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Rank Ordered Listing of Organizations Receiving
5
or More Utility Patents During the Period
Having Primary Classification In
Class 228, Metal Fusion Bonding
( technology class is determined by the primary classification assigned to the patent- see 'Explanation of Data' )
( patent ownership is determined by the first-named assignee listed on a patent )
First-Named Assignee | 2009 | 2010 | 2011 | 2012 | 2013 | Total |
---|---|---|---|---|---|---|
INTERNATIONAL BUSINESS MACHINES CORPORATION | 10 | 18 | 8 | 10 | 11 | 57 |
~INDIVIDUALLY OWNED PATENT | 9 | 11 | 11 | 9 | 10 | 50 |
BOEING COMPANY | 8 | 13 | 8 | 4 | 4 | 37 |
PANASONIC CORPORATION | 6 | 7 | 6 | 7 | 3 | 29 |
GM GLOBAL TECHNOLOGY OPERATIONS LLC | 0 | 4 | 11 | 2 | 8 | 25 |
KULICKE AND SOFFA INDUSTRIES INC. | 8 | 4 | 3 | 7 | 2 | 24 |
ASM TECHNOLOGY SINGAPORE PTE LTD | 7 | 4 | 2 | 3 | 3 | 19 |
GENERAL ELECTRIC COMPANY | 3 | 9 | 3 | 2 | 2 | 19 |
KABUSHIKI KAISHA SHINKAWA | 4 | 9 | 2 | 1 | 2 | 18 |
FUJITSU LIMITED | 1 | 7 | 4 | 0 | 5 | 17 |
ROLLS-ROYCE PLC | 1 | 3 | 4 | 6 | 3 | 17 |
INTEL CORPORATION | 3 | 5 | 1 | 4 | 3 | 16 |
SENJU METAL INDUSTRY CO. LTD. | 1 | 2 | 4 | 6 | 2 | 15 |
HITACHI, LTD | 3 | 4 | 4 | 0 | 3 | 14 |
KAWASAKI JUKOGYO KABUSHIKI KAISHA | 1 | 7 | 3 | 0 | 2 | 13 |
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD. | 0 | 0 | 1 | 5 | 6 | 12 |
IBIDEN CO., LTD. | 1 | 2 | 3 | 3 | 2 | 11 |
ORTHODYNE ELECTRONICS CORPORATION | 1 | 0 | 2 | 4 | 4 | 11 |
SHINKO ELECTRIC INDUSTRIES CO., LTD. | 1 | 6 | 3 | 1 | 0 | 11 |
ASM ASSEMBLY AUTOMATION LTD. | 0 | 8 | 0 | 2 | 0 | 10 |
COMAU, INC. | 0 | 2 | 2 | 4 | 2 | 10 |
ROHM AND HAAS ELECTRONIC MATERIALS, L.L.C. | 0 | 0 | 5 | 0 | 5 | 10 |
SHINKAWA LTD. | 0 | 2 | 2 | 5 | 1 | 10 |
HONDA GIKEN KOGYO KABUSHIKI KAISHA (HONDA MOTOR CO., LTD.) | 1 | 6 | 2 | 0 | 0 | 9 |
INFINEON TECHNOLOGIES AG | 1 | 2 | 1 | 3 | 2 | 9 |
MEGASTIR TECHNOLOGIES LLC | 0 | 0 | 3 | 3 | 3 | 9 |
MTU AERO ENGINES GMBH | 0 | 2 | 2 | 0 | 5 | 9 |
SIEMENS AKTIENGESELLSCHAFT | 1 | 2 | 3 | 3 | 0 | 9 |
TEXAS INSTRUMENTS, INCORPORATED | 4 | 1 | 1 | 1 | 2 | 9 |
UNITED TECHNOLOGIES CORPORATION | 3 | 2 | 1 | 0 | 3 | 9 |
HONEYWELL INTERNATIONAL INC. | 4 | 1 | 0 | 1 | 2 | 8 |
UNITED STATES OF AMERICA, NATIONAL AERONAUTICS AND SPACE ADMINISTRATION | 1 | 1 | 2 | 2 | 2 | 8 |
FLEXTRONICS AP, LLC | 0 | 0 | 0 | 5 | 2 | 7 |
HONG FU JIN PRECISION INDUSTRY (SHENZHEN) CO., LTD. | 0 | 0 | 4 | 2 | 1 | 7 |
MICRON TECHNOLOGY, INC. | 1 | 3 | 1 | 1 | 1 | 7 |
SAMSUNG ELECTRONICS CO., LTD. | 2 | 1 | 1 | 2 | 1 | 7 |
SHIBUYA KOGYO COMPANY, LTD. | 2 | 0 | 2 | 3 | 0 | 7 |
SHOWA DENKO KABUSHIKI KAISHA | 1 | 3 | 1 | 2 | 0 | 7 |
LOCKHEED MARTIN CORPORATION | 1 | 1 | 0 | 3 | 1 | 6 |
MITSUBISHI HEAVY INDUSTRIES, LTD. | 1 | 0 | 1 | 1 | 3 | 6 |
PAC TECH-PACKAGING TECHNOLOGIES GMBH | 1 | 2 | 2 | 1 | 0 | 6 |
SAMSUNG ELECTRO-MECHANICS CO., LTD. | 1 | 1 | 0 | 2 | 2 | 6 |
DENSO CORPORATION | 3 | 2 | 0 | 0 | 0 | 5 |
KAIJO CORPORATION | 0 | 2 | 3 | 0 | 0 | 5 |
LINDE AKTIENGESELLSCHAFT | 0 | 0 | 2 | 2 | 1 | 5 |
MAZDA MOTOR CORPORATION | 2 | 3 | 0 | 0 | 0 | 5 |
NISSAN MOTOR COMPANY, LIMITED | 0 | 2 | 3 | 0 | 0 | 5 |
RENESAS ELECTRONICS CORP. | 0 | 0 | 3 | 1 | 1 | 5 |
SCHUNK ULTRASCHALLTECHNIK GMBH | 3 | 1 | 1 | 0 | 0 | 5 |
SEIKO EPSON CORPORATION | 1 | 0 | 4 | 0 | 0 | 5 |
SIEMENS ENERGY, INC. | 0 | 1 | 2 | 2 | 0 | 5 |
SILVERBROOK RESEARCH PTY. LTD | 0 | 2 | 3 | 0 | 0 | 5 |
SONY CORPORATION | 2 | 2 | 1 | 0 | 0 | 5 |
UNITED LAUNCH ALLIANCE, LLC | 0 | 0 | 1 | 3 | 1 | 5 |
Questions regarding these reports should be directed to:
U.S. Patent and Trademark Office
Electronic Information Products Division - PTMT
P.O Box 1450
Alexandria VA 22313-1450tel: (571) 272-5600
fax: (571) 273-0110
email: oeip@uspto.govaddress of PTMT pages at the USPTO Web Site: http://www.uspto.gov/web/offices/ac/ido/oeip/taf/tafp.html
selected PTMT files available for download at : http://www.uspto.gov/web/offices/ac/ido/oeip/taf/data/
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