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| Class 438 | SEMICONDUCTOR DEVICE MANUFACTURING: PROCESS |
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![[List of Pre Grant Publications for class 438 subclass 1]](../as.gif) | ![[List of Patents for class 438 subclass 1]](../ps.gif) | 1 | HAVING BIOMATERIAL COMPONENT OR INTEGRATED WITH LIVING ORGANISM |
| | 2 | HAVING SUPERCONDUCTIVE COMPONENT |
| | 3 | HAVING MAGNETIC OR FERROELECTRIC COMPONENT |
| | 4 | REPAIR OR RESTORATION |
| | 5 | INCLUDING CONTROL RESPONSIVE TO SENSED CONDITION |
| | 6 |  Interconnecting plural devices on semiconductor substrate |
| | 7 | Optical characteristic sensed |
| | 10 | Electrical characteristic sensed |
| | 14 | WITH MEASURING OR TESTING |
| | 15 | Packaging (e.g., with mounting, encapsulating, etc.) or treatment of packaged semiconductor |
| | 16 | Optical characteristic sensed |
| | 17 | Electrical characteristic sensed |
| | 19 | HAVING INTEGRAL POWER SOURCE (E.G., BATTERY, ETC.) |
| | 20 | ELECTRON EMITTER MANUFACTURE |
| | 21 | MANUFACTURE OF ELECTRICAL DEVICE CONTROLLED PRINTHEAD |
| | 22 | MAKING DEVICE OR CIRCUIT EMISSIVE OF NONELECTRICAL SIGNAL |
| | 23 | Having diverse electrical device |
| | 26 | Packaging (e.g., with mounting, encapsulating, etc.) or treatment of packaged semiconductor |
| | 29 | Including integrally formed optical element (e.g., reflective layer, luminescent material, contoured surface, etc.) |
| | 33 | Substrate dicing |
| | 34 | Making emissive array |
| | 36 | Ordered or disordered |
| | 37 | Graded composition |
| | 38 | Passivating of surface |
| | 39 | Mesa formation |
| | 42 | Groove formation |
| | 45 | Dopant introduction into semiconductor region |
| | 46 | Compound semiconductor |
| | 48 | MAKING DEVICE OR CIRCUIT RESPONSIVE TO NONELECTRICAL SIGNAL |
| | 49 | Chemically responsive |
| | 50 | Physical stress responsive |
| | 51 |  Packaging (e.g., with mounting, encapsulating, etc.) or treatment of packaged semiconductor |
| | 52 | Having cantilever element |
| | 53 | Having diaphragm element |
| | 54 | Thermally responsive |
| | 56 | Responsive to corpuscular radiation (e.g., nuclear particle detector, etc.) |
| | 57 | Responsive to electromagnetic radiation |
| | 58 | Gettering of substrate |
| | 59 | Having diverse electrical device |
| | 61 | Continuous processing |
| | 63 | Particulate semiconductor component |
| | 64 | Packaging (e.g., with mounting, encapsulating, etc.) or treatment of packaged semiconductor |
| | 65 |  Having additional optical element (e.g., optical fiber, etc.) |
| | 66 | Plural responsive devices (e.g., array, etc.) |
| | 68 | Substrate dicing |
| | 69 | Including integrally formed optical element (e.g., reflective layer, luminescent layer, etc.) |
| | 70 | Color filter |
| | 71 | Specific surface topography (e.g., textured surface, etc.) |
| | 72 | Having reflective or antireflective component |
| | 73 | Making electromagnetic responsive array |
| | 74 | Vertically arranged (e.g., tandem, stacked, etc.) |
| | 75 | Charge transfer device (e.g., CCD, etc.) |
| | 76 |  Majority signal carrier (e.g., buried or bulk channel, peristaltic, etc.) |
| | 77 | Compound semiconductor |
| | 78 | Having structure to improve output signal (e.g., exposure control structure, etc.) |
| | 80 | Lateral series connected array |
| | 82 | Having organic semiconductor component |
| | 83 | Forming point contact |
| | 84 | Having selenium or tellurium elemental semiconductor component |
| | 85 | Having metal oxide or copper sulfide compound semiconductive component |
| | 87 | Graded composition |
| | 88 | Direct application of electric current |
| | 89 | Fusion or solidification of semiconductor region |
| | 90 | Including storage of electrical charge in substrate |
| | 91 | Avalanche diode |
| | 92 | Schottky barrier junction |
| | 93 | Compound semiconductor |
| | 94 | Heterojunction |
| | 95 | Chalcogen (i.e., oxygen (O), sulfur (S), selenium (Se), tellurium (Te)) containing |
| | 96 | Amorphous semiconductor |
| | 97 | Polycrystalline semiconductor |
| | 98 | Contact formation (i.e., metallization) |
| | 99 | HAVING ORGANIC SEMICONDUCTIVE COMPONENT |
| | 100 | MAKING POINT CONTACT DEVICE |
| | 102 | HAVING SELENIUM OR TELLURIUM ELEMENTAL SEMICONDUCTOR COMPONENT |
| | 104 | HAVING METAL OXIDE OR COPPER SULFIDE COMPOUND SEMICONDUCTOR COMPONENT |
| | 105 | HAVING DIAMOND SEMICONDUCTOR COMPONENT |
| | 106 | PACKAGING (E.G., WITH MOUNTING, ENCAPSULATING, ETC.) OR TREATMENT OF PACKAGED SEMICONDUCTOR |
| | 107 | Assembly of plural semiconductive substrates each possessing electrical device |
| | 110 | Making plural separate devices |
| | 115 | Including contaminant removal or mitigation |
| | 116 | Having light transmissive window |
| | 117 | Incorporating resilient component (e.g., spring, etc.) |
| | 118 | Including adhesive bonding step |
| | 120 | With vibration step |
| | 121 | Metallic housing or support |
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