subdoc-claims

Element Title: Claims Sub-Document

Element Description: Structure for the claims of the patent. Contains an optional header and one or more claims.

Element Content:

(heading?,claim+)

Element is Located in:

patent-application-publication

Element Attributes:

Name	Type	Default Value	Example	Description
st32-name	CDATA	"SDOCL"	In DTD for reference only	Data mapping to Grant Red Book/ST32

Element Markup Instructions: none

Element Example:

<subdoc-claims>
    <heading lvl="1">What is claimed is: </heading>
    <claim id="CLM-00001">
        <claim-text><highlight><bold>1</bold></highlight>. A method for ... metallization, said method comprises:
            <claim-text>forming a dielectric layer on a semiconductor substrate; </claim-text>
            <claim-text>forming an anti-reflective layer on said dielectric layer; </claim-text>
            <claim-text>patterning said dielectric layer, thereby ... said dielectric layer; and </claim-text>
            <claim-text>forming a conductive layer in said interconnect line regions. </claim-text>
        </claim-text>
    </claim>
    <claim id="CLM-00002">
        <claim-text><highlight><bold>2</bold></highlight>. The method according to ..., further ... formed:
        <claim-text>forming an inter-layer dielectric on said semiconductor substrate; </claim-text>
        <claim-text>patterning said inter-layer ... dielectric; and </claim-text>
        <claim-text>filling said plug regions with conductive materials. </claim-text>
        </claim-text>
    </claim>
    <claim id="CLM-00003">
        <claim-text><highlight><bold>3</bold></highlight>. The method ... regions is filled. </claim-text>
    </claim>
    .
    .
    .
</subdoc-claims>