for electrical modification or sensing of a storage medium (e.g., capacitive, resistive, or electrostatic discharge)

Rendering selected devices operable or inoperable:
This subclass is indented under subclass 128. Process wherein selected devices located on a semiconductive substrate are electrically completed or electrically shorted so as to be rendered operable or inoperable.
(1) Note. Adjusting an operating characteristic (e.g., threshold voltage) of selected devices so as to render them operational yet nonresponsive to the intended operating voltage is specifically excluded from herein.

SEE OR SEARCH THIS CLASS, SUBCLASS:
276 for processes of programming or encoding a grouping of insulated gate field effect transistors by altering the operative mode (enhancement type or depletion type) of selected transistors.

Using structure alterable to conductive state (i.e., antifuse):
This subclass is indented under subclass 128. Process for making an array of electrical devices and selectively interconnecting the devices via a structure which is alterable from a nonconductive state to a conductive state.

SEE OR SEARCH THIS CLASS, SUBCLASS:
467 for altering the conductivity of an antifuse element through the direct application of an electrical current.
600 for metallization processes forming a structure alterable to a conductive state.

Using structure alterable to nonconductive state (i.e., fuse):
This subclass is indented under subclass 128. Process for making an array of electrical devices and selectively interconnecting the devices via a structure which is alterable from a conductive state to a nonconductive state.

SEE OR SEARCH THIS CLASS, SUBCLASS:
467 for altering the conductivity of a fuse element through the direct application of electrical current.
601 for metallization processes forming a structure alterable to a nonconductive state.

SEE OR SEARCH CLASS:
327, Miscellaneous Active Electrical Nonlinear Devices, Circuits, and Systems, especially subclass 525 for a specific identifiable device, circuit, or system having as a part of it's construction or arrangement a fusible link element.
365, Static Information Storage and Retrieval, subclass 96 for fusible links relating to programmable read-only memory and subclass 200 for eliminating "bad bit" information associated with read/write circuits.

MAKING REGENERATIVE-TYPE SWITCHING DEVICE (E.G., SCR, IGBT, THYRISTOR, ETC.):
This subclass is indented under the class definition. Process for making a switching device structure acting as if it has two or more active emitter junctions each of which is
associated with a separate, equivalent transistor having an individual gain and which, when initiated by a base region current, causes the equivalent transistors to mutually drive each other in a regenerative manner to lower the voltage drop between emitter regions.
(1) Note. If the current is above a level I[subscrpt]h[end subscrpt], called the "holding current", then the device will remain ON when the triggering signal is removed by the regenerative feedback therebetween, and is then said to be "latched.

SEE OR SEARCH CLASS:
257, Active Solid-State Devices (e.g., Transistors, Solid-State Diodes), 107 for a regenerative-type switching device.
361, Electricity: Electrical Systems and Devices, 100 and 205 for circuits employing thyristors (e.g., silicon controlled rectifiers (SCRs))
363, Electric Power Conversion Systems, 27, 54, 57+, 68, 85+, 96+, 128+, 135+, and 160+ for circuits employing thyristors (e.g., silicon controlled rectifiers (SCRs))

Bidirectional rectifier with control electrode (e.g., triac, diac, etc.):
This subclass is indented under subclass 133. Process for making a regenerative switching device having a control electrode which device can conduct in both the forward and reverse directions, being triggered into conduction by a pulse applied to the control electrode.

SEE OR SEARCH CLASS:
257, Active Solid-State Devices (e.g., Transistors, Solid-State Diodes), 119 for a bidirectional rectifier with control electrode.

Having field effect structure:
This subclass is indented under subclass 133. Process wherein the regenerative switching device includes or is combined with a field effect structure (i.e., wherein the current through a active channel region is controlled by an electric field coming from a voltage which is applied between the gate and source terminals thereof).
(1) Note. Includes amplifying gate-type and optical turn-on-type structures.

SEE OR SEARCH CLASS:
257, Active Solid-State Devices (e.g., Transistors, Solid-State Diodes), 133 for a regenerative device combined with a field effect transistor.

Junction gate:
This subclass is indented under subclass 135. Process for making a regenerative switching device which possesses a gate electrode which forms a PN (rectifying) junction with the semiconductor substrate.

Vertical channel:
This subclass is indented under subclass 136. Process for making a junction gate regenerative-type switching device wherein the active channel is configured to provide, in whole or in part, a vertically conductive pathway between source and drain regions.

Vertical channel:
This subclass is indented under subclass 135. Process for making a regenerative-type switching device wherein the active channel is configured to provide, in whole or in part, a vertically conductive pathway between source and drain regions.

SEE OR SEARCH THIS CLASS, SUBCLASS:
268 for a process of making a vertical channel insulated gate field effect transistor.

Altering electrical characteristic:
This subclass is indented under subclass 133. Process having
a step of altering an electrical characteristic of the regenerative-type switching device.

Having structure increasing breakdown voltage (e.g., guard ring, field plate, etc.):
This subclass is indented under subclass 133. Process for making a regenerative switching device having a structure for increasing the breakdown voltage of the device (e.g., beveled junction, contoured edge, etc.).

SEE OR SEARCH CLASS:
257, Active Solid-State Devices (e.g., Transistors, Solid-State Diodes), 168 for a regenerative-type switching device having means to increase breakdown voltage.

MAKING CONDUCTIVITY MODULATION DEVICE (E.G., UNIJUNCTION TRANSISTOR, DOUBLE BASE DIODE, CONDUCTIVITY-MODULATED TRANSISTOR, ETC.):
This subclass is indented under the class definition. Process for making a conductivity modulation device structure which has a high resistivity semiconductor region of one conductivity-type having a region of opposite conductivity-type forming a pn junction with a central portion of the high resistivity region, with structural means provided to forward bias the pn junction to inject minority carriers into the high resistivity region to vary its conductivity producing modulated wave response (i.e., conductivity modulation).

SEE OR SEARCH CLASS:
257, Active Solid-State Devices (e.g., Transistors, Solid-State Diodes), subclass 212 for a conductivity modulation device.
388, Electricity: Motor Control Systems, subclass 919 for unijunction transistor circuit trigger control means.

MAKING FIELD EFFECT DEVICE HAVING PAIR OF ACTIVE REGIONS SEPARATED BY GATE STRUCTURE BY FORMATION OR ALTERATION OF SEMICONDUCTIVE ACTIVE REGIONS:
This subclass is indented under the class definition. Process for forming or altering a pair of device active regions (i.e., source or drain) separated by a gate structure intended to permit or block the flow of electrical current therebetween.
(1) Note. To be proper hereunder, the claim must include a positive recitation of (a) formation of semiconductive active regions or (b) altering the electrical properties of active semiconductive regions of the substrate. [figure]

SEE OR SEARCH THIS CLASS, SUBCLASS:
49 for a process of making a chemically sensitive field effect transistor (i.e., CHEMFET.)

Gettering of semiconductor substrate:
This subclass is indented under subclass 142. Process including a step of gettering the semiconductor substrate.

SEE OR SEARCH THIS CLASS, SUBCLASS:
471 for process of gettering a semiconductor substrate, per se.

Charge transfer device (e.g., CCD, etc.):
This subclass is indented under subclass 142. Process for making a structure in which storage sites for packets of electrical charge are induced at or below the semiconductor surface by an electric field applied by serially arranged gate electrodes formed thereupon and wherein carrier potential energy per unit charge minima are established at a given storage site and such minima are transferred in a serial manner via an active channel region to one or more adjacent storage sites.
(1) Note. Included herein are devices commonly referred to as charge coupled devices as well as bucket brigade devices.
(2) Note. A field effect device of the charge injection-type (i.e., CID) that transfers the charge in a nonserial manner to the device substrate or the data bus is not proper hereunder.

SEE OR SEARCH THIS CLASS, SUBCLASS:
75 for a process of making a charge transfer device which is
responsive to electromagnetic radiation.
587 for a process of making an array of gate electrodes upon a semiconductor substrate.

SEE OR SEARCH CLASS:
257, Active Solid-State Devices (e.g., Transistors, Solid-State Diodes), 215 for a charge transfer device structure.
365, Static Information Storage and Retrieval, subclass 183 for a charge coupled memory.
377, Electrical Pulse Counters, Pulse Dividers, or Shift Registers: Circuits and Systems, 57 for charge transfer device systems.

Having additional electrical device:
This subclass is indented under subclass 144. Process for making a charge transfer device structure in combination with an additional electrical device.

Majority signal carrier (e.g., buried or bulk channel, peristaltic, etc.):
This subclass is indented under subclass 144. Process for making a charge transfer device structure wherein the transfer of such charge minima is by majority carriers of the semiconductive material (i.e., by electrons in n-type material, and is by holes in p-type semiconductive material).

Changing width or direction of channel (e.g., meandering channel, etc.):
This subclass is indented under subclass 144. Process for making a charge transfer device structure wherein the active channel region changes its width or direction throughout all or part of the distance between adjacent storage sites.

Substantially incomplete signal charge transfer (e.g., bucket brigade, etc.):
This subclass is indented under subclass 144. Process for making a charge transfer device structure wherein the charge transferred is less than the entire charge stored in the storage site from which it originates.

On insulating substrate or layer (e.g., TFT, etc.):
This subclass is indented under subclass 142. Process for making a field effect transistor from a semiconductive layer formed upon an insulating substrate (for example, glass or sapphire) or an insulating layer.

SEE OR SEARCH THIS CLASS, SUBCLASS:
30 for process of making a device or circuit emissive of nonelectrical signal comprising an array of field effect transistors on an insulating substrate combined with a liquid crystal optical material.

Specified crystallos:graphic orientation:
This subclass is indented under subclass 149. Process wherein a given feature of the field effect device on an insulating substrate or layer is formed in a definite crystallos:graphic relationship relative to the insulating substrate or layer or the semiconductor layer thereupon.

Having insulated gate:
This subclass is indented under subclass 149. Process for making an insulated gate field effect transistor from a semiconductive layer formed upon an insulating substrate (for example, glass or sapphire) or an insulating layer.

Combined with electrical device not on insulating substrate or layer:
This subclass is indented under subclass 151. Process for making a field effect transistor formed on an insulating substrate or layer combined with an additional electrical device which is not formed upon an insulating substrate or layer.
(1) Note. The electrical device not on an insulating substrate or layer is often referred to as a bulk device while the electrical device on the insulating substrate or layer is often referred to as a thin film device with the combined structure either horizontally disposed or vertically stacked (i.e., 3-dimensional).

SEE OR SEARCH THIS CLASS, SUBCLASS:
155 for a process of making a field effect transistor on an insulating substrate or layer and an additional electrical device on an insulating substrate or layer.

SEE OR SEARCH CLASS:
257, Active Solid-State Devices (e.g., Transistors, Solid-State Diodes), 350 for an insulated gate field effect device formed on a single crystal semiconductor layer on an insulating substrate combined with a diverse-type device structure.

Complementary field effect transistors:
This subclass is indented under subclass 152. Process for making plural field effect transistors of opposite conductivity type (i.e., wherein source and drain regions of a first field effect transistor are of opposite conductivity type to source and drain regions of a second field effect transistor).

Complementary field effect transistors:
This subclass is indented under subclass 151. Process for making plural field effect transistors of opposite conductivity type (i.e., wherein source and drain regions of a first field effect transistor are of opposite conductivity type to source and drain regions of a second field effect transistor).

And additional electrical device on insulating substrate or layer:
This subclass is indented under subclass 151. Process for making a field effect transistor formed on an insulating layer or substrate combined with an additional electrical device which is also formed on an insulating substrate or layer.
(1) Note. The additional electrical device must be other than an insulated gate field effect transistor if formed utilizing the same semiconductive layer or may be any type of electrical device if formed utilizing a different semiconductive layer with the structure formed referred to as a vertically stacked or 3-dimensional structure.

SEE OR SEARCH THIS CLASS, SUBCLASS:
152 for a process of making a field effect transistor on an insulating substrate or layer and an additional electrical device not on an insulating substrate or layer.

Vertical channel:
This subclass is indented under subclass 151. Process for making a junction gate field effect transistor wherein the active channel is configured to provide, in whole or in part, a vertically conductive pathway between source and drain regions.

Plural gate electrodes (e.g., dual gate, etc.):
This subclass is indented under subclass 151. Process for making a field effect transistor formed on an insulating layer or substrate wherein plural insulated gate electrodes on either the same or opposite sides of the active channel region serve to control the electrical conduction characteristics of the semiconductive active channel region.

SEE OR SEARCH THIS CLASS, SUBCLASS:
283 for a process of making an insulated gate field effect transistor having either dual gate or opposed gate structure.

Inverted transistor structure:
This subclass is indented under subclass 151. Process for making a field effect transistor formed on an insulating substrate or layer wherein the gate electrode of the field effect transistor is formed so as to be in direct contact with the insulating substrate or layer.

Source-to-gate or drain-to-gate overlap:
This subclass is indented under subclass 158. Process wherein the source or drain regions or layers of the inverted field effect transistor are formed so as to extend over a portion of the gate electrode formed on the insulating substrate or layer.

Utilizing backside irradiation:
This subclass is indented under subclass 158. Process wherein single or multiple layers formed over the gate are patterned by irradiating a photoresist layer with a radiation source located on the opposite side of the substrate from which the gate is formed.

Including source or drain electrode formation prior to semiconductor layer formation (i.e., staggered electrodes):
This subclass is indented under subclass 151. Process wherein the source or drain electrodes of the field effect transistor are formed on the insulating substrate or layer prior to the deposition of a semiconductive layer.

Introduction of nondopant into semiconductor layer:
This subclass is indented under subclass 151. Process wherein a nonelectrically active impurity (i.e., one that does not change the electrically properties) is introduced into the semiconductive layer.

Adjusting channel dimension (e.g., providing lightly doped source or drain region, etc.):
This subclass is indented under subclass 151. Process wherein a particular dimension of the active channel region of the field effect transistor (e.g., thickness, length, etc.) is adjusted.

Semiconductor islands formed upon insulating substrate or layer (e.g., mesa formation, etc.):
This subclass is indented under subclass 151. Process wherein the semiconductor layer selectively deposited or deposited and subsequently patterned to form a semiconductive region electrically isolated from laterally adjoining semiconductor regions.
(1) Note. The separate laterally adjacent semiconductor layers are each intended to possess a single field effect transistor and be electrically isolated with respect to one another prior to electrically interconnecting.

Including differential oxidation:
This subclass is indented under subclass 164. Process in which the patterning of the semiconductive layer includes a step of oxidizing the semiconductive layer to form regions of differing oxide thickness.

Including recrystallization step:
This subclass is indented under subclass 151. Process wherein the crystalline structure of the semiconductive layer is altered or modified (e.g., from amorphous to polycrystalline or single crystalline).

SEE OR SEARCH THIS CLASS, SUBCLASS:
150 for a process of making a field effect transistor on an insulating substrate or layer having a specified crystallos:graphic orientation.

Having Schottky gate (e.g., MESFET, HEMT, etc.):
This subclass is indented under subclass 142. Process for making a field effect transistor which possesses a gate which forms a metal-semiconductor rectifying junction with the underlying semiconductive active channel region.

Specified crystallos:graphic orientation:
This subclass is indented under subclass 167. Process wherein a given feature of the Schottky gate field effect device is formed in a definite crystallos:graphic orientation relative to the substrate.
(1) Note. Processes of making a transistor in a semiconductor substrate of given orientation are not sufficient for placement in this subclass.

Complementary Schottky gate field effect transistors:
This subclass is indented under subclass 167. Process for making plural Schottky gate field effect transistors of opposite conductivity type (i.e., wherein source and drain regions of a first field effect transistor are of opposite conductivity type to source and drain regions of a second field effect transistor).

And bipolar device:
This subclass is indented under subclass 167. Process for making a bipolar transistor in addition to the Schottky gate field effect transistor.

And passive electrical device (e.g., resistor, capacitor, etc.):
This subclass is indented under subclass 167. Process for making a Schottky gate field effect transistor having
combined therewith an electrical device or element in which charge carriers do not change their energy levels and do not provide electrical rectification, amplification, or switching, but which does react to voltage and current input.

Having heterojunction (e.g., HEMT, MODFET, etc.):
This subclass is indented under subclass 167. Process for making a Schottky gate field effect transistor wherein the Schottky gate field effect transistor possesses an interface between two dissimilar semiconductor materials which constitute a junction.

Vertical channel:
This subclass is indented under subclass 167. Process for making a Schottky gate field effect transistor wherein the active channel is configured to provide, in whole or in part, a vertically conductive pathway between source and drain regions.

Doping of semiconductive channel region beneath gate (e.g., threshold voltage adjustment, etc.):
This subclass is indented under subclass 167. Process for making a Schottky gate field effect transistor having a step of introducing an electrically active dopant species into the semiconductor channel region beneath the gate electrode.
(1) Note. To be proper herein, the transistor channel region must possess semiconductive characteristics prior to the introduction of the dopant.

Buried channel:
This subclass is indented under subclass 167. Process for making a Schottky gate field effect transistor wherein the channel formed between the source and drain regions is configured so as to be buried beneath the semiconductor substrate surface.

Plural gate electrodes (e.g., dual gate, etc.):
This subclass is indented under subclass 167. Process for making a Schottky gate field effect transistor wherein plural gate electrodes on either the same or opposite side of the active channel region serve to control the electrical conduction characteristics of the semiconductive active channel region.

Closed or loop gate:
This subclass is indented under subclass 167. Process for making a Schottky field effect transistor wherein the gate electrode is configured such that it closes upon itself to thereby totally surround one of the device active regions.

Elemental semiconductor:
This subclass is indented under subclass 167. Process for making a Schottky gate field effect transistor wherein the gate electrode is formed upon an elemental semiconductor active channel region.

Asymmetric:
This subclass is indented under subclass 167. Process for making a Schottky gate field effect transistor wherein the pair of active regions are off-set or nonsymmetrical with respect to the centerline of the Schottky gate electrode.

Self-aligned:
This subclass is indented under subclass 167. Process for making a Schottky gate field effect transistor wherein a previously formed device feature is utilized to make device regions in the desired registration to the previously formed
feature.
(1) Note. A self-aligned gate is one which is aligned between the source and drain via a masking process which uses the gate material itself to achieve the registration of the related device regions.

Doping of semiconductive region:
This subclass is indented under subclass 180. Process wherein a semiconductive region of the substrate is changed in electrical properties by introduction of an electrically active impurity.

T-gate:
This subclass is indented under subclass 181. Process wherein a T-shaped gate structure is formed or utilized at any stage in the process.

Dummy gate:
This subclass is indented under subclass 181. Process wherein a temporary gate is formed or utilized at any stage in the process and is intended to be removed or have no function in the final device.

Utilizing gate sidewall structure:
This subclass is indented under subclass 181. Process wherein a gate sidewall structure is utilized during the doping of semiconductive regions adjacent the gate structure.
(1) Note. The sidewall structure may function as a masking layer or dopant source during the self-aligned doping step.

Multiple doping steps:
This subclass is indented under subclass 184. Process including plural steps of doping the semiconductive regions of the substrate.

Having junction gate (e.g., JFET, SIT, etc.):
This subclass is indented under subclass 142. Process for making a field effect transistor which possesses a gate electrode which forms a PN (rectifying) junction with the semiconductor active channel region.

Specified crystallos:graphic orientation:
This subclass is indented under subclass 186. Process wherein a given feature of the junction gate field effect device is formed in a definite crystallos:graphic orientation relative to the substrate.
(1) Note. Processes of making a transistor in a semiconductor substrate of given orientation are not sufficient for placement in this subclass.

Complementary junction gate field effect transistors:
This subclass is indented under subclass 186. Process for making plural junction gate field effect transistors of opposite conductivity type (i.e., wherein source and drain regions of a first field effect transistor are of opposite conductivity type to source and drain regions of a second field effect transistor).

And bipolar transistor:
This subclass is indented under subclass 186. Process for making a junction gate field effect transistor which additionally contains a bipolar transistor.

And passive device (e.g., resistor, capacitor, etc.):
This subclass is indented under subclass 186. Process for making a junction gate field effect transistor having combined therewith an electrical device or component in which charge carriers do not change their energy levels and do not provide electrical rectification, amplification, or switching, but which does react to voltage and current input.

Having heterojunction:
This subclass is indented under subclass 186. Process for making a junction gate field effect transistor which possesses an interface between two dissimilar semiconductor materials which constitute a junction.

Vertical channel:
This subclass is indented under subclass 186. Process for making a junction gate field effect transistor wherein the active channel is configured to provide, in whole or in part, a vertically conductive pathway between source and drain regions.

SEE OR SEARCH THIS CLASS, SUBCLASS:
347 for a process of making a permeable base bipolar transistor.

Multiple parallel current paths (e.g., grid gate, etc.):
This subclass is indented under subclass 192. Process for making a junction gate field effect transistor wherein the junction gate which controls the vertical channel consists of a plurality of parallel current paths.

Doping of semiconductive channel region beneath gate (e.g., threshold voltage adjustment, etc.):
This subclass is indented under subclass 186. Process for making a junction gate field effect transistor having a step of introducing an electrically active dopant species into the semiconductor channel region beneath the gate electrode.
(1) Note. To be proper herein, the transistor channel region must possess semiconductive characteristics prior to the introduction of the dopant.

Plural gate electrodes:
This subclass is indented under subclass 186. Process for making a junction gate field effect transistor having plural gate electrodes on either the same or opposite side of the active channel region which serve to control the electrical conduction characteristics of the semiconductive active channel region.

Including isolation structure:
This subclass is indented under subclass 186. Process for making a junction gate field effect transistor having a structure which serves to at least partially electrically isolate the semiconductor region in which the device is formed from laterally adjacent semiconductive regions.

Having insulated gate (e.g., IGFET, MISFET, MOSFET, etc.):
This subclass is indented under subclass 142. Process for making a field effect transistor wherein the gate electrode is electrically insulated from the semiconductive substrate, that portion of the semiconductive substrate therebeneath being the active channel region separating source and drain.

SEE OR SEARCH THIS CLASS, SUBCLASS:
151 for a process of making an insulated gate field effect transistor on an insulating substrate or layer
585 for insulated gate metallization processes, per se.

Specified crystallos:graphic orientation:
This subclass is indented under subclass 197. Process wherein a given feature of the junction gate field effect device is formed in a definite crystallos:graphic orientation relative to the substrate.
(1) Note. Processes of making a transistor in a semiconductor substrate of given orientation are not sufficient for placement in this subclass.

Complementary insulated gate field effect transistors (i.e., CMOS):
This subclass is indented under subclass 197. Process for making plural insulated gate field effect transistors of opposite conductivity type (i.e., wherein source and drain regions of a first field effect transistor are of opposite conductivity type to source and drain regions of a second field effect transistor).

And additional electrical device:
This subclass is indented under subclass 199. Process for making complementary insulated gate field effect transistors having combined therewith an additional electrical device.

Including insulated gate field effect transistor having gate surrounded by dielectric (i.e., floating gate):
This subclass is indented under subclass 200. Process for making complementary insulated gate field effect transistors having combined therewith an additional insulated gate field effect transistor possessing a gate electrode enclosed by dielectric.
(1) Note. Usually, the floating gate electrode is located (a) above and insulated from the channel region and (b) below and insulated from a controlling gate electrode. A floating gate electrode, due to accumulated electrical influence derived from the controlling gate electrode, provides on-off operation of the channel region. Floating gate arrangements are prevalent in ultraviolet erasable programmable read-only memory devices (i.e., EPROMs)

Including bipolar transistor (i.e., BiCMOS):
This subclass is indented under subclass 200. Process for making complementary insulated gate field effect transistors combined with a bipolar transistor.

Complementary bipolar transistors:
This subclass is indented under subclass 202. Process for making complementary insulated gate field effect transistors combined with a first bipolar transistor which additionally contains a second bipolar transistor which is of opposite conductivity type to the first bipolar transistor.

Lateral bipolar transistor:
This subclass is indented under subclass 202. Process for making complementary insulated gate field effect transistors additionally having a bipolar transistor possessing a horizontal-type structure so that current flow between its emitter and collector regions is parallel to a major surface of the semiconductor substrate.

Plural bipolar transistors of differing electrical characteristics:
This subclass is indented under subclass 202. Process for making complementary insulated gate field effect transistors combined with multiple bipolar transistors of differing electrical properties.

Vertical channel insulated gate field effect transistor:
This subclass is indented under subclass 202. Process for making complementary insulated gate field effect transistors combined with a bipolar transistor and wherein at least one
insulated gate field effect transistor possesses an active channel region which is configured to provide, at least in part, a vertically conductive pathway between source and drain regions.

Including isolation structure:
This subclass is indented under subclass 202. Process for making complementary insulated gate field effect transistors combined with a bipolar transistor having a structure serving to at least partially electrically isolate the semiconductive region in which one transistor is formed from laterally adjacent semiconductive regions.

Isolation by PN junction only:
This subclass is indented under subclass 207. Process for making complementary insulated gate field effect transistors combined with a bipolar transistor in which the transistors are electrically isolated solely through the use of properly biased PN junctions.

Including additional vertical channel insulated gate field effect transistor:
This subclass is indented under subclass 200. Process for making complementary insulated gate field effect transistors having combined therewith an additional field effect transistor having an active channel region configured to provide, at least in part, a vertically conductive pathway between source and drain regions.

Including passive device (e.g., resistor, capacitor, etc.):
This subclass is indented under subclass 200. Process for making complementary insulated gate field effect transistors having combined therewith a passive electrical device or element (i.e., an electrical device or component in which charge carriers do not change their energy levels and do not provide electrical rectification, amplification, or switching, but which does react to voltage and current
input).

Having gate surrounded by dielectric (i.e., floating gate):
This subclass is indented under subclass 199. Process for making complementary insulated gate field effect transistors wherein at least one field effect transistor has an additional insulated gate electrode completely separated by dielectric from its first insulated gate electrode.
(1) Note. Usually, the floating gate electrode is located (a) above and insulated from the channel region and (b) below and insulated from a controlling gate electrode. A floating gate electrode, due to accumulated electrical influence derived from the controlling gate electrode, provides on-off operation of the channel region. Floating gate arrangements are prevalent in ultraviolet erasable programmable read-only memory devices (i.e., EPROMs)

Vertical channel:
This subclass is indented under subclass 199. Process for making complementary insulated gate field effect transistors wherein the active channel region of at least one of the transistors is configured to provide, at least in part, a vertically conductive pathway between source and drain regions.

SEE OR SEARCH THIS CLASS, SUBCLASS:
268 for a process of making a vertical channel insulated gate field effect transistor.

Common active region:
This subclass is indented under subclass 199. Process for making complementary insulated gate field effect transistors wherein the transistors share a device active region.

Having underpass or crossunder:
This subclass is indented under subclass 199. Process for making complementary insulated gate field effect transistors having an electrically conductive structure located within the semiconductor substrate which functions to electrically connect the transistors.

Having fuse or integral short:
This subclass is indented under subclass 199. Process for making complementary field effect transistors having a structure which is alterable from the conductive to nonconductive state or functions to electrically short the transistor structure.

Gate insulator structure constructed of diverse dielectrics (e.g., MNOS, etc.) or of nonsilicon compound:
This subclass is indented under subclass 199. Process for making complementary insulated gate field effect transistors wherein the gate dielectric insulator of at least one of the transistors is constructed of plural diverse dielectrics (e.g., nitride and oxide layers, etc.) or of a nonsilicon containing dielectric compound.

Doping of semiconductor channel region beneath gate insulator (e.g., threshold voltage adjustment, etc.):
This subclass is indented under subclass 199. Process having a step of introducing an electrically active dopant species into the semiconductor active channel region beneath the gate insulator of at least one of the complementary insulated gate field effect transistors.

Including isolation structure:
This subclass is indented under subclass 199. Process for making complementary field effect transistors having a structure serving to at least partially electrically isolate the semiconductive region in which one transistor is formed from laterally adjacent semiconductive regions.

Total dielectric isolation:
This subclass is indented under subclass 218. Process for making complementary insulated gate field effect transistors in which at least one of the insulated gate complementary field effect transistors is fully electrically isolated by dielectric insulative material from laterally adjacent semiconductive regions.

Isolation by PN junction only:
This subclass is indented under subclass 218. Process for making complementary insulated gate field effect transistors in which the transistors are electrically isolated solely through the use of properly biased PN junctions.

Dielectric isolation formed by grooving and refilling with dielectric material:
This subclass is indented under subclass 218. Process for making complementary insulated gate field effect transistors wherein lateral isolation means is provided by forming a recess into the semiconductor substrate and refilling the recess at least in part with electrically insulative material.

With epitaxial semiconductor layer formation:
This subclass is indented under subclass 221. Process for making complementary insulated gate field effect transistors with dielectric isolation formed by grooving and refilling with dielectric material including a step of forming an epitaxial semiconductor layer.

Having well structure of opposite conductivity type:
This subclass is indented under subclass 221. Process for
making complementary insulated gate field effect transistors including a step of forming a well of opposite conductivity to the adjoining semiconductor region in which well is formed an insulated gate field effect transistor of opposite conductivity type to an insulated gate field effect transistor located in the adjoining semiconductor region.

Plural wells:
This subclass is indented under subclass 223. Process for making complementary insulated gate field effect transistors wherein plural wells of the same or opposite conductivity type are formed in the semiconductive substrate, each well utilized for formation therein of an insulated gate field effect transistor.

Recessed oxide formed by localized oxidation (i.e., LOCOS):
This subclass is indented under subclass 218. Process for making complementary insulated gate field effect transistors wherein lateral isolation means is provided by a step of selectively oxidizing semiconductive regions of the substrate.

With epitaxial semiconductor layer formation:
This subclass is indented under subclass 225. Process for making complementary insulated gate field effect transistors with dielectric isolation formed by selectively oxidizing semiconductive regions of the substrate combined with a step of forming an epitaxial semiconductor layer.

Having well structure of opposite conductivity type:
This subclass is indented under subclass 225. Process for making complementary insulated gate field effect transistors including a step of forming a well of opposite conductivity to the adjoining semiconductor regions in which well is formed an insulated gate field effect transistor of opposite conductivity type to an insulated gate field effect transistor located in the adjoining semiconductor region.

Plural wells:
This subclass is indented under subclass 227. Process for making complementary insulated gate field effect transistors wherein plural wells of the same or opposite conductivity type are formed in the semiconductive substrate, each well utilized for formation therein of an insulated gate field effect transistor.

Self-aligned:
This subclass is indented under subclass 199. Process for making complementary insulated gate field effect transistors wherein a previously formed device feature is utilized to make device regions in the desired registration to the previously formed feature.
(1) Note. A self-aligned gate is one which is aligned between the source and drain via a masking process which uses the gate material itself to achieve the registration of related device regions.

Utilizing gate sidewall structure:
This subclass is indented under subclass 229. Process with a step of utilizing a structure located on the sidewall of the gate electrode as the previously formed device feature.

Plural doping steps:
This subclass is indented under subclass 230. Process including multiple steps of introducing electrically active dopant species into semiconductor regions of the substrate.

Plural doping steps:
This subclass is indented under subclass 229. Process including multiple steps of introducing electrically active dopant species into semiconductor regions of the substrate.

And contact formation:
This subclass is indented under subclass 199. Process for making complementary insulated gate field effect transistors including a step of forming electrical connections to the transistors.

Including bipolar transistor (i.e., BiMOS):
This subclass is indented under subclass 197. Process for making an insulated gate field effect transistor having combined therewith a bipolar transistor.

Heterojunction bipolar transistor:
This subclass is indented under subclass 234. Process for making an insulated gate field effect transistor combined with a bipolar transistor wherein the emitter-base junction or the collector-base junction of the bipolar transistor possesses an interface between two dissimilar semiconductor materials.

Lateral bipolar transistor:
This subclass is indented under subclass 234. Process for making an insulated gate field effect transistor combined with a bipolar transistor which has a horizontal-type structure resulting in current flow between its emitter and collector regions parallel to a major surface of the semiconductor substrate.

Including diode:
This subclass is indented under subclass 197. Process for making an insulated gate field effect transistor having combined therewith a diode device or element.

Including passive device (e.g., resistor, capacitor, etc.):
This subclass is indented under subclass 197. Process for making an insulated gate field effect transistor having combined therewith an electrical device or component in which charge carriers do not change their energy levels and do not provide electrical rectification, amplification, or switching, but which does react to voltage and current input.

SEE OR SEARCH THIS CLASS, SUBCLASS:
273 for a process of making an insulated gate field effect transistor which possesses an integral short of the active regions of a single transistor.

Capacitor:
This subclass is indented under subclass 238. Process for making an insulated gate field effect transistor having combined therewith a capacitor as the passive device.

Having high dielectric constant insulator (e.g., Ta[subscrpt]2[end subscrpt]O[subscrpt]5[end subscrpt], etc.):
This subclass is indented under subclass 239. Process wherein the capacitor dielectric is constructed of a material having a dielectric constant of greater than 7.5, the dielectric constant of Si[subscrpt]3[end subscrpt]N[subscrpt]4[end subscrpt].

And additional field effect transistor (e.g., sense or access transistor, etc.):
This subclass is indented under subclass 239. Process for making an insulated gate field effect transistor having
combined therewith a capacitor and an additional field effect transistor.

SEE OR SEARCH THIS CLASS, SUBCLASS:
258 for process of making a floating gate-type insulated gate field effect transistor having combined therewith an additional insulated gate field effect transistor.

Including transistor formed on trench sidewalls:
This subclass is indented under subclass 241. Process wherein the additional diverse field effect transistor is formed on the side-walls of a groove formed in the semiconductor substrate.
(1) Note. The access transistor serves to sense the storage of electrical charges on the capacitor.

Trench capacitor:
This subclass is indented under subclass 239. Process for making an insulated gate field effect transistor combined with a capacitor which is located in a groove in the semiconductor substrate.

SEE OR SEARCH CLASS:
257, Active Solid-State Devices (e.g., Transistors, Solid-State Diodes), 301 for an insulated gate field effect transistor combined with a trench capacitor.

Utilizing stacked capacitor structure (e.g., stacked trench, buried stacked capacitor, etc.):
This subclass is indented under subclass 243. Process wherein the trench capacitor contains a number of capacitor plate regions aligned vertically above each other or wherein the capacitor and the insulated gate field effect transistor are located such that one overlies the other.

With epitaxial layer formed over the trench:
This subclass is indented under subclass 243. Process including a step of forming an epitaxial semiconductive layer over the trench region.

Including doping of trench surfaces:
This subclass is indented under subclass 243. Process having a step of introducing electrically active dopant species into the surfaces of the groove in which the capacitor is located.

SEE OR SEARCH THIS CLASS, SUBCLASS:
524 for a process of implanting a dopant into a grooved semiconductive region.

Multiple doping steps:
This subclass is indented under subclass 246. Process utilizing plural steps of introducing electrically active dopant species into the trench surfaces.

Including isolating means formed in trench:
This subclass is indented under subclass 246. Process including forming a structure functioning as electrical isolation means at the groove bottom.

Doping by outdiffusion from a dopant source layer (e.g., doped oxide, etc.):
This subclass is indented under subclass 246. Process wherein doping the trench surfaces is via diffusion from an adjacent dopant source layer formed thereupon.

Planar capacitor:
This subclass is indented under subclass 239. Process for making an insulated gate field effect transistor combined with a capacitor wherein a generally planar region of the semiconductive substrate forms a first capacitor plate with the capacitor dielectric and a second capacitor plate formed thereupon.

Including doping of semiconductive region:
This subclass is indented under subclass 250. Process having a step of introducing an electrically active dopant species into a semiconductive region of the substrate forming the first capacitor plate.

Multiple doping steps:
This subclass is indented under subclass 251. Process having plural steps of introducing electrically active dopant species into a semiconductive region of the substrate forming the first capacitor plate.

Stacked capacitor:
This subclass is indented under subclass 239. Process for making an insulated gate field effect transistor in combination with a capacitor containing a number of capacitor plate and dielectric layers deposited successively one atop another and overlying the field effect transistor.

SEE OR SEARCH CLASS:
257, Active Solid-State Devices (e.g., Transistors, Solid-State Diodes), 306 for an insulated gate field effect transistor combined with a stacked capacitor.

Including selectively removing material to undercut and expose storage node layer:
This subclass is indented under subclass 253. Process having
a step of selectively removing material (e.g., by etching, etc.) to undercut and expose the capacitor electrode which serves as the storage node layer of the stacked capacitor.
(1) Note. The capacitor electrode on which the electrical charge is stored is referred to as the storage node layer.

Including texturizing storage node layer:
This subclass is indented under subclass 253. Process having a step of roughening the surface of the capacitor plate which serves as the storage node layer of the stacked capacitor.
(1) Note. The capacitor electrode on which the electrical charge is stored is referred to as the storage node layer.

Contacts formed by selective growth or deposition:
This subclass is indented under subclass 253. Process wherein electrical contacts are formed by selective growth or deposition of conductive material onto the semiconductor substrate.

Having additional gate electrode surrounded by dielectric (i.e., floating gate):
This subclass is indented under subclass 197. Process for making an insulated gate field effect transistor wherein an additional gate electrode completely separated by dielectric from a first insulated gate electrode is formed.
(1) Note. Usually, the floating gate electrode is located (a) above and insulated from the channel region and (b) below and insulated from a controlling gate electrode that determines operation of the floating gate electrode. A floating gate electrode, due to accumulated electrical influence derived from the controlling gate electrode, provides on-off operation of the channel region. Floating gate arrangements are prevalent in ultraviolet erasable programmable read-only memory devices (i.e., EPROMs).

SEE OR SEARCH THIS CLASS, SUBCLASS:
201 for a process of making complementary insulated gate field effect transistors combined with an additional floating
gate-type insulated gate field effect transistor.

Including additional field effect transistor (e.g., sense or access transistor, etc.):
This subclass is indented under subclass 257. Process for making a floating gate-type insulated gate field effect transistor having combined therewith an additional field effect transistor.

SEE OR SEARCH THIS CLASS, SUBCLASS:
241 for a process of making an insulated gate field effect transistor combined with a capacitor which structure contains an additional insulated gate field effect transistor.

Including forming gate electrode in trench or recess in substrate:
This subclass is indented under subclass 257. Process for making a floating gate type insulated gate field effect transistor including forming a gate electrode in a groove located in the semiconductor substrate.

Textured surface of gate insulator or gate electrode:
This subclass is indented under subclass 257. Process for making a floating gate-type insulated gate field effect transistor wherein a roughened surface is utilized for the gate insulator or gate electrode.

Multiple interelectrode dielectrics or nonsilicon compound gate insulator:
This subclass is indented under subclass 257. Process for making a floating gate-type insulated gate field effect transistor with plural interelectrode dielectrics or a nonsilicon compound dielectric material.

SEE OR SEARCH THIS CLASS, SUBCLASS:
287 for a process of making an insulated gate field effect transistor having the gate insulator constructed of diverse dielectrics or of a nonsilicon compound dielectric.

Including elongated source or drain region disposed under thick oxide regions (e.g., buried or diffused bitline, etc.):
This subclass is indented under subclass 257. Process for making a floating gate-type insulated gate field effect transistor having elongated source or drain region located under thick oxide dielectric regions.
(1) Note. The regions disposed under the thick oxide regions must be active source or drain regions rather than channel stops serving to electrically isolate laterally spaced FETs.

SEE OR SEARCH THIS CLASS, SUBCLASS:
294 for a process of making an insulated gate field effect transistor including dielectric isolation structure.

Tunneling insulator:
This subclass is indented under subclass 262. Process for making a floating gate type insulated gate field effect transistor including an insulative layer adjacent the gate electrode which allows passage of charge carriers therethrough.

Tunneling insulator:
This subclass is indented under subclass 257. Process for making a floating gate-type insulated gate field effect transistor including an insulative layer adjacent the gate electrode which allows passage of charge carriers therethrough.

Oxidizing sidewall of gate electrode:
This subclass is indented under subclass 257. Process for making a floating gate-type field effect transistor including a step of forming a dielectric sidewall on the gate electrode by reacting the gate electrode material with oxygen.

Having additional, nonmemory control electrode or channel portion (e.g., for accessing field effect transistor structure, etc.):
This subclass is indented under subclass 257. Process for making a floating gate-type field effect transistor having an additional, nonmemory control electrode (i.e., having direct electrical contact thereto) or channel portion.

SEE OR SEARCH CLASS:
257, Active Solid-State Devices (e.g., Transistors, Solid-State Diodes), subclass 316 for a floating gate memory device with an additional contacted control electrode.

Including forming gate electrode as conductive sidewall spacer to another electrode:
This subclass is indented under subclass 266. Process including a step of forming a conductive electrode on the sidewall of another electrode wherein the conductive sidewall serves as a gate electrode.

Vertical channel:
This subclass is indented under subclass 197. Process for making a insulated gate field effect transistor wherein the active channel is configured to provide, in whole or in part, a vertically conductive pathway between source and drain regions.

Utilizing epitaxial semiconductor layer grown through an opening in an insulating layer:
This subclass is indented under subclass 268. Process for making an insulated gate field effect transistor wherein a
epitaxial semiconductor layer is deposited through an opening in an insulating layer upon a semiconductor substrate.

Gate electrode in trench or recess in semiconductor substrate:
This subclass is indented under subclass 268. Process for making an insulated gate field effect transistor wherein the gate electrode is formed in a groove or recess in the semiconductor substrate.

SEE OR SEARCH THIS CLASS, SUBCLASS:
259 for a process of making a floating gate-type insulated gate field effect transistor having a gate electrode formed in a groove located in the semiconductive substrate.

V-gate:
This subclass is indented under subclass 270. Process for making an insulated gate field effect transistor wherein the gate electrode has a V-shape configuration.

Totally embedded in semiconductive layers:
This subclass is indented under subclass 270. Process wherein the gate electrode is surrounded on all sides by semiconductive layers.

Having integral short of source and base regions:
This subclass is indented under subclass 268. Process for making an insulated gate field effect transistor having an integral electrical connection between the source and base (i.e., substrate) regions.

Short formed in recess in substrate:
This subclass is indented under subclass 273. Process wherein the integral short is formed in a groove in the semiconductor substrate

Making plural insulated gate field effect transistors of differing electrical characteristics:
This subclass is indented under subclass 197. Process for making multiple insulated gate field effect transistors of differing electrical characteristics.

SEE OR SEARCH THIS CLASS, SUBCLASS:
128 for processes of selectively wiring an array of electrical devices by completing particular devices of the array or by completion or destruction of conductive pathways between particular devices of the array.

Introducing a dopant into the channel region of selected transistors:
This subclass is indented under subclass 275. Process for making plural insulated gate field effect transistors having a step of introducing an electrically active dopant species into the semiconductor channel region beneath the gate insulator of one or more transistors to produce transistors of differing electrical characteristics.

SEE OR SEARCH THIS CLASS, SUBCLASS:
130 for processes of rendering electrical devices in an array operable or inoperable by electrically completing or electrically shorting designated devices thereof to selectively interconnect the array.
289 for a process of doping the semiconductor channel region beneath gate insulator to (a) produce field effect transistors of identical electrical characteristics or (b) alter the electrical characteristics of a single field effect transistor.

Including forming overlapping gate electrodes:
This subclass is indented under subclass 276. Process for
making plural insulated gate field effect transistors of differing electrical characteristics including a step of forming overlapping gate electrodes.

After formation of source or drain regions and gate electrode (e.g., late programming, encoding, etc.):
This subclass is indented under subclass 276. Process for making plural insulated gate field effect transistors of differing electrical characteristics wherein the semiconductor channel region is doped subsequent to the formation of the source and drain regions and the gate electrode.

Making plural insulated gate field effect transistors having common active region:
This subclass is indented under subclass 197. Process for making multiple insulated gate field effect transistors in which a transistor active region is shared between two or more field effect transistors.

Having underpass or crossunder:
This subclass is indented under subclass 197. Process for making an insulated gate field effect transistor electrically interconnected to an adjoining electrical device via a conductive structure located within the semiconductor substrate.

SEE OR SEARCH THIS CLASS, SUBCLASS:
214 for a process of making complementary insulated gate field effect transistors combined with an underpass or crossunder.

Having fuse or integral short:
This subclass is indented under subclass 197. Process for making an insulated gate field effect transistor which possesses a structure alterable to a nonconductive state
(i.e., fuse) or an integral electrical connection between source and gate regions or between drain and gate regions.

SEE OR SEARCH THIS CLASS, SUBCLASS:
132 for a process of making an array of electrical devices and selectively interconnecting the devices via fusible links.
238 for a process of making an insulated gate field effect transistor combined with a resistor.

Buried channel:
This subclass is indented under subclass 197. Process for making an insulated gate field effect transistor wherein the channel formed between the source and drain regions is configured so as to be located beneath the semiconductor substrate surface.

Plural gate electrodes (e.g., dual gate, etc.):
This subclass is indented under subclass 197. Process for making an insulated gate field effect transistor wherein plural gate electrodes on either the same or opposite side of the active channel region serve to control the electrical conduction characteristics of the semiconductive active channel region.

SEE OR SEARCH THIS CLASS, SUBCLASS:
157 for a process of making an insulated gate field effect transistor upon an insulating substrate or layer wherein the transistor possesses dual gate or opposed gate structure.

Closed or loop gate:
This subclass is indented under subclass 197. Process for making an insulated gate field effect transistor wherein the gate electrode is configured such that it closes upon itself to thereby totally surround one of the device active regions.

Utilizing compound semiconductor:
This subclass is indented under subclass 197. Process for making an insulated gate field effect transistor utilizing a compound semiconductor active region.

Asymmetric:
This subclass is indented under subclass 197. Process for making an insulated gate field effect transistor wherein the pair of active regions are offset or nonsymmetrical with respect to the centerline of the insulated gate electrode.

Gate insulator structure constructed of diverse dielectrics (e.g., MNOS, etc.) or of nonsilicon compound:
This subclass is indented under subclass 197. Process for making an insulated gate field effect transistor wherein the gate dielectric insulator is constructed of plural diverse dielectrics (e.g., nitride and oxide, etc.) or of a nonsilicon containing dielectric compound.

SEE OR SEARCH THIS CLASS, SUBCLASS:
216 for a process of making complementary insulated gate field effect transistors at least one transistor having a gate insulator structure constructed of diverse dielectrics or of nonsilicon compound.
261 for a process of making a floating gate-type insulated gate field effect transistor having multiple interelectrode dielectrics or nonsilicon containing dielectric.

Having step of storing electrical charge in gate dielectric:
This subclass is indented under subclass 197. Process for making an insulated gate field effect transistor having an active step of storing electrical charge in the gate dielectric insulator.

Doping of semiconductive channel region beneath gate insulator (e.g., adjusting threshold voltage, etc.):
This subclass is indented under subclass 197. Process for making an insulated gate field effect transistor having a step of introducing electrically active dopant species into the semiconductor active channel region beneath the gate insulator.

SEE OR SEARCH THIS CLASS, SUBCLASS:
276 for a process of doping the semiconductor channel region beneath gate insulator of selected transistors to make plural field effect transistors of differing electrical characteristics.

After formation of source or drain regions and gate electrode:
This subclass is indented under subclass 289. Process wherein the semiconductor channel region is doped subsequent to the formation of the source and drain regions and the gate electrode.

Using channel conductivity dopant of opposite type as that of source and drain:
This subclass is indented under subclass 289. Process wherein the dopant and the semiconductor active channel region beneath the gate insulator are of the same conductivity type.

Direct application of electrical current:
This subclass is indented under subclass 197. Process for making an insulated gate field effect transistor having a step of directly applying an electrical current to the semiconductor substrate.

SEE OR SEARCH THIS CLASS, SUBCLASS:
17 for a step of measuring involving aging electrical devices formed on a semiconductor substrate via the direct application of electrical current.

Fusion or solidification of semiconductor region:
This subclass is indented under subclass 197. Process for making an insulated gate field effect transistor having a step of fusing or solidifying a semiconductive region of the substrate.

Including isolation structure:
This subclass is indented under subclass 197. Process for making an insulated gate field effect transistor having a structure which serves to at least partially electrically isolate the semiconductor region in which the device is formed from laterally adjacent semiconductive regions.

SEE OR SEARCH THIS CLASS, SUBCLASS:
400 for processes of forming an electrically isolated lateral semiconductor structure utilizing dielectric or junction isolation.

Total dielectric isolation:
This subclass is indented under subclass 294. Process for making an insulated gate field effect transistor which is fully electrically isolated by dielectric insulative material from laterally adjacent semiconductive regions.

Dielectric isolation formed by grooving and refilling with dielectric material:
This subclass is indented under subclass 294. Process for making an insulated gate field effect transistor including the step of forming an isolation structure by making a recess in the semiconductor substrate and refilling the recess with an insulative material.

Recessed oxide formed by localized oxidation (i.e., LOCOS):
This subclass is indented under subclass 294. Process for making an insulated gate field effect transistor including the step of oxidizing a selected region of a semiconductive substrate to form an embedded oxide (e.g., field oxide) therein which forms the periphery of a semiconductive region utilized for the formation of the field effect transistor.

Doping region beneath recessed oxide (e.g., to form chanstop, etc.):
This subclass is indented under subclass 297. Process including a step of introducing electrically active dopant species into the semiconductor substrate region beneath the recessed oxide (e.g., to form a channel stop thereby preventing electric field inversion beneath the recessed oxide, etc.).

Self-aligned:
This subclass is indented under subclass 197. Process for making an insulated gate field effect transistor wherein a previously formed device feature is utilized to make device regions in the desired registration to the previously formed feature.
(1) Note. A self-aligned gate is one which is aligned between the source and drain via a masking process which uses the gate material itself to achieve the registration of the related device regions.

Having elevated source or drain (e.g., epitaxially formed source or drain, etc.):
This subclass is indented under subclass 299. Process including a step of forming the source or drain active region at a position above and laterally adjacent to the channel region of the transistor.

Source or drain doping:
This subclass is indented under subclass 299. Process having a step for the self-aligned introduction of electrically active dopant species into the semiconductor regions of the substrate to form the transistor source or drain regions or portions thereof.

Oblique implantation:
This subclass is indented under subclass 301. Process involving implanting ions other than perpendicularly with respect to the plane of the substrate.

Utilizing gate sidewall structure:
This subclass is indented under subclass 301. Process having structure on the sidewall of the gate electrode or gate insulator which is utilized as the previously formed device feature.

Conductive sidewall component:
This subclass is indented under subclass 303. Process wherein the gate sidewall structure is composed at least in part of a conductive component.

Plural doping steps:
This subclass is indented under subclass 303. Process including multiple steps of introducing dopant species into the semiconductive regions of the substrate.

Plural doping steps:
This subclass is indented under subclass 301. Process including multiple steps of introducing dopant species into
the semiconductive regions of the substrate.

Using same conductivity-type dopant:
This subclass is indented under subclass 306. Process wherein the same conductivity-type electrically active dopant is introduced using plural doping steps.

Radiation or energy treatment modifying properties of semiconductor regions of substrate (e.g., thermal, corpuscular, electromagnetic, etc.):
This subclass is indented under subclass 197. Process for making an insulated gate field effect transistor having a step of irradiating the semiconductor substrate to alter the electrical properties of semiconductive regions thereof.

SEE OR SEARCH THIS CLASS, SUBCLASS:
795 for a process of modifying properties of semiconductive regions of the substrate via radiation or energy treatment.

FORMING BIPOLAR TRANSISTOR BY FORMATION OR ALTERATION OF SEMICONDUCTIVE ACTIVE REGIONS:
This subclass is indented under the class definition. Process for forming a transistor structure which upon completion possesses a base region separating two or more active regions and in which both positive and negative charge carriers are used to support current flow.
(1) Note. To be proper hereunder, the claim must include a positive recitation of (a) formation of semiconductive active regions or (b) altering the electrical properties of active semiconductive regions of the substrate.
(2) Note. The regions of a bipolar transistor are commonly referred to as collector, base, and emitter. A bipolar device may alternatively be identified by the semiconductive regions from which the device is formed (i.e., a NPN or PNP device). [figure]

SEE OR SEARCH THIS CLASS, SUBCLASS:
170 for a process of making a Schottky gate field effect
transistor combined with a bipolar transistor.
189 for a process of making a junction gate field effect transistor combined with a bipolar transistor.
202 for a process of making complementary insulated gate field effect transistors combined with a bipolar transistor.
234 for a process of making an insulated gate field effect transistor combined with a bipolar transistor.

SEE OR SEARCH CLASS:
257, Active Solid-State Devices (e.g., Transistors, Solid-State Diodes), subclass 47, 197, 205, 273, 350, 361, 370, 378, 423, 462, 477+, 511, 512, 517, 518, 525, 526, 539+, and 552+ for a bipolar transistor structure.

Gettering of semiconductor substrate:
This subclass is indented under subclass 309. Process having a step of gettering the semiconductor substrate.

On insulating substrate or layer (i.e., SOI type):
This subclass is indented under subclass 309. Process for making a bipolar transistor wherein the transistor is formed upon an insulating substrate (e.g., glass, sapphire, etc.) or layer.

Having heterojunction:
This subclass is indented under subclass 309. Process for making a bipolar transistor wherein the emitter-base or the collector-base junction is an interface of two dissimilar semiconductor materials resulting in a heterojunction therebetween.

SEE OR SEARCH THIS CLASS, SUBCLASS:
235 for a process of making an insulated gate field effect transistor combined with a heterojunction bipolar transistor.

SEE OR SEARCH CLASS:
257, Active Solid-State Devices (e.g., Transistors, Solid-State Diodes), 197 for a heterojunction bipolar transistor structure.

Complementary bipolar transistors:
This subclass is indented under subclass 312. Process for making a structure which comprises plural bipolar transistors wherein the emitter and collector regions of a first bipolar transistor are of opposite conductivity type to the emitter and collector regions of a second bipolar transistor.(i.e., both pnp and npn bipolar transistor structures), at least one of which possesses a heterojunction.

And additional electrical device:
This subclass is indented under subclass 312. Process for making a heterojunction bipolar transistor and an additional electrical device.

Forming inverted transistor structure:
This subclass is indented under subclass 312. Process forming a heterojunction bipolar transistor structure in which a semiconductor body such as a semiconductor substrate or a semiconductor layer is used as its emitter region, a first semiconductor region formed in the semiconductor body is used as the base region and a second semiconductor region formed in the first semiconductor region is used as the collector region.

Forming lateral transistor structure:
This subclass is indented under subclass 312. Process for making a heterojunction bipolar transistor which has a horizontal structure resulting in current flow between its emitter and collector parallel to a major surface of the semiconductor substrate.

Wide bandgap emitter:
This subclass is indented under subclass 312. Process for making a heterojunction bipolar transistor with an active region which involves a charge carrier emitter region made of a semiconductor material having an energy gap between its conduction and valence band which is greater than the energy gap of the dissimilar semiconductor material of the base region.

SEE OR SEARCH CLASS:
257, Active Solid-State Devices (e.g., Transistors, Solid-State Diodes), subclass 198 for a wide band-gap emitter heterojunction bipolar transistor structure.

Including isolation structure:
This subclass is indented under subclass 312. Process for making a heterojunction bipolar transistor which has structure so as to at least partially electrically isolate the device from laterally adjacent semiconductor regions.

SEE OR SEARCH THIS CLASS, SUBCLASS:
353 for an electrical isolation process in a nonheterojunction bipolar device.

Air isolation (e.g., mesa, etc.):
This subclass is indented under subclass 318. Process for making a heterojunction bipolar transistor wherein the emitter or collector region of the device is a raised feature with respect to the plane of the substrate.

SEE OR SEARCH THIS CLASS, SUBCLASS:
343 for a process of making a nonheterojunction bipolar device having a mesa or stacked emitter.

Self-aligned:
This subclass is indented under subclass 312. Process for making a heterojunction bipolar transistor wherein a previously formed device feature is utilized to make device regions in the desired registration to the previously formed feature.

Utilizing dummy emitter:
This subclass is indented under subclass 320. Process for making a heterojunction bipolar transistor wherein a substitute emitter is formed or removed prior to the forming of the active emitter region of the device.

Complementary bipolar transistors:
This subclass is indented under subclass 309. Process for making plural bipolar transistors wherein the emitter and collector regions or a first bipolar transistor are of opposite conductivity type to the emitter and collector regions of a second bipolar transistor.

Having common active region (i.e., integrated injection logic (I[supscrpt]2[end supscrpt]L), etc.):
This subclass is indented under subclass 322. Process for making complementary bipolar transistors which possess a common active region.

Including additional electrical device:
This subclass is indented under subclass 323. Process for making complementary bipolar transistors with shared common region having combined therewith an additional electrical device.

Having lateral bipolar transistor:
This subclass is indented under subclass 323. Process for making complementary bipolar transistors with shared common region wherein at least one of the bipolar transistors has a horizontal structure resulting in current flow between its emitter and collector parallel to a major surface of the semiconductor substrate.

Including additional electrical device:
This subclass is indented under subclass 322. Process for making complementary bipolar transistors having combined therewith an additional electrical device.

Having lateral bipolar transistor:
This subclass is indented under subclass 322. Process for making complementary bipolar transistors wherein at least one of the bipolar transistors has a horizontal structure resulting in current flow between its emitter and collector parallel to a major surface of the semiconductor substrate.

Including diode:
This subclass is indented under subclass 309. Process for making a bipolar transistor having combined therewith a diode.

Including passive device (e.g., resistor, capacitor, etc.):
This subclass is indented under subclass 309. Process for making a bipolar transistor having combined therewith an electrical device or component in which charge carriers do not change their energy levels and do not provide electrical rectification, amplification, or switching, but which does react to voltage and current input.

Resistor:
This subclass is indented under subclass 329. Process for making a bipolar transistor combined with a resistive element or component.

SEE OR SEARCH CLASS:
257, Active Solid-State Devices (e.g., Transistors, Solid-State Diodes), 539, 577, and 582 for bipolar transistor structure combined with a resistive element.

Having same doping as emitter or collector:
This subclass is indented under subclass 330. Process wherein the resistor region has the same doping profile (i.e., is formed in the same step) as either the emitter or collector region of the bipolar transistor with which the resistor is combined.
(1) Note. Most resistors in bipolar integrated circuits are formed with the same doping step as the bipolar transistor base regions. Resistors that are instead formed at the same doping step as the emitter or collector, rather than the base, go in this subclass.

Lightly doped junction isolated resistor:
This subclass is indented under subclass 330. Process wherein the resistive element is in the form of a lightly doped layer of one conductivity type located in a region of opposite conductivity type, such that the pn junction between the resistor region and its containing opposite conductivity-type region serves to electrically isolate the resistor.
(1) Note. A resistor region is considered to be lightly doped if it is substantially less heavily doped than the base region of the bipolar transistor combined therewith, or if it has a doping density not greater than 100 times that of the opposite conductivity-type region in which it is contained.

Having fuse or integral short:
This subclass is indented under subclass 309. Process for making a bipolar transistor which possesses a structure which
is alterable from a conductive to a nonconductive state (i.e., fuse) or an integral electrical short between the collector and emitter active regions or between the base and emitter active regions.

SEE OR SEARCH THIS CLASS, SUBCLASS:
132 for a process of making an array of electrical devices and selectively interconnecting the devices via fusible links.

Forming inverted transistor structure:
This subclass is indented under subclass 309. Process forming a bipolar transistor structure in which a semiconductor body such as a semiconductor substrate or a semiconductor layer is used as its emitter region, a first semiconductor region formed in the semiconductor body is used as the base region and a second semiconductor region formed in the first semiconductor region is used as the collector region.

SEE OR SEARCH THIS CLASS, SUBCLASS:
315 for a process of making a heterojunction bipolar transistor having an inverted structure.

Forming lateral transistor structure:
This subclass is indented under subclass 309. Process for making a bipolar transistor wherein the transistor has a horizontal structure resulting in current flow between its emitter and collector parallel to a major surface of the semiconductor substrate.

SEE OR SEARCH THIS CLASS, SUBCLASS:
204 for a process of making complementary insulated gate field effect transistors combined with a lateral bipolar transistor.
236 for a process of making an insulated gate field effect transistor combined with a lateral bipolar transistor.
327 for a process of making a structure comprising complementary bipolar transistors one of which possesses a lateral transistor structure.

SEE OR SEARCH CLASS:
257, Active Solid-State Devices (e.g., Transistors, Solid-State Diodes), 557 for a lateral bipolar transistor structure.

Combined with vertical bipolar transistor:
This subclass is indented under subclass 335. Process for making a lateral bipolar transistor combined with a vertical bipolar transistor having current flow between its emitter and collector perpendicular to a major surface of the semiconductor substrate.

Active region formed along groove or exposed edge in semiconductor:
This subclass is indented under subclass 335. Process for making a lateral bipolar transistor wherein the transistor has a recess or exposed edge and an active region of the transistor is formed along the recess or exposed edge.

Having multiple emitter or collector structure:
This subclass is indented under subclass 335. Process for making a lateral bipolar transistor having plural emitter active regions or plural collector active regions.

Self-aligned:
This subclass is indented under subclass 335. Process for making a lateral bipolar transistor wherein a previously formed device feature is utilized to make device active regions in the desired registration to the previously formed feature.

Making plural bipolar transistors of differing electrical characteristics:
This subclass is indented under subclass 309. Process for making multiple bipolar transistors possessing differing electrical properties.

Using epitaxial lateral overgrowth:
This subclass is indented under subclass 309. Process for making a bipolar transistor including forming a single crystalline semiconductor layer epitaxially on the semiconductor substrate and laterally over an insulative layer thereupon.

SEE OR SEARCH THIS CLASS, SUBCLASS:
481 for a process utilizing fluid growth or deposition of semiconductor active material onto an insulating layer by epitaxial lateral overgrowth.

Having multiple emitter or collector structure:
This subclass is indented under subclass 309. Process for making a bipolar transistor having plural emitter active regions or plural collector active regions.

SEE OR SEARCH CLASS:
257, Active Solid-State Devices (e.g., Transistors, Solid-State Diodes), 563 for multiple separately connected emitter, collector, or base regions in the same transistor structure.

Mesa or stacked emitter:
This subclass is indented under subclass 309. Process for making a bipolar transistor wherein the emitter is a raised feature relative to the adjoining semiconductive regions.

SEE OR SEARCH CLASS:
257, Active Solid-State Devices (e.g., Transistors, Solid-State Diodes), subclass 586 for a bipolar transistor structure with a nonplanar semiconductor surface (e.g., groove, mesa, bevel, etc.).

Washed emitter:
This subclass is indented under subclass 309. Process wherein the surface of the semiconductive substrate is etched to remove oxide layers formed on the emitter region during emitter diffusion thus allowing an aperature used for diffusing the emitter impurity to be directly utilized as the aperature for electrical contact formation.

Walled emitter:
This subclass is indented under subclass 309. Process for making a bipolar transistor wherein the emitter-base junction terminates against a dielectric isolation sidewall.

SEE OR SEARCH CLASS:
257, Active Solid-State Devices (e.g., Transistors, Solid-State Diodes), especially subclass 514 and 515 for walled emitter bipolar transistor structure.

Emitter dip prevention or utilization:
This subclass is indented under subclass 309. Process involving special diffusion techniques to eliminate or utilize the tendency of the base-collector junction to "bulge" downward during the emitter diffusion.

Permeable or metal base:
This subclass is indented under subclass 309. Process for making a bipolar transistor wherein the base region incompletely separates the collector and emitter regions, or is constructed of a metallic material.

SEE OR SEARCH THIS CLASS, SUBCLASS:
192 for a method of making a vertical junction gate field effect transistor.

Sidewall base contact:
This subclass is indented under subclass 309. Process for making a bipolar transistor wherein a conductive layer serving as the base electrode makes contact to the sidewall of the base region.

Pedestal base:
This subclass is indented under subclass 309. Process for making a bipolar transistor wherein the base region is provided with a projecting portion.

Forming base region of specified dopant concentration profile (e.g., inactive base region more heavily doped than active base region, etc.):
This subclass is indented under subclass 309. Process for making a bipolar transistor with a semiconductor base region possessing a specified concentration profile of an electrically active dopant species contained therein.

SEE OR SEARCH CLASS:
257, Active Solid-State Devices (e.g., Transistors, Solid-State Diodes), subclass 592 for a bipolar transistor device having a base region possessing specified doping concentration profile.

Direct application of electrical current:
This subclass is indented under subclass 309. Process for making a bipolar transistor involving having a step of directly applying an electric current to the semiconductor substrate.

SEE OR SEARCH THIS CLASS, SUBCLASS:
17 for a step of measuring involving aging electrical devices formed on a semiconductor substrate via the direct application of electrical current.

Fusion or solidification of semiconductor region:
This subclass is indented under subclass 309. Process for making a bipolar transistor having a step of fusing or solidifying semiconductive regions of the substrate.

Including isolation structure:
This subclass is indented under subclass 309. Process for making a bipolar transistor having a structure which serves to at least partially electrically isolate the semiconductive region in which the transistor is formed from laterally adjacent semiconductive regions.

SEE OR SEARCH THIS CLASS, SUBCLASS:
400 for processes of forming an electrically isolated lateral semiconductor structure utilizing dielectric or junction isolation without a step of bipolar transistor manufacture.

Having semi-insulative region:
This subclass is indented under subclass 353. Process for making a bipolar transistor wherein the electrical isolation is provided at least in part by a high resistivity semiconductive component.

Total dielectrical isolation:
This subclass is indented under subclass 353. Process for making a bipolar transistor which is fully electrically isolated by dielectric insulative material from laterally adjacent semiconductive regions.

Isolation by PN junction only:
This subclass is indented under subclass 353. Process for making a bipolar transistor in a semiconductive region which is completely electrically isolated from laterally spaced regions of the semiconductor substrate solely through the use of properly biased PN junctions. [figure]

Including epitaxial semiconductor layer formation:
This subclass is indented under subclass 356. Process for making a junction isolated bipolar transistor utilizing the formation of an epitaxial semiconductor layer.

Up diffusion of dopant from substrate into epitaxial layer:
This subclass is indented under subclass 357. Process including a step of diffusing a dopant from the semiconductor substrate into the epitaxial layer form thereupon.

Dielectric isolation formed by grooving and refilling with dielectrical material:
This subclass is indented under subclass 353. Process for making a bipolar transistor involving the formation of a recess in the semiconductor followed by the refilling of the recess with an insulative material.

With epitaxial semiconductor formation in groove:
This subclass is indented under subclass 359. Process for making a bipolar transistor additionally involving the epitaxial deposition of a semiconductor material in the groove.

Including deposition of polysilicon or noninsulative material into groove:
This subclass is indented under subclass 359. Process for
making a bipolar transistor wherein a noninsulative material is deposited into the groove in addition to the insulative material.

Recessed oxide by localized oxidation (i.e., LOCOS):
This subclass is indented under subclass 353. Process for making a bipolar transistor including the step of oxidizing a portion of a semiconductive material to form an embedded oxide (i.e., field oxide) therein which forms the periphery of a semiconductive region utilized for the formation of the bipolar transistor.

With epitaxial semiconductor layer formation:
This subclass is indented under subclass 362. Process for making a bipolar transistor utilizing in addition to the recessed oxide the formation of an epitaxial semiconductor layer.

Self-aligned:
This subclass is indented under subclass 309. Process wherein a previously formed device feature is utilized to make device regions in the desired registration to the previously formed feature.

Forming active region from adjacent doped polycrystalline or amorphous semiconductor:
This subclass is indented under subclass 364. Process having an active region (e.g., base, emitter, or collector) formed of polycrystalline or amorphous semiconductor.

Having sidewall:
This subclass is indented under subclass 365. Process
including forming dielectric isolation on the sidewall of the base region to separate the base and collector regions.

Including conductive component:
This subclass is indented under subclass 366. Process wherein the sidewall is a combination of conductive and insulative components.

Simultaneously outdiffusing plural dopants from polysilicon or amorphous semiconductor:
This subclass is indented under subclass 365. Process including the simultaneous outdiffusing of electrically active dopants from the polysilicon or amorphous active region.

Dopant implantation or diffusion:
This subclass is indented under subclass 364. Process having a step of implanting or diffusing an electrically active dopant species into a semiconductive region of the substrate.

Forming buried region (e.g., implanting through insulating layer, etc.):
This subclass is indented under subclass 369. Process wherein the dopant is implanted or diffused through an insulating layer.

Simultaneous introduction of plural dopants:
This subclass is indented under subclass 369. Process involving the concurrent introduction of multiple dopant species into one or more semiconductive regions of the substrate.

Plural doping steps:
This subclass is indented under subclass 369. Process having multiple steps of doping semiconductive regions of the substrate.

Multiple ion implantation steps:
This subclass is indented under subclass 372. Process wherein the plural doping steps are affected by implanting electrically active dopant ions into semiconductive regions of the substrate.

Using same conductivity-type dopant:
This subclass is indented under subclass 373. Process wherein the same conductivity-type electrically active dopant ion is introduced using plural ion implantation steps.

Forming partially overlapping regions:
This subclass is indented under subclass 372. Process wherein the plural doping steps are affected upon localized areas which lap over each other in part.

Single dopant forming regions of different depth or concentrations:
This subclass is indented under subclass 372. Process wherein the plural doping steps form regions which differ in amount of impurity or the distance the impurity has to travel inwardly from the surface.

Through same mask opening:
This subclass is indented under subclass 372. Process wherein plural doping steps are affected through the same opening in a dopant masking layer.

Radiation or energy treatment modifying properties of semiconductor regions of substrate (e.g., thermal, corpuscular, electromagnetic, etc.):
This subclass is indented under subclass 309. Process for making a bipolar transistor having a step of irradiating the semiconductor substrate to alter the electrical properties of semiconductive regions thereof.

SEE OR SEARCH THIS CLASS, SUBCLASS:
795 for a process of modifying properties of semiconductive regions of the substrate via radiation or energy treatment.

VOLTAGE VARIABLE CAPACITANCE DEVICE MANUFACTURE (E.G., VARACTOR, ETC.):
This subclass is indented under the class definition. Process for making an active solid-state device wherein the device changes its capacitance depending on the amount of voltage applied thereto.

SEE OR SEARCH CLASS:
257, Active Solid-State Devices (e.g., Transistors, Solid-State Diodes), subclass 312 for an insulated gate FET combined with a voltage variable capacitor, subclass 480 for a Schottky barrier in a voltage variable capacitance diode, and subclasses 595+ for a voltage variable capacitance device.
332, Modulators, subclass 136 for a modulator combined with a voltage variable capacitor.
361, Electricity: Electrical Systems and Devices, 277 for a per se voltage variable capacitor (varactor).

AVALANCHE DIODE MANUFACTURE (E.G., IMPATT, TRAPPAT, ETC.):
This subclass is indented under the class definition. Process for making a device which is configured to operate in a manner in which an external voltage is applied in the reverse-conducting direction of the semiconductor device junction with sufficient magnitude to cause the potential barrier at the junction to breakdown due to electrons or holes gaining sufficient speed to dislodge valence electrons and thus create more hole-electron current carriers resulting in a sudden change from high dynamic electrical resistance to very low dynamic resistance.
(1) Note. The terms Zener diode and Zener breakdown voltage are used rather loosely in that the breakdown mechanism above about 6 volts is thought to be due to avalanching and that below about 6 volts is thought to be due essentially to tunnelling.

SEE OR SEARCH THIS CLASS, SUBCLASS:
91 for a process of making a device or circuit which is responsive to a nonelectrical signal and operates in an avalanche breakdown mode.

SEE OR SEARCH CLASS:
257, Active Solid-State Devices (e.g., Transistors, Solid-State Diodes), subclass 199 for an avalanche diode in a noncharge transfer device having a heterojunction, subclass 438 for a light-responsive avalanche junction device, subclass 481 for an avalanche diode having a Schottky barrier, subclass 551 for an avalanche diode used as a voltage reference element combined with pn junction isolation means in an integrated circuit, and subclasses 603+ for avalanche diodes in general.

MAKING PASSIVE DEVICE (E.G., RESISTOR, CAPACITOR, ETC.):
This subclass is indented under the class definition. Process for making an electrical device or component utilizing a semiconductor substrate in which charge carriers do not change their energy levels and that does not provide rectification, amplification, or switching, but which does react to voltage and current input.
(1) Note. Formation of a conductive layer of specified resistivity is not sufficient for placement hereunder unless the intent is for the layer to function as a discrete resistor element.
(2) Note. An isolation structure which functions by the application of an electrical bias (e.g., a channel stop, guard ring, or field plate region) is not a passive charge
storage element proper here for, nor is the floating gate structure of a field effect device.

SEE OR SEARCH THIS CLASS, SUBCLASS:
21 for making a device controlled ink jet printhead or thermal printhead.
50 for a process of making a pressure sensitive resistive device.
171 for a process of making a Schottky gate field effect transistor combined with a passive electrical device.
190 for a process of making a junction gate field effect transistor combined with a passive electrical device.
210 for a process of making complementary insulated gate field effect transistors combined with a passive electrical device.
238 for a process of making an insulated gate field effect transistor combined with a passive electrical device.
329 for a process of making a bipolar transistor combined with a passive electrical device.
379 for a process of making a voltage variable capacitance device.

SEE OR SEARCH CLASS:
264, Plastic and Nonmetallic Article Shaping or Treating: Processes, subclass 61 for methods of vitrifying or sintering of inorganic preform to make a discrete passive device (e.g., multilayer ceramic capacitor, etc.).

Resistor:
This subclass is indented under subclass 381. Process involving the manufacture of an electrically resistive element utilizing a semiconductor substrate.

SEE OR SEARCH THIS CLASS, SUBCLASS:
21 for a process of making an electrical resistor-type thermal printhead.
50 for a process of making a resistor responsive to physical stress.
238 for a process of making an insulated gate field effect transistor combined with a resistor device or element.
330 for making a bipolar transistor combined with a resistor device or element.

Lightly doped junction isolated resistor:
This subclass is indented under subclass 382. Process wherein the resistive element is in the form of a lightly doped layer of one conductivity type located in a region of opposite conductivity type, such that the pn junction between the resistor region and its containing opposite conductivity-type region serves to electrically isolate the resistor.

Deposited thin film resistor:
This subclass is indented under subclass 382. Process wherein the resistor is formed by the deposition of resistive material upon the semiconductor substrate.

SEE OR SEARCH CLASS:
427, Coating Processes, especially 96 for producing a printed circuit by coating and subclasses 101+ for producing a resistor for current control by coating onto a nonsemiconductive substrate.

Altering resistivity of conductor:
This subclass is indented under subclass 384. Process wherein the electrical resistivity of a conductive material (i.e., metallization) is altered subsequent to deposition.

Trench capacitor:
This subclass is indented under subclass 381. Process for making a capacitor located in a groove in a semiconductive substrate.

Having stacked capacitor structure (e.g., stacked trench, buried stacked capacitor, etc.):
This subclass is indented under subclass 386. Process wherein the trench capacitor contains a number of capacitor plate regions aligned vertically above each other.

With epitaxial layer formed over the trench:
This subclass is indented under subclass 386. Process for making a trench capacitor including a step of forming an epitaxial semiconductive layer over the trench region.

Including doping of trench surfaces:
This subclass is indented under subclass 386. Process for making a trench capacitor having a step of introducing electrically active dopant species into a surface (i.e., sidewall or bottom) of the trench in which the capacitor is located.

SEE OR SEARCH THIS CLASS, SUBCLASS:
524 for a process of implanting a dopant into a grooved semiconductive region.

Multiple doping steps:
This subclass is indented under subclass 389. Process for making a trench capacitor utilizing plural doping steps.

Including isolating means formed in trench:
This subclass is indented under subclass 389. Process for making a trench capacitor having structure functioning as electrical isolation formed in the trench bottom.

Doping by outdiffusion from a dopant source layer (e.g., doped oxide):
This subclass is indented under subclass 389. Process for making a trench capacitor wherein the trench surfaces are doped via outdiffusion from a doped source layer.

Planar capacitor:
This subclass is indented under subclass 386. Process for making a capacitor wherein a generally planar region of a semiconductive substrate forms a first capacitor plate with a dielectric layer and a second capacitor plate formed thereupon.

Including doping of semiconductive region:
This subclass is indented under subclass 393. Process for making a planar capacitor having a step of introducing electrically active dopant species into a semiconductive region of the substrate forming the first capacitor plate.

Multiple doping steps:
This subclass is indented under subclass 394. Process for making a planar capacitor utilizing plural steps of incorporating electrically active dopant species into a semiconductive region of the substrate forming the first capacitor plate.

Stacked capacitor:
This subclass is indented under subclass 386. Process for making a capacitor containing a number of capacitor plate and dielectric layers deposited successively one atop another.

Including selectively removing material to undercut and expose storage node layer:
This subclass is indented under subclass 396. Process for making a stacked capacitor having a step of selectively removing material to undercut and expose the capacitor electrode which serves as the storage node layer.
(1) Note. The capacitor electrode on which the electrical charge is stored is referred to as the storage node layer.

Including texturizing storage node layer:
This subclass is indented under subclass 396. Process for making a stacked capacitor having a step of roughening the surface of the capacitor plate which serves as the storage node layer.
(1) Note. The capacitor electrode on which the electrical charge is stored is referred to as the storage node layer.

Having contacts formed by selective growth or deposition:
This subclass is indented under subclass 396. Process for making a stacked capacitor wherein electrical contacts are formed by selective growth or deposition of conductive material onto the substrate.

FORMATION OF ELECTRICALLY ISOLATED LATERAL SEMICONDUCTIVE STRUCTURE:
This subclass is indented under the class definition. Process for making partial or total electrical isolation means serving to minimize electrical current flow between laterally adjoining semiconductive regions of the substrate.
(1) Note. To be proper hereunder, the proximate function of the formed semiconductor structure must be to electrically isolate laterally adjoining semiconductive regions, wherein each region is adapted for the construction of an electrical device.

SEE OR SEARCH THIS CLASS, SUBCLASS:
49 for a process of manufacturing a regenerative switching device having a guard ring or field plate component.
196 for a process of making a junction gate field effect transistor having an electrical isolation structure.
207 for a process of making a structure combining complementary insulated gate field effect transistors with a bipolar transistor (BiCMOS) additionally having an electrical isolation structure.
218 for a process of making a structure having complementary insulated gate field effect transistors (CMOS) additionally having an electrical isolation structure.
294 for a process of manufacturing an insulated gate field effect transistor having an electrical isolation structure.
353 for a process of manufacturing a bipolar transistor having an electrical isolation structure.
455 for a process in which plural semiconductive substrates are joined together with insulative material to provide layered semiconductive regions which may be electrically isolated from one another.
479 for a process involving fluid growth of a layer of semiconductive material upon an insulative substrate (i.e., SOI formation).

SEE OR SEARCH CLASS:
257, Active Solid-State Devices (e.g., Transistors, Solid-State Diodes), 499 for an integrated circuit structure with electrically isolated components.

Having substrate registration feature (e.g., alignment mark):
This subclass is indented under subclass 400. Process wherein the process of forming electrical isolation utilizes an alignment feature formed on the semiconductive substrate or forms an alignment feature for subsequent use.

And gettering of substrate:
This subclass is indented under subclass 400. Process for making laterally spaced electrically isolated semiconductor regions having a step of gettering a semiconductor
substrate.

Having semi-insulating component:
This subclass is indented under subclass 400. Process for making laterally spaced electrically isolated semiconductor regions wherein a high resistivity semiconductive component serves to electrically isolate, at least in part, the laterally spaced regions.

Total dielectric isolation:
This subclass is indented under subclass 400. Process for making laterally spaced electrically isolated semiconductor regions wherein the semiconductive regions are fully electrically isolated by dielectric insulative material.

SEE OR SEARCH THIS CLASS, SUBCLASS:
219 for a process of making complementary insulated gate field effect transistors having total dielectric isolation means.
295 for a process of making an insulated gate field effect transistor having total dielectric isolation means.
355 for a process of making a bipolar transistor having total dielectric isolation means.

And separate partially isolated semiconductor regions:
This subclass is indented under subclass 404. Process for making a total dielectric isolation semiconductor structure additionally having laterally spaced semiconductor regions at least one of which is fully electrically isolated from other laterally spaced semiconductive regions and at least one other region which is partially electrically isolated from another laterally spaced semiconductive region.

Bonding of plural semiconductive substrates:
This subclass is indented under subclass 404. Process for making a total dielectric isolation semiconductor structure including a step of joining plural semiconductive substrates together into a coherent monolith, such as by thermal treatment.

SEE OR SEARCH THIS CLASS, SUBCLASS:
455 for a process of laminating or bonding of plural semiconductive substrates not resulting in an electrically isolated lateral semiconductor structure.

Nondopant implantation:
This subclass is indented under subclass 404. Process for making a total dielectric isolation semiconductor structure including a step of ion implantation of a nonelectrically active impurity into a semiconductive region of the substrate.
(1) Note. The nondopant may react with the semiconductor region to produce a dielectric material embedded in the semiconductor region.

With electrolytic treatment step:
This subclass is indented under subclass 404. Process for making a total dielectric isolation semiconductor structure including a step of electrochemical treatment of the semiconductor substrate (i.e., such as to affect etching or coating action thereupon).

Porous semiconductor formation:
This subclass is indented under subclass 408. Process wherein the electrolytic treatment results in the formation of a porous semiconductor component.

Encroachment of separate locally oxidized regions:
This subclass is indented under subclass 404. Process for
making a total dielectric isolation semiconductor structure including a step of oxidation of adjacent semiconductive regions whereby the oxidized regions acquire a touching relationship.

Air isolation (e.g., beam lead supported semiconductor islands, etc.):
This subclass is indented under subclass 404. Process for making a total dielectric isolation structure wherein the resulting structure has islands of semiconductor material supported by beam leads and separated by air.

SEE OR SEARCH THIS CLASS, SUBCLASS:
461 for a process of depositing electrically conductive material to a semiconductive substrate and subsequently removing portions of the substrate to separate the same into beam leaded semiconductor devices.
619 for process of depositing an electrically conductive structure (i.e., metallization) upon a semiconductive substrate contacting spaced regions thereupon utilizing an air-gap dielectric.

SEE OR SEARCH CLASS:
257, Active Solid-State Devices (e.g., Transistors, Solid-State Diodes), subclass 522 for an air bridge isolated integrated circuit structure.

Semiconductor islands formed upon insulating substrate or layer (e.g., mesa isolation, etc.):
This subclass is indented under subclass 411. Process for making a total dielectric isolation semiconductor structure wherein laterally spaced semiconductor islands are formed upon an insulative substrate or layer.

With epitaxial semiconductor formation:
This subclass is indented under subclass 404. Process for making a total dielectric isolation semiconductor structure having a step of epitaxially depositing a semiconductive layer onto the substrate.

Isolation by PN junction only:
This subclass is indented under subclass 400. Process whereby the laterally spaced regions of the semiconductor substrate are electrically isolated solely through the use of properly biased PN junctions.

Thermomigration:
This subclass is indented under subclass 414. Process for making junction isolated laterally spaced semiconductor regions having a step of dopant migration under the influence of a temperature gradient.

With epitaxial semiconductor formation:
This subclass is indented under subclass 414. Process for making junction isolated laterally spaced semiconductor regions having a step of epitaxially depositing a semiconductor layer.

And simultaneous polycrystalline growth:
This subclass is indented under subclass 416. Process for making junction isolated laterally spaced semiconductor regions in which polycrystalline semiconductive regions are deposited simultaneously with the epitaxial deposition.

Dopant addition:
This subclass is indented under subclass 416. Process for making junction isolated laterally spaced semiconductor regions including a step of introducing an electrically active dopant species into semiconductive regions of the substrate.

Plural doping steps:
This subclass is indented under subclass 418. Process for making junction isolated laterally spaced semiconductor regions including multiple steps of introducing an electrically active dopant species into semiconductive regions of the substrate.

Plural doping steps:
This subclass is indented under subclass 414. Process for making an junction isolated laterally spaced semiconductor regions including multiple steps of introducing an electrically active dopant species into semiconductive regions of the substrate.

Having air-gap dielectric (e.g., groove, etc.):
This subclass is indented under subclass 400. Process for making an electrically isolated laterally spaced semiconductor structure resulting in laterally spaced semiconductive regions separated at least in part by a recessed air-gap feature relative to the surrounding surface (e.g., groove, trench, notch, etc.).

SEE OR SEARCH THIS CLASS, SUBCLASS:
411 for a process of forming a total dielectric isolation structure utilizing air isolation.

Enclosed cavity:
This subclass is indented under subclass 421. Process wherein the air-gap dielectric is in the form of an enclosed cavity or void between the laterally spaced semiconductive regions.

Implanting to form insulator:
This subclass is indented under subclass 400. Process for making an electrically isolated laterally spaced semiconductor structure including a step of implanting a nonelectrically active dopant species to form an insulative region which serves to electrically isolate lateral semiconductive regions.

SEE OR SEARCH THIS CLASS, SUBCLASS:
407 for a process of forming total dielectric isolation with a step of implanting a nondopant ion.
766 for a process of forming a buried insulative region by ion implantation of a nondopant species.

Grooved and refilled with deposited dielectric material:
This subclass is indented under subclass 400. Process for making electrically isolated laterally spaced semiconductor regions including a step of forming a recess or trench in the semiconductive substrate and refilling the same with deposited insulative material.

Combined with formation of recessed oxide by localized oxidation:
This subclass is indented under subclass 424. Process for making electrically isolated laterally spaced semiconductor regions by grooving and refilling with insulative material including the step of forming an embedded oxide by localized oxidation (of semiconductor material).
(1) Note. To be proper herein, the locally oxidized regions must consume semiconductor regions of the substrate (i.e., other than the oxidation solely of deposited layers residing within the groove). Additionally, the uppermost surface of the embedded oxide must be physically below the adjoining semiconductor top surface.

SEE OR SEARCH THIS CLASS, SUBCLASS:
444 for a process of forming a recessed oxide electrical isolation structure by localized oxidation including a preliminary step of forming a groove into the semiconductor substrate.

Recessed oxide laterally extending from groove:
This subclass is indented under subclass 425. Process for making electrically isolated laterally spaced semiconductor regions by grooving and refilling with insulative material whereby the embedded oxidized region extends laterally from the groove region.

Refilling multiple grooves of different widths or depths:
This subclass is indented under subclass 424. Process for making electrically isolated laterally spaced semiconductor regions by grooving and refilling with insulative material wherein grooves of differing widths or depths are filled with insulative material.

Reflow of insulator:
This subclass is indented under subclass 427. Process for making electrically isolated laterally spaced semiconductor regions by grooving and refilling with insulative material including a step of redistributing insulative material by the viscous flow of the insulative material when exposed to high temperature.

And epitaxial semiconductor formation in groove:
This subclass is indented under subclass 424. Process for making electrically isolated laterally spaced semiconductor regions by grooving and refilling with insulative material including a step of epitaxially depositing semiconductive material in the groove.

And deposition of polysilicon or noninsulative material into groove:
This subclass is indented under subclass 424. Process for making electrically isolated laterally spaced semiconductor
regions by grooving and refilling with insulative material wherein polysilicon or noninsulative material is deposited into the groove.

Oxidation of deposited material:
This subclass is indented under subclass 430. Process for making electrically isolated laterally spaced semiconductor regions by grooving and refilling with insulative material including a step of oxidizing the polysilicon or noninsulative material deposited into the groove.

Nonoxidized portions remaining in groove after oxidation:
This subclass is indented under subclass 431. Process for making electrically isolated laterally spaced semiconductor regions by grooving and refilling with insulative material wherein at least a portion of the polysilicon or noninsulative material deposited into the groove remains after the oxidation step.

Dopant addition:
This subclass is indented under subclass 424. Process for making electrically isolated laterally spaced semiconductor regions by grooving and refilling with insulative material combined with a step of introducing an electrically active dopant species into a semiconductive region of the substrate.

From doped insulator in groove:
This subclass is indented under subclass 433. Process for making electrically isolated laterally spaced semiconductor regions by grooving and refilling with insulative material wherein the semiconductor regions are doped from a doped insulator residing in the groove.

Multiple insulative layers in groove:
This subclass is indented under subclass 424. Process for making electrically isolated laterally spaced semiconductor regions by grooving and refilling with plural insulative layers.

Reflow of insulator:
This subclass is indented under subclass 435. Process for making electrically isolated laterally spaced semiconductor regions by grooving and refilling with insulative material including a step of redistributing insulative material by the viscous flow of the insulative material when exposed to high temperature.

Conformal insulator formation:
This subclass is indented under subclass 435. Process for making electrically isolated laterally spaced semiconductor regions by grooving and refilling with insulative material including forming an insulative layer which follows the contour of the groove.

Reflow of insulator:
This subclass is indented under subclass 424. Process for making electrically isolated laterally spaced semiconductor regions by grooving and refilling with insulative material including a step of redistributing insulative material by the viscous flow of the insulative material when exposed to high temperature.

Recessed oxide by localized oxidation (i.e., LOCOS):
This subclass is indented under subclass 400. Process for making electrically isolated laterally spaced semiconductor regions including the step of oxidizing a portion of a semiconductive material to form an embedded oxide (e.g., field oxide) therein which isolates the laterally adjacent
semiconductive regions.

Including nondopant implantation:
This subclass is indented under subclass 439. Process including a step of ion implanting a nonelectrically active impurity species into any region of the semiconductor substrate.
(1) Note. The nondopant may serve to alter the oxidation rate of the implanted region.

SEE OR SEARCH THIS CLASS, SUBCLASS:
423 for a process of forming a laterally spaced isolation structure involving the implantation of an ion which reacts with the substrate to form an insulative material.

With electrolytic treatment step:
This subclass is indented under subclass 439. Process including a step of electrochemical treatment of the semiconductor substrate (e.g., such as to affect etching or coating action thereon).

With epitaxial semiconductor layer formation:
This subclass is indented under subclass 439. Process including a step of epitaxially growing a single crystal semiconductor layer on the substrate.

Etchback of recessed oxide:
This subclass is indented under subclass 439. Process having a step of thinning the formed recessed oxide by chemical etching action followed by an additional step of oxidizing a semiconductive region of the substrate.

Preliminary etching of groove:
This subclass is indented under subclass 439. Process including a preliminary step of etching a trench into the semiconductive substrate followed by locally oxidizing the trench surfaces to form the recessed oxide therein.

SEE OR SEARCH THIS CLASS, SUBCLASS:
421 for a process of forming electrically isolated lateral semiconductive regions utilizing an air-gap separation.
425 for a process of forming a grooved and refilled electrical isolation structure including a step of forming an embedded localized oxidation region of the semiconductor substrate within or adjoining the groove.

Masking of groove sidewall:
This subclass is indented under subclass 444. Process utilizing a layer in contact with the groove sidewalls which serves as a protective covering during either an etching or oxidation step.

Polysilicon containing sidewall:
This subclass is indented under subclass 445. Process utilizing a polysilicon containing component for masking the groove sidewalls.

Dopant addition:
This subclass is indented under subclass 444. Process including a step of introducing an electrically active dopant species into semiconductive regions of the substrate.

Utilizing oxidation mask having polysilicon component:
This subclass is indented under subclass 439. Process utilizing a layer in contact with the substrate having a
polysilicon containing component which serves as a protective covering during the localized oxidation step.

Dopant addition:
This subclass is indented under subclass 439. Process including a step of introducing an electrically active dopant species into semiconductive regions of the substrate.

Implanting through recessed oxide:
This subclass is indented under subclass 449. Process wherein the dopant species is implanted through the recessed oxide into the semiconductive regions therebeneath.

Plural doping steps:
This subclass is indented under subclass 449. Process utilizing multiple steps of doping semiconductive regions of the substrate.

Plural oxidation steps to form recessed oxide:
This subclass is indented under subclass 439. Process having multiple steps of oxidizing the semiconductor substrate in the region of the recessed oxide.

And electrical conductor formation (i.e., metallization):
This subclass is indented under subclass 439. Process including a step of making an electrically conductive member integral to the semiconductive substrate.
(1) Note. The contact may be, for example, directly to semiconductive regions of the substrate or may reside atop the field oxide isolation structure.

SEE OR SEARCH THIS CLASS, SUBCLASS:
584 for a process of depositing electrically or thermally conductive material on a semiconductor substrate.

Field plate electrode:
This subclass is indented under subclass 400. Process having a step of forming an electrically conductive structure formed on a major surface of the semiconductor substrate for electrically separating laterally positioned device regions.

SEE OR SEARCH THIS CLASS, SUBCLASS:
584 for a process of depositing electrically or thermally conductive material on a semiconductor substrate.

BONDING OF PLURAL SEMICONDUCTOR SUBSTRATES:
This subclass is indented under the class definition. Process in which plural semiconductive substrates are joined together into a coherent body, such as by thermal treatment.
(1) Note. Connection of electrical terminals on transposed semiconductive substrates by joining the respective terminals on one substrate to the terminals on a second substrate (e.g., flip-chip bonding, etc.) is a packaging operation and as such cross-referencing hereunder is discouraged.

SEE OR SEARCH THIS CLASS, SUBCLASS:
107 for a process of packaging (e.g., mounting, encapsulating, etc.) involving the assembly of plural semiconductive substrates or the treating of a packaged device containing the same.
406 for a process of making a full electrical isolation structure including a laminating step whereby current flow will be minimized between laterally adjoining semiconductive regions.

SEE OR SEARCH CLASS:
65, Glass Manufacturing, particularly 36 for fusion bonding of glass to a formed part. While Class 65 considers silicon and silicon dioxide glass, and hence takes the melting, shaping or fusion bonding of the same (as well as combined operations whether preparatory or subsequent to the melting, shaping, or fusion bonding step), if the structure formed is
identified as having utility for semiconductor electrical devices, placement is proper in Class 438.
117, Single-Crystal, Oriented-Crystal, and Epitaxy Growth Processes; Non-Coating Apparatus Therefor, subclass 1 for processes of joining independent crystals.
156, Adhesive Bonding and Miscellaneous Chemical Manufacture, 60, for a per se process of adhesive bonding or assembly therefor of plural preforms.
228, Metal Fusion Bonding, for processes of metal fusion bonding of semiconductive substrates.

Having enclosed cavity:
This subclass is indented under subclass 455. Process for joining plural semiconductive substrates into an integral body resulting in a partially or wholly enclosed void structure therein.

SEE OR SEARCH THIS CLASS, SUBCLASS:
422 for a process of forming an electrically isolated lateral semiconductive structure utilizing a partially or wholly enclosed cavity as an air-gap dielectric.

Warping of semiconductor substrate:
This subclass is indented under subclass 455. Process for joining plural semiconductive substrates into an integral body including a step of bending one or more of the semiconductor substrates to be joined.

Subsequent separation into plural bodies (e.g., delaminating, dicing, etc.):
This subclass is indented under subclass 455. Process for joining plural semiconductive substrates into an integral body having a step of dividing the integral body into plural individual bodies subsequent to the joining operation.

Thinning of semiconductor substrate:
This subclass is indented under subclass 455. Process for joining plural semiconductive substrates into an integral body having a step of reducing the thickness of at least one of the semiconductive substrates.

SEMICONDUCTOR SUBSTRATE DICING:
This subclass is indented under the class definition. Process including the step of separating the semiconductor substrate into plural individual bodies (e.g., die, etc.) usually by removal of material therefrom or by cleavage thereof.

SEE OR SEARCH THIS CLASS, SUBCLASS:
113 for a process of packaging (e.g., mounting, encapsulating, etc.) of treating a packaged semiconductor device having a step of dividing a semiconductor substrate into discrete individual units.

SEE OR SEARCH CLASS:
83, Cutting, for a generic process of cutting a substrate into discrete individual units.
225, Severing by Tearing or Breaking, 1 for methods.
451, Abrading, for a process of dicing by abrading.

Beam lead formation:
This subclass is indented under subclass 460. Process for separating a semiconductor substrate into plural individual bodies wherein the resultant bodies possess electrical leads which extend beyond the edges of the body (i.e., cantilevered).

SEE OR SEARCH THIS CLASS, SUBCLASS:
411 for a process of making laterally spaced isolated semiconductor structure wherein self-supporting electrodes hold plural semiconductor bodies in spaced relationship to each other.

SEE OR SEARCH CLASS:
29, Metal Working, subclass 827 for beam lead device manufacture wherein an electrically conductive body is mounted in a cantilever fashion to an electrical device.

Having specified scribe region structure (e.g., alignment mark, plural grooves, etc.):
This subclass is indented under subclass 460. Process wherein the region of the semiconductor substrate delineating the separating boundary between adjacent die possesses a specified structure.
(1) Note. The specified structure may serve no function in the separation of the substrate into plural bodies (e.g., alignment marks, etc.) or may facilitate the separation operation (e.g., plural grooves of specified relationship, a trench having significant sidewall structure, etc.).
(2) Note. A scribe groove, per se, or plural scribe lines intersecting in such a way so as to form chips of a certain shape (e.g., trapezoidal, etc.) are not considered proper herein.

By electromagnetic irradiation (e.g., electron, laser, etc.):
This subclass is indented under subclass 460. Process utilizing electromagnetic radiation for dividing the semiconductor substrate into plural distinct bodies.
(1) Note. Proper for this subclass are processes wherein the electromagnetic irradiation serves to from a "scribe" line (i.e., a weakened or removed area to facilitate subsequent separation) combined with an additional step of separating the substrate into distinct bodies at such line.

With attachment to temporary support or carrier:
This subclass is indented under subclass 460. Process including a step of attaching the semiconductor substrate to a temporary holder to facilitate the handling of the substrate.

SEE OR SEARCH THIS CLASS, SUBCLASS:
106 for a process of packaging (e.g., mounting, encapsulating, etc.) a semiconductor substrate by securing the same to a support (i.e., a mounting) or treating a packaged semiconductor device.

Having a perfecting coating:
This subclass is indented under subclass 460. Process including a step of coating the semiconductor substrate with a coating which enhances the dicing operation.

DIRECT APPLICATION OF ELECTRICAL CURRENT:
This subclass is indented under the class definition. Process including the step having an electric current come in direct contact with the semiconductor substrate (i.e., nonradiatively) to treat the same.
(1) Note. Per se (a) irradiation of ionized atoms or molecules to implant the same into a semiconductor material, (b) exposing a semiconductive substrate to a plasma or electron beam, or (c) electrochemical treatment of a semiconductive substrate, is not considered a direct application electrical treatment for this and indented subclasses.

SEE OR SEARCH THIS CLASS, SUBCLASS:
10 for a semiconductor manufacturing process including a step of measuring or testing of the process or of the substrate for feedback control of the manufacturing process.
17 for a semiconductor manufacturing process including a step of measuring or testing an electrical characteristic of the process or of the substrate.
88 for a process of making a device responsive to electromagnetic radiation having a step of directly applying electrical current.
101 for a process of manufacturing a point contact semiconductive device having a step of directly applying electrical current.
103 for a process of manufacturing a device having a selenium or tellurium elemental semiconductive device including a step of directly applying electrical current.
292 for a process of making an insulated gate field effect
transistor having a step of directly applying electrical current.
351 for a process of making a bipolar transistor having a step of directly applying electrical current.

SEE OR SEARCH CLASS:
204, Chemistry: Electrical and Wave Energy, especially 192.1 for processes of coating, forming, or etching by sputtering.
324, Electricity: Measuring and Testing, appropriate subclass for per se electrical testing (i.e., aging).

To alter conductivity of fuse or antifuse element:
This subclass is indented under subclass 466. Process involving the direct application of electrical current to a fuse or antifuse portion of the semiconductor substrate to alter the conductivity of same.

SEE OR SEARCH THIS CLASS, SUBCLASS:
132 for a process of making an array of electrical devices and selectively interconnecting the devices via fusible links.
281 for a process of making an insulated gate field effect transistor combined with a fuse or integral short.
333 for a process of making a bipolar transistor combined with a fuse or integral short.

Electromigration:
This subclass is indented under subclass 466. Process involving the movement of atoms (usually dopant atoms) under the influence of an electric field.

Utilizing pulsed current:
This subclass is indented under subclass 466. Process wherein the electrical current is presented in periodic surges.

Fusion of semiconductor region:
This subclass is indented under subclass 466. Process wherein semiconductor regions of the substrate are melted upon application of the electrical current.

SEE OR SEARCH THIS CLASS, SUBCLASS:
89 for a process of making a semiconductive device responsive to electromagnetic radiation having a step of fusing or solidifying a semiconductive region of the substrate.
293 for a process of making an insulated gate field effect transistor having a step of fusing or solidifying a semiconductive region of the substrate.
352 for a process of making a bipolar transistor having a step of fusing or solidifying a semiconductive region of the substrate

GETTERING OF SUBSTRATE:
This subclass is indented under the class definition. Process having a step of treating a semiconductor substrate to reduce or remove deleterious defects (impurities, vacancies, dislocations, etc.) therefrom.
(1) Note. Examples of gettering techniques include segregation (e.g., coalescence) of defects to a defined region, implanting internal defect localizing regions, removal of superfluous electrical charges other than mere static electricity or those accumulated during manufacture (e.g., passivation of dangling bonds on the substrate surface by covalently bonding to hydrogen), and removal of mobile ion contamination such as by volatilization.
(2) Note. The introduction of recombination centers (i.e., deep level dopants) into the semiconductor substrate, such centers serving to control carrier lifetime, is not considered to be gettering for the purpose of this and indented subclasses. However, the removal of the same from the semiconductor substrate is proper hereunder.
(3) Note. Gettering includes treating the substrate locally (e.g., surface, internal regions, etc.). In gettering, impurities within the substrate may be attracted to a region of the substrate where they can be removed or "fixed". In cleaning, foreign matter on the substrate surface is removed.
Thus there may be a cleaning step within an overall process of gettering. Processes of apparatus gettering (i.e., apparatus cleaning) are not considered proper hereunder unless combined with the gettering of a semiconductor substrate.

SEE OR SEARCH THIS CLASS, SUBCLASS:
115 for a step of contaminant removal or mitigation in a process of mounting, packaging, or encapsulating a semiconductor device.
510 for a process of doping semiconductive regions with an electrically active element.
795 for a process of radiation or energy treating a semiconductive substrate to modify the properties thereof of semiconductive regions thereof.

SEE OR SEARCH CLASS:
134, Cleaning and Liquid Contact With Solids, subclasses 1-42 for a process of cleaning.

By vibrating or impacting:
This subclass is indented under subclass 471. Process wherein a step of vibrating the semiconductive substrate or striking the semiconductive substrate with solid material is utilized to produce a gettering effect.

SEE OR SEARCH CLASS:
134, Cleaning and Liquid Contact With Solids, especially 6 for a process of cleaning a semiconductor wafer by impacting the wafer with solid matter.

By implanting or irradiating:
This subclass is indented under subclass 471. Process wherein a step of implanting or irradiating the semiconductive substrate is utilized to produce a gettering effect.

Ionized radiation (e.g., corpuscular or plasma treatment,
etc.):
This subclass is indented under subclass 473. Process wherein ionized radiation is applied to the semiconductor substrate to produce a gettering effect.

Hydrogen plasma (i.e., hydrogenization):
This subclass is indented under subclass 474. Process wherein the radiation is a plasma containing ionized hydrogen (i.e., proton irradiation).

By layers which are coated, contacted, or diffused:
This subclass is indented under subclass 471. Process wherein the substrate is exposed to a specified material by (a) depositing a layer of the material on the substrate, (b) physically contacting the substrate with the material, or (c) diffusing into the substrate a gettering species to form a gettering region in the substrate.

By vapor phase surface reaction:
This subclass is indented under subclass 471. Process in which the substrate is treated with a reactive gas mixture which preferentially forms volatile compounds with the undesired impurities.

FORMATION OF SEMICONDUCTIVE ACTIVE REGION ON ANY SUBSTRATE (E.G., FLUID GROWTH, DEPOSITION, ETC.):
This subclass is indented under the class definition. Process for depositing onto any substrate single or multiple layers of semiconductor material adapted to serve as an active device region, the semiconductive material being deposited as amorphous, polycrystalline, or single crystalline material.
(1) Note. Included herein are those processes for the fluid growth of semiconductive material having a sufficiently high resistivity so as to be termed semi-insulative. However, if
the proximate function of the semiconductive material is as a electrical conductor (e.g., a multilayer inter-connect having a polysilicon layer), classification is excluded fro m this and indented subclasses.

SEE OR SEARCH THIS CLASS, SUBCLASS:
102 for selenium or tellurium elemental semiconductor deposition,
104 for transition metal oxide or copper sulfide compound semiconductor deposition,
105 for diamond semiconductor deposition,
412 for a process of forming laterally spaced isolated semiconductive islands/mesas upon an insulating substrate or layer.
414 for a process of forming laterally spaced junction isolated semiconductive regions.
423 Chemistry of Inorganic Compounds, particularly subclasses 348+ for methods of producing elemental silicon intended as a feedstock for later fabrication into active layers/regions.
584 for a process of coating conductive material onto a semiconductive substrate, or intermediate layers thereupon.

SEE OR SEARCH CLASS:
117, Single-Crystal, Oriented-Crystal, and Epitaxy Growth Processes; Non-Coating Apparatus Therefor, for processes of single crystal growth of semiconductor material upon a seed or substrate and perfecting steps combined therewith.

On insulating substrate or layer:
This subclass is indented under subclass 478. Process wherein the semiconductor layer is deposited onto an electrically insulating substrate or layer.
(1) Note. The formation of a semiconductive active region on an insulative substrate by the chemical reduction of a portion of the insulative substrate thereby altering the reduced portion of the insulative substrate into a semiconductive region is proper herein.

Including implantation of ion which reacts with semiconductor
substrate to form insulating layer:
This subclass is indented under subclass 479. Process for the deposition of a semiconductor layer onto an electrically insulating layer including implanting an ion which reacts with the semiconductive regions of the substrate to form an electrically insulating layer.

SEE OR SEARCH THIS CLASS, SUBCLASS:
766 for a per se process of implanting an ion which reacts with semiconductive regions of the substrate to form an electrical insulator.

Utilizing epitaxial lateral overgrowth:
This subclass is indented under subclass 479. Process wherein the semiconductor material is deposited so as to overlay electrically insulative material and such that epitaxial growth occurs laterally from a crystal seeding region.

Amorphous semiconductor:
This subclass is indented under subclass 478. Process wherein the deposited semiconductive material possesses no regular crystalline lattice.

Compound semiconductor:
This subclass is indented under subclass 482. Process wherein the deposited amorphous semiconductor is a compound semiconductor.

Running length (e.g., sheet, strip, etc.):
This subclass is indented under subclass 482. Process involving the fluid growth of an amorphous semiconductor onto a substrate presented as a continuum of indeterminate length.

SEE OR SEARCH THIS CLASS, SUBCLASS:
62 for a process of making a device responsive to electromagnetic radiation utilizing the deposition of a semiconductive active layer onto a substrate of indeterminate length.

Deposition utilizing plasma (e.g., glow discharge, etc.):
This subclass is indented under subclass 482. Process utilizing a plasma or glow discharge during the deposition of the semiconductive material.

And subsequent crystallization:
This subclass is indented under subclass 482. Process having a step of depositing an amorphous semiconductor layer combined with the subsequent crystallization of the amorphous semiconductor layer.

SEE OR SEARCH CLASS:
117, Single-Crystal, Oriented-Crystal, and Epitaxy Growth Processes; Non-Coating Apparatus Therefor, appropriate subclasses for the process of single crystallization and perfecting steps therewith.

Utilizing wave energy (e.g., laser, electron beam, etc.):
This subclass is indented under subclass 486. Process whereby the crystallization is affected by the application of a source of wave energy to the amorphous semiconductor.

Polycrystalline semiconductor:
This subclass is indented under subclass 478. Process wherein the deposited semiconductive material is polycrystalline (i.e., possesses multiple crystalline regions having grain boundaries therebetween).

SEE OR SEARCH THIS CLASS, SUBCLASS:
764 for processes of depositing semi-insulative polycrystalline silicon upon a semiconductive substrate.

Simultaneous single crystal formation:
This subclass is indented under subclass 488. Process wherein both single and polycrystalline regions are simultaneously formed on the same substrate.

Running length (e.g., sheet, strip, etc.):
This subclass is indented under subclass 488. Process involving the fluid growth of an indeterminate length of amorphous semiconductor.

SEE OR SEARCH THIS CLASS, SUBCLASS:
62 for a process of making a device responsive to electromagnetic radiation utilizing the deposition of a semiconductive active layer onto a substrate of indeterminate length.

And subsequent doping of polycrystalline semiconductor:
This subclass is indented under subclass 488. Process having a subsequent step of incorporating an electrically active dopant species into the polycrystalline semiconductive material.

Fluid growth step with preceding and subsequent diverse operation:
This subclass is indented under subclass 478. Process having a step of the fluid growth of a semiconductor active region combined with a preceding nonfluid growth step and a subsequent nonfluid growth step.

Plural fluid growth steps with intervening diverse operation:
This subclass is indented under subclass 478. Process wherein multiple fluid growth steps having combined therewith at least one step not perfecting to either prior or subsequent growth steps and which step is preformed intermediate to the multiple fluid growth steps.

SEE OR SEARCH CLASS:
117, Single-Crystal, Oriented-Crystal, and Epitaxy Growth Processes; Non-Coating Apparatus Therefor, appropriate subclasses for the process of single crystallization and perfecting steps therewith.

Differential etching:
This subclass is indented under subclass 493. Process where the differential etching of the substrate intermediate to the steps of fluid growth of semiconductive material is the diverse step.

Doping of semiconductor:
This subclass is indented under subclass 493. Process wherein the incorporation of an electrically active dopant species into a semiconductive region of the substrate intermediate to the steps of fluid growth of semiconductive material is the diverse step.

Coating of semiconductive substrate with nonsemiconductive material:
This subclass is indented under subclass 493. Process wherein the coating of a nonsemiconductive material intermediate to the steps of fluid growth of semiconductive material is the diverse operation.

Fluid growth from liquid combined with preceding diverse
operation:
This subclass is indented under subclass 478. Process having a nonfluid growth operation which precedes the fluid growth of semiconductive material from the liquid state and is not merely perfecting thereto.
(1) Note. See Class 117, class definition section I, C, (4) Note, for a detailed description of the types of perfecting prior operations which in combination with a step of single crystal growth are proper therein.

Differential etching:
This subclass is indented under subclass 497. Process wherein the differential etching of the substrate prior to the fluid growth of semiconductive material from the liquid state is the diverse step.

Doping of semiconductor:
This subclass is indented under subclass 497. Process wherein a semiconductive region of the substrate is incorporated with an electrically active dopant species prior to a step of fluid growth of semiconductive material from the liquid state.

Fluid growth from liquid combined with subsequent diverse operation:
This subclass is indented under subclass 478. Process having a nonfluid growth operation which is subsequent to the fluid growth of semiconductive active region from the liquid state and is not merely perfecting thereto.
(1) Note. See Class 117, class definition (4) Note, for a detailed description of the types of perfecting subsequent operations which in combination with a step of single crystal growth are proper therein.

Doping of semiconductor:
This subclass is indented under subclass 500. Process wherein a semiconductive region of the substrate is incorporated with an electrically active dopant species subsequent to a step of fluid growth of semiconductive material from the liquid state.

Heat treatment:
This subclass is indented under subclass 500. Process wherein the substrate having the deposited semiconductor active region thereon is heat treated following a step of fluid growth of semiconductive material from the liquid state.

Fluid growth from gaseous state combined with preceding diverse operation:
This subclass is indented under subclass 478. Process having a nonfluid growth operation which precedes the fluid growth of semiconductive material from the vapor state and is not merely perfecting thereto.
(1) Note. See Class 117, class definition section I, C, (4) Note, for a detailed description of the types of perfecting prior operations which in combination with a step of single crystal growth are proper therein.

Differential etching:
This subclass is indented under subclass 503. Process wherein the differential etching of the substrate prior to the fluid growth of semiconductive material from the gaseous state is the diverse step.

Doping of semiconductor:
This subclass is indented under subclass 503. Process wherein a semiconductive region of the substrate is incorporated with an electrically active dopant species prior to a step of fluid growth of semiconductive material from the
vapor or gaseous state.

Ion implantation:
This subclass is indented under subclass 505. Process wherein the doping is by implantation of dopant ions into the semiconductor regions of the substrate.

Fluid growth from gaseous state combined with subsequent diverse operation:
This subclass is indented under subclass 478. Process having a nonfluid growth operation which is subsequent to the fluid growth of semiconductive active region from the gaseous state and is not merely perfecting thereto.
(1) Note. See Class 117, class definition section I, C, (4) Note, for a detailed description of the types of perfecting subsequent operations which in combination with a step of single crystal growth are proper therein.